• 한국정밀공학회지
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• 제20권3호
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• pp.35-41
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• 2003

The multihole blanking of thin sheet metal using progressive die set is an important process on production of precision electronic machine parts such as IC leadframe. In this paper, in order to investigate the influence of blanking order on the final lead profile and deformed configuration, simulation technique for progressive blanking process is proposed and analyzed by LS-DYNA. The results of FE-simulations are in good agreement with the experimental results. Consequently, from the results of FE-analysis based on the procedure proposed in this paper, it is possible to predict the deformation of lead and to manufacture high precision leadframes in progressive blanking process and these results might be used as a guideline to develop layout design system in multihole blanking process.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.414-417
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• 2008

A lid & frame used as the shield of electromagnetic waves in cellular phones are composed of frame, which is welded at their electric circuits, and lid, of which debonding and joining are available from the frame. Typical lid & frame were mechanically bonded by contact between the embossing of lid and the piercing of frame Bonding force of this part have to allow us to detach the lid from frame for exchange or fix of the electric part and have to be high enough to protect the electric part from external impacts. This study is designed to estimate the effect of design variable of lid & frame on its debonding force. Estimations were performed by finite element method.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 추계학술발표강연 및 논문개요집
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• pp.110-110
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• 1999

• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 춘계학술발표강연 및 눈문개요집
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• pp.123-123
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• 1999

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 추계학술대회 논문집
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• pp.71-74
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• 2001

Using the Taguchi method, optimum process condition of lead frame blanking has been determined in the point of view of shape of blanked profile. As the main process parameters, clearance, strip holding pressure and bridge width are selected. According to the orthogonal array table, three levels of experiment have been carried out for each factors. The optimal blanking condition is analyzed with the SN ratio. It has been verified that the optimal process condition can be determined with a combination of basic blanking experiment and experiment design method. Both the effect of each factors and gain can be judged in the quantitative manners from the analysis of SN ratio.

• 마이크로전자및패키징학회지
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• 제7권4호
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• pp.31-35
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• 2000

반도체 칩과 리드프레임을 접착하고 있는 얇은 접착제층에 전단하중이 가해질 때 발생하는 응력상태를 조사하고 있다. 계면 응력상태를 해석하기 위해서 경계요소법이 사용되고 있다. 선형 탄성이론을 적용하여 해석하면, 강체와 접착제의 계면이 자유 경 계면과 만나는 부분에서 $\gamma^{\lambda=1}$(0<1<1) 형태의 응력 특이성이 존재한다. 이러한 특이성으로 인해, 모서리 균열이나 계면 박리가 발생할 수 있다.

• 한국재료학회지
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• 제8권11호
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• pp.982-986
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• 1998

baking 전후의 금선의 접합강도 변화를 연구하였다. 금선을 이용하여 Si 칩의 AI 패드와 은도금된 리드프레임 사이를 thermosonic 방법으로 본딩하였다. 본딩된 금선을 $175^{\circ}C$에서 시간을 변화시키면서 baking 처리하였다. 접합강도는 와이어 풀 테스트, 볼 전단 테스트, stud 풀 테스트로 평가하였다. 와이어 풀 접합강도는 baking 처리를 거쳐도 크게 변화하지 않았지만 파괴 유형이 baking 전에는 볼목 파괴에서 baking 후 스티치 파괴로 바뀌었다. 본딩과 baking 중 금선의 결정립이 크게 성장하였는데 이런 결정립 크기 변화와 금선 접합 부위의 기하학적인 모양에 따라 파괴 유형이 바뀌었다.

• 한국정밀공학회지
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• 제18권2호
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• pp.102-110
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• 2001

In this paper, methods to analyze wire sweep and paddle shift during the semiconductor ship-encapsulation process have been studied. The analysis of wire sweep includes flow-field analysis in a complicated geometry, drag-force calculation for given flow of fluid, and wire-deformation calculation for given loads. The paddle-shift analysis is used to analyze the deformation of the paddle due to the pressure difference in two cavities. the analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The numerical solution is used for more accurate calculation of wire-sweep. The numerical results of wire sweep show good agreements with the experimental ones.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.296-299
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• 2002

The precision blanking of thin sheet metal is important process on production of precision electronic machine parts such as IC leadframe. In the blanking process, the factors that friction coefficient, tool clearance, material properties are the most important factors in the precision blanking process, because these factors affect the sheared face of product, side forces to punch during blanking process and surface condition after blanking process. So, many investigations have been performed. But, the former studies did not take up the characteristic of material. In this paper, in order to investigate the characteristic of blank, such as K(strength coefficient) and n(strain hardening coefficient), on the sheared face of blank and the side force to punch, FE-simulation has been analyzed by means of DEFORM-2D. To obtain input Parameters on FE-simulation, tensile and friction test has been done.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.192-192
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• 2011

본 연구에서는 LED lead frame을 위한 Sn-3.5Ag 솔더의 젖음 특성과 반사율에 관하여 조사하였다. 금속기판과 액체금속간의 젖음성은 wetting balance tester를 이용하여 평가하였으며, 최대인출력, 최대인출시간 등을 측정하고 표면장력을 계산하였다. Sn-3.5Ag 솔더를 $250{\sim}290^{\circ}C$의 온도에서 젖음성을 측정하였는데 온도가 증가함에 따라 젖음성이 향상되는 것을 확인할 수 있었다. 또한 솔더가 도금된 Cu-coupon의 반사율을 측정하였는데 $270^{\circ}C$에서 가장 높은 반사율을 나타냈다.