• Journal of the Korean Society for Precision Engineering
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• v.16 no.2 s.95
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• pp.145-152
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• 1999

This paper presents the principle and experimental results of a non-contact surface roughness measurement by means of screen projected pattern of lase beam reflected from a polished surface. In the reflected laser beam pattern especially from a fine surface like ground or polished one, light intensity varies from the center fo the image to its boundary as the Gaussian distribution. The standard deviation of a light intensity distribution is assumed to be a good non-contact estimator for measuring the surface roughnes, because the light reflectivity is known to be well related with the surface roughness. This method doesn't need to discriminate between the specularly reflected light and the diffusely reflected one, whereas the scattered laser intensity method must do. Nor it needs to adjust the change of light intensity caused by environmental lights or specimen materials. Reflected laser beam pattern narrowly spreads out in the vertical direction to tiny scratches on the polished surface due to abrasives. The deeper the scratch the more the dispersion, which means the rougher surface. The standard deviation of the pattern is nearly in proportion to the surface roughness. Measurement errors by this method are shown to be below 10 percent compared with those obtained by a common contact method. The inclination of measuring unit from the normal axis causes the measurement errors up to 10 percent for an angle of 4 degree. Therefore the proposed method can be used as an on-the-machine quick roughness estimator within 10 percent measurement error.

• Korean Journal of Optics and Photonics
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• v.4 no.4
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• pp.420-427
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• 1993

Dielectric thin film mirrors are embedded in multimode and single-mode fibers by a fusion splicing technique. The fibers with $45{\circ}$ angled embedded mirrors serve as ultra-compact directional couplers with low excess optical loss of 0.2 dB for multimode and 0.5 dB for single mode at 1.3 ${\mu}m$ and excellent mechanical properties. The reflectance is wavelength dependent and strongly polarization depencient. Far-field scans of the reflected output power measured with a white-light source show a pattern which is almost circularly symmetric with aspect ratio of 1.09 at 5% of the peak power. The splitting ratio in a multimode coupler measured with a diode laser source is much less dependent on input coupling conditions than in conventional fused biconical-taper couplers, indicating that these couplers are less susceptible to modal noise occuring in optical fiber communication systems. Spectral properties of multilayer internal mirrors normal to the fiber axis have been investigated experimentally, and a matrix analysis has been used to explain the results.

• Korean Journal of Optics and Photonics
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• v.16 no.6
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• pp.553-559
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• 2005

Pulsed terahertz (THz) radiation was generated by optical rectification and detected by a fee space electro-optic sampling (FS-EOS) method. We used ZnTe (110) crystals for both generation and detection. By coating dielectric anti-reflection film on the ZnTe crystal surface, we can reduce the reflectance of a pump laser beam from $30\%$ to $2\%$, and the terahertz pulse amplitude increased $27\%$ compared with an uncoated crystal. A wider bandwidth of THz radiation was obtained by using a thinner crystal but the signal intensity was decreased in this case. And variations of THz radiation by changing orientation of the ZnTe crystal with respect to the pump (or probe) laser polarization, and by changing the power of the pump laser have also been investigated and discussed.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.1
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• pp.117-123
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• 1998

We investigated the effect of mechanical backside damage in Czochralski grown silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductivity decay method, photo-acoustic displacement method, X-ray section topography, and wet oxidation/preferential etching methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the photo-acoustic displacement values increased proportionally, and it was at Grade 1: Grade 2:Grade 3 = 1:19.6:41 that the normalized relative quantization ratio of excess photo-acoustic displacement in damaged wafer was calculated, which are normalized to the excess PAD from sample Grade 1.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.5
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• pp.370-376
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• 2016

Corrosion on the surface of a structure can generate cracks or cause walls to thin. This can lead to fracturing, which can eventually lead to fatalities and property loss. In an effort to prevent this, laser imaging technology has been used over the last ten years to detect thin-plate structure, or relatively thin piping. The most common laser imaging was used to develop a new technology for inspecting and imaging a desired area in order to scan various structures for thin-plate structure and thin piping. However, this method builds images by measuring waves reflected from defects, and subsequently has a considerable time delay of a few milliseconds at each scanning point. In addition, the complexity of the system is high, due to additional required components, such as laser-focusing parts. This paper proposes a laser imaging method with an increased scanning speed, based on excitation and the measurement of standing waves in structures. The wavenumber of standing waves changes at sections with a geometrical discontinuity, such as thickness. Therefore, it is possible to detect defects in a structure by generating standing waves with a single frequency and scanning the waves at each point by with the laser scanning system. The proposed technique is demonstrated on a wall-thinned plate with a linear thickness variation.

• The Journal of Engineering Geology
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• v.12 no.4
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• pp.405-419
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• 2002

Fracture roughness of rock specimens is observed by a new confocal laser scanning microscope (CLSM; Olympus OLS1100). The wave length of laser is 488 nm, and the laser scanning is managed by a light polarization method using two galvano-meter scanner mirrors. The function of laser reflection auto-focusing enables us to measure line data fast and precisely. The system improves resolution in the light axis (namely z) direction because of the confocal optics. Using the CLSM, it is Possible to measure a specimen of the size up to $10{\;}{\times}{\;}10{\;}cm$ which is fixed on a specially designed stage. A sampling is managed in a spacing $2.5{\;}\mu\textrm{m}$ along x and y directions. The highest measurement resolution of z direction is $10{\;}\mu\textrm{m}$, which is more accurate than other methods. Core specimens of coarse and fine grained granite are provided. Fractures are artificially maneuvered by a Brazilian test method. Measurements are performed along three scan lines on each fracture surface. The measured data are represented as 2-D and 3-D digital images showing detailed features of roughness. Line profiles of the coarse granites represent more frequent change of undulation than those of the fine granite. Spectral analyses by the fast Fourier transform (FFT) are performed to characterize the roughness data quantitatively and to identify influential frequency of roughness. The FFT results suggest that a specimen loaded by large and low frequency energy tends to have high values of undulation change and large wave length of fracture roughness.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.2
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• pp.157-161
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• 1999

We investigated the effect of mechanical back side damage in Czochralski silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductance decay ($\mu$-PCD) technique, wet oxidation/preferential etching methods, near surface micro defect (NSMD) analysis, and X-ray section topography. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and NSMD density increased proportionally, also correlated to the oxidation induced stacking fault (OISF) density. Thus, NSMD technique can be used separately from conventional etching method in OISF measurement.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.4
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• pp.581-586
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• 1998

We investigated the effect of mechanical back side damage in Czochralski grown silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductivity decay method, degree of X-ray diffuse scattering, X-ray section topography, and wet oxidation/preferential etching methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the magnitude of diffuse scattering and X-ray excess intensity increased proportionally, and it was at Grade 1:Grade 2:Grade 3=1:7:18.4 that the normalized relative quantization ratio of excess intensity in damaged wafer was calculated, which are normalized to the excess intensity from sample Grade 1.

• Journal of Digital Contents Society
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• v.18 no.1
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• pp.123-132
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• 2017

The physical display technology is the ultimate display technology that human beings aspire, and the world makes use of laser, plasma and reflector plate. Besides, technology development of binocular stereoscopic display has been actively progressed, but there is a limitation to the intact physical representation such as influence of optical ambient light and brightness. In this paper, the display technology using physical deformation different from the existing optical display is approached as a cultural and emotional perspective. The purpose of this paper is to develop the multivariate display technology that can create 3D realistic stereoscopic images through projecting dynamic images on physically diversified screen by overcoming the limitations of 2D planar digital signage and study how to apply them to video, exhibition and performance.

• Transactions of the Korean Society of Mechanical Engineers
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• v.12 no.3
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• pp.440-449
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• 1988

Small vibration displacements may be measured by optical interferometers, based on the Michelson method. The standard Michelson interferometer works well when the mirror displacements are relatively large compared to the optical wavelength. But it does not work for displacements less than approximately a quater of optical wavelength. Several multiple reflection laser interferometers, simply modified standard Michelson interferometer, have been developed to decrease the minimum detectable limits. Among these a relatively simple and easy multiple reflection system is used to measure the small vibration displacements. This multiple reflection system is constructed with a right angle prism and a convex lens. Therefore this system makes it possible to measure a vibration displacement of the small area on the vibrating structure. The fringe interpolation method and curve fitting method are used to determine accurately the small vibration displacements from the measured interference fringe patterns. Also computer simulation technique is used to check the accuracies of these method. According to the results of the computer simulation technique, the curve fitting method is more accurate than the fringe interpolation method. The optically measured results are in good agreement with those of the standard accelerometer with high accuracy and it is possible to measure the peak vibration displacement as small as 9.01nm using multiple reflection system and curve fitting method.