• Title/Summary/Keyword: 레이저 식각

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Fabrication and studies on the properties of a spinning-disk confocal microscope (회전원판식 공초점 현미경의 구성과 광학특성)

  • 신은성;남기봉
    • Korean Journal of Optics and Photonics
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    • v.8 no.4
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    • pp.255-259
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    • 1997
  • In this paper, the result of a performance study on a home-built spinning disk type confocal microscope is presented. The confocal microscope was fabricated with a Nipkow disk made of the made of the microfilm. The throughput of the disk was 0.5%, allowing the observation of specimen with higher reflectivities only. A laser diode at 692.7nm was used as the light source. The topographic structures of a PC ROM and the CD ROM were observed with sufficient reliability, while the effect of the convolution of the beam size with the finite object size was found dominant. Also the shadowing effect by the etched pattern was observed.

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Heteroepitaxial Growth of ZnO Thin Films by PLD (레이저증착법을 이용한 ZnO 이종에피탁시 박막성장)

  • 박재영;이병택;김상섭;이재목;제정호
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.03a
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    • pp.113-113
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    • 2003
  • ZnO 박막은 p형 도핑방법이 점차 알려 지면서 최근 차세대 발광소자 재료로서 주목을 받고 있으며, 우수한 전자 이동도, 우수한 홀 이동도, 발광 스펙트럼(PL) 피크의 날카로움, 높은 free exciton binding energy, 방사선 노출에 대한 큰 내구성, 습식 식각이 가능, 동종 기판 사용이 가능함으로써 박막의 품질을 개선할 수 있고 제조공정을 간소화할 수 있는 등의 장점을 지니고 있어 이에 관련된 많은 연구들이 진행되고 있다. 특히 ZnO 박막을 차세대 발광소자로 응용하기 위해서는 고품질의 에피탁시 박막을 성장시켜야 하며 이를 위하여 MBE, MOCVD, PLD법 등 다양한 에피탁시 박막증착이 시도되고 있다. 또한 보다 양질의 ZnO 박막을 성장시키기 위해 적절한 단결정 기판 및 버퍼층의 탐색과 각 기판에 따른 ZnO 박막의 물성평가 작업도 진행되고 있다.

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Micro-drilling of Fused Silica by Laser Induced Wet Etching (레이저습식각을 이용한 용융실리카의 미세구멍가공)

  • Baek, Byeong-Seon;Lee, Jong-Kil;Jeon, Byung-Hee
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1344-1348
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    • 2003
  • It is generally known to be difficult to etch a surface of a transparent material such as fused silica by conventional laser ablation in which the surface is simply irradiated with a laser beam. A lot of studies have been done to provide a method capable of efficiently etching transparent materials without defects such as cracks. One of the promising methods or the micro-machining of optically transparent materials is laser induced etching. In this study, micro-drilling of fused silica by laser induced wet etching was conducted. KrF excimer and YAG laser were used as light sources. Acetone solution pyrene and ethanol solution of rhodamine were used as etchant.

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Reaction Mechanism of Photo-Induced Etching of Single-Layer MoS2

  • Choe, Yu-Na;An, Gwang-Hyeon;Ryu, Sun-Min
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.194.1-194.1
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    • 2014
  • 기저면에 구조적 결함을 도입함으로써 그래핀과 $MoS_2$와 같은 이차원 결정의 물리, 화학, 전기 및 기계적 성질을 제어하려는 연구가 폭넓게 수행되고 있다. 본 연구에서는 플라즈마 속의 산소 래디컬을 이용하여 기계적 박리법으로 만들어진 단일층 그래핀과 $MoS_2$ 표면에 구조적 결함을 유도하고 제어하는 방법을 개발하였다. 라만 및 광발광 분광법을 통해 생성된 결함 밀도를 측정하고 전하 밀도 등의 화학적 변화를 추적하였다. 그래핀의 경우 산소 플라즈마 처리 시간에 따라 결함(defect)의 정도를 보여주는 라만 D-봉우리의 높이와 넓이가 커짐을 확인하였고 이를 G-봉우리의 높이와 비교하여 정량하였다. $MoS_2$의 경우 $E{^1}_{2g}$$A_{1g}$-봉우리의 높이가 점점 감소하고 광발광의 세기 또한 감소함을 확인하였다. 또한 본 연구에서는 기판의 편평도가 결함 생성 속도에 미치는 영향을 비교 및 분석하여 반응 메커니즘을 제시하고자 한다.

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Micromachining of Fused Silica by KrF Excimer Laser Induced Wet Etching (KrF 엑시머 레이저를 이용한 용융실리카의 미세 습식 식각가공)

  • 백병선;이종길;전병희;김헌영
    • Transactions of Materials Processing
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    • v.11 no.7
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    • pp.601-607
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    • 2002
  • Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.

Laser-Direct Patterning for Plasma Display Panel (플라즈마 디스플레이 패널을 위한 레이저 직접 패터닝)

  • Ahn, Min-Young;Lee, Kyoung-Cheol;Lee, Hong-Kyu;Lee, Cheon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.99-102
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    • 1999
  • A mixture which was made from organic gel, glass powder and ceramic powder was masklessly etched for fabrication of barrier rib of PDP(Plasma Display Panel) by focused Ar$^{+}$ laser( λ =514 nm) and Nd:YAG(λ =532, 266 nm) laser irradiation at the atmosphere. The depth of the etched grooves increases with increasing a laser fluence and decreasing a scan speed. Using second harmonic of Nd:YAG laser, the threshold laser fluence was 6.5 mJ/$\textrm{cm}^2$ for the sample of PDP barrier rib softened at 12$0^{\circ}C$. The thickness of 130 ${\mu}{\textrm}{m}$ of the sample on the glass was clearly removed without any damage on the glass substrate by fluence of 19.5 J/$\textrm{cm}^2$....

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Laser Direct Etching on Transparent Conductive Oxide Films Sputtered on Polycarbonate Substrates (PC 기판상에 스퍼터링된 투명전도 산화막의 레이저 식각 특성)

  • Lee, Jeongmin;Kwon, Sang Jik;Cho, Eou Sik
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.27 no.3
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    • pp.146-150
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    • 2014
  • As a method of simple patterning of transparent conductive oxide (TCO) films deposited on flexible substrates, laser direct etching was carried out on TCO films sputtered on polycarbonate (PC) substrates. As a result of different binding energies in TCO films, indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) were more easily etched than zinc oxide with different $Nd:YVO_4$ laser beam conditions.

Low Index Contrast Planar SiON Waveguides Deposited by PECVD (PECVD 법에 의해 제작된 저굴절률 차이 평판 SiON광도파로)

  • Kim, Yong-Tak;Yoon, Seok-Gyu;Yoon, Dae-Ho
    • Journal of the Korean Ceramic Society
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    • v.42 no.3 s.274
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    • pp.178-181
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    • 2005
  • Silicon oxynitride (SiON) layers deposited upon a $SiO_2/Si$ buffer layer placed upon silicon wafers have been obtained by using PECVD from $SiH_4,\;N_2O$, and $N_2$. It can be seen that the refractive index, measured by using a prism coupler, for the SiON films can be varied between 1.4480 and 1.4958 at a wavelength of 1552 nm by changing the process parameters. Optical planar waveguides with a thickness of $6{\mu}m$ and a refractive index contrast ($\Delta$n) of $0.36\% have been deposited. Also, etching experiments were performed using ICP dry etching equipment on thick SiON films grown onto Si substrates covered by a thick $SiO_2$ buffer layer. A polarization maintaining single-mode fiber was used for the input and a microscope objective for the output at $1.55{\mu}m$. As a result, a low index contrast SiON based waveguide is fabricated with easily adjustable refractive index of core layer. It illustrates that the output intensity mode is a waveguiding single-mode.

Development of Trimming Technology in High-fine Resistor Using U.V. Laser (자외선 레이저를 이용한 고정밀 저항체 가공기술 개발)

  • Noh, S.S.;Kim, D.H.;Chung, G.S.;Kim, H.P.;Kim, K.H.
    • Journal of Sensor Science and Technology
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    • v.11 no.6
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    • pp.358-364
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    • 2002
  • In this paper, we used U.V.(wavelength, 355nm) laser for adjusting Pt thin films temperature sensor to $100{\Omega}$ at $0^{\circ}C$. Internationally, A-class tolerance of temperature sensor is $0.06{\Omega}$ at $0^{\circ}C$. This is under value of $0.15^{\circ}C$, actually, so high-fine trimming technology is essential to this process. The width of trimmed lines was about $10{\mu}m$ and the best trimming of Pt thin films of $1{\sim}1.5{\mu}m$ was carried out with power : 35mW, rep. rate frequency : 200Hz and bite size : $1.5{\mu}m$. And using photolithography process, 96 resistors were fabricated in $2"{\times}2"$ substrate as the proportion of $79{\sim}90{\Omega}$ and $91{\sim}102{\Omega}$ is 42.7% and 57.3%, respectively. As result of trimming resistors to the target value of $109.73{\Omega}$ at $25^{\circ}C$, 82.3% of resistors had the tolerance within ${\pm}0.30{\Omega}$ and the others(17.7%) were within ${\pm}0.06{\Omega}$ of A-class tolerance.

Fabrication and characterization of 1.55$\mu$m SI-PBH DFB-LD for 10 Gbps optical fiber communications (10 Gb/s 급 광통신용 1.55$\mu$m SI-PBH DFB-LD의 제작 및 특성연구)

  • 김형문;김정수;오대곤;주흥로;박성수;송민규;곽봉신;김홍만;편광의
    • Korean Journal of Optics and Photonics
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    • v.8 no.4
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    • pp.327-332
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    • 1997
  • We fabricated the high speed 1.55${\mu}{\textrm}{m}$ distributed feedback laser diodes (DFB-LD) using both two-step mesa etching process and semi-insulating InP current blocking layers. The devices characteristics were threshold current of ~15mA, slope efficiency of ~0.13mW/mA, and dynamic resistance of ~6.0Ω, with as-cleaved facets. The fabricated DFB-LD showed the single longitudinal mode with more than 40dB up to 6 $I_{th}$(CW condition), emitting at the wavelength of 0.546${\mu}{\textrm}{m}$. The -3dB bandwidth was >10㎓ at the driving current of 27mA, and the maximum -3dB bandwidth was ~18㎓ at 90 mA current, showing the superior frequency response of SI-PBH DFB-LD. In the 10Gb/s transmission experiment for 1.55${\mu}{\textrm}{m}$ DFB-LD module, maximum 10 km of single mode fiber(SMF) or 80 km of dispersion shifted fiber (DSF) could be transmitted with error free.

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