• The Journal of the Korea institute of electronic communication sciences
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• v.14 no.5
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• pp.927-934
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• 2019

Recently, mobile devices have evolved into small computers with various functions according to user requirements. Careful attention must be paid to the design of the power supply network for the stable operation of the application processor (AP), the wireless communication modem, the high performance camera, and the various interfaces of the mobile device to implement various functions of the mobile device. In this paper, we analyzed and verified the method of optimizing the design parameters such as the position, capacity, and number of decoupling capacitors to meet the target impedance required by the driver IC chip to ensure the stability of the power supply network of mobile devices that should be designed as wiring type due to mounting density limitation. The proposed wired power supply network design method can be applied to various applications including high-speed signal transmission line in addition to mobile applications.

• Journal of IKEEE
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• v.25 no.4
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• pp.591-597
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• 2021

This paper proposes an EMC-aware PCB design method to reduce electromagnetic emission, where trace length and teturn path of critical signal are shortened by changing chip location and trace layout on the PCB, while additional filters or decoupling capacitors are not required. In the proposed method, signal velocity is calculated for various signals on the PCB. Critical signal with the fastest signal velocity is determined and its return path is shortened as much as possible by placing chip location and trace routing first. Return path of critical signal should be carefully designed not to have discontinuity. Power plane and ground plane should be carefully designed not to be divided, since these planes are the reference of return path. The proposed method was applied to automotive directional Bluetooth speaker which failed to pass CISPR 32 and CISPR 25 EMC tests. Its PCB was redesigned based on the proposed method and it easily passed the EMC tests. The proposed method is useful to EMC-sensitive electronic equipments.