• Journal of the Korean Ceramic Society
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• v.36 no.5
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• pp.490-496
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• 1999

The sintering behavior of LTCC (low temperature cofired ceramics) chip couplers was investigated in relation with Ag diffusion at the interface of glass ceramic substrate-Ag electrode. Sintering temperature was in the range of 825$^{\circ}C$-975$^{\circ}C$. The commercial green sheet and silver electrode were used. Below 875$^{\circ}C$ the diffusion of the Ag ion into the substrate and the penetration of glassy phases into the electrode occurred due to an increase of fluidity. Thus the lectrode line was severely deformed and damaged. At 975$^{\circ}C$ the transformation of crystalline phases into glassy phases and the melting of the Ag electrode resulted in the diffusion of the considerable amount of Ag ions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.344-348
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• 2002

As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.29-33
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• 2003

최근 이동 정보통신 분야의 발전에 따라 단말기 및 관련 부품들을 소형 경량화 하는 것이 매우 중요한 기술요소로 부각되고 있다. 이를 위해서는 기판의 배선밀도를 높이는 것과 개별 부품 또는 모듈의 크기와 무게를 줄이는 것이 절실히 필요하며, 이러한 요구에 부응하기 위해 기존의 다층 PCB 기술이나 MCM 기술에 비해 우수한 배선밀도와 양호한 전기적 특성을 갖는 저온 동시소성 세라믹(Low Temperature Co-fired Ceramic) 기술이 개발, 적용되고 있다. 본 논문에서는 이러한 LTCC 기판의 소결에 있어 기존의 소결 공정인 전기로 소결 공정과 microwave를 이용한 소결 공정을 이용하여 소결 하였을 때, LTCC 기판의 수축율과 무게감소, 그에 따른 밀도변화, SEM 을 이용한 표면형상 분석을 통해 급속가열을 통한 공정시간의 단축, 낮은 에너지 소비로 인한 제조단가의 절감, 균일한 가열로 인한 소결온도의 저하 등의 장점을 갖는 microwave sintering 을 적용할 수 있는 가능성을 제시하였다.

• Journal of Korean Society of Steel Construction
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• v.16 no.2 s.69
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• pp.181-190
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• 2004

A new inelastic design method performing iterative calculations using secant stiffness was developed. Since the proposed design method uses linear analysis, it is convenient and stable in numerical analysis. At the same time, the proposed design method can accurately estimate the inelastic strength and ductility demands of the members by performing iterative calculation. In the present study, the procedure of the proposed design method was established. Design examples using the proposed method were presented, and its advantages were highlighted by comparisons with existing design methods using elastic or plastic analysis. Unlike the existing inelastic design methods performing the preliminary design on the structure and checking its validity using nonlinear analysis, the proposed integrated analysis-design method can directly calculate the strength and ductility demands of each member. In addition, the proposed design method can address the inelastic design strategy intended by the engineer, such as strength and ductility limits of members and the design concept of strong-column and weak-beam. As a result, economical and safe design can be achieved.

• Composites Research
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• v.18 no.1
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• pp.1-9
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• 2005

A methodology is presented for the failure prediction of composite single-lap bonded joints considering both of composite adherend failure and bondline failure. An elastic-perfectly plastic model of adhesive and a delamination failure criterion are used in the methodology. The failure predictions have been performed using finite element method and the proposed methodology. The failure prediction results such as failure mode and strength have very good agreements with the test results of joint specimens with various bonding methods and parameters. The influence of variations in the effective strength (that is, adhesion performance) and plastic behavior of adhesive on the failure characteristics of composite bonded Joints are investigated numerically. The numerical results show that optimal joint strength is archived when adhesive and delamination failure occur in the same time.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.1-5
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• 2000

Co-fired resistors for high frequency MCM-C (Multi Chip Module-Cofired) were fabricated and measured their RF properties from DC to 6 GHz. LTCC (Low Temperature Co-fired Ceramics) substrates with 8 layers were used as the substrates. Resisters and electrodes were printed on the 7th layer and connected to the top layer by via holes. Deviation from DC resistance of the resistors was resulted from the resister pastes, resistor size, and via length. From the experimental results, the suitable equivalent circuit model was adopted with resistor, transmission line, capacitor, and inductor. The characteristic impedance $Z_{o}$ of the transmission line from the equivalent circuit can explain the RF behavior of the buried resistor according to the structural variation.

• Clean Technology
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• v.21 no.3
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• pp.184-190
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• 2015

Most of LNT catalysts use noble metals such as Pt for low temperature NO_x oxidation but there is an economic weakness. For the purpose of overcoming this, this study is to develop DeNO_x catalyst for LNT excluding PGM (platinum group metal) such as Pt, Pd, Rh, etc. To do so, Al/Co/Ni catalyst selected as a preliminary test is used to study fundamental property and NO_x’s conversion according to calcined temperature. Ultimately, that is, Al/Co/Ni mixed metal oxide which does not use PGM is selected and physicochemical characterization is performed by way of XRD, EDS, SEM, BET and ramp test and NO_x conversion is also analyzed. This study shows that all samples consist of mixed oxides of spinel structure of Co₂AlO₄ and NiAl₂O₄ and have enough pore volume and size for redox. But as a result of NH₃-TPD test, it is desired that calcined temperature needs to be maintained at 700 ℃ or lower. Also only samples which are processed under 500 ℃ satisfied NO and NO_x conversion simultaneously through ramp test. Based on this study’s results, optimum calcined temperature for Al/Co/Ni=1.0/2.5/0.3 mixed metal oxide catalyst is 500 ℃.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.584-591
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• 2017

Metal removal from water has not been explained clearly by either adsorption onto the surface of absorbents or precipitation as metal hydroxides because those occur simultaneously to a certain extent. For a better understanding of the metal removal mechanisms, batch experiments were performed using soil calcined at $850^{\circ}C$ under various pH conditions for Cu, Pb, Zn, Cd, and Cr. The results showed that the metal removal efficiency with the exception of Cr decreased abruptly, even within 5 min, showing more than 90% removal. The pH of each reactant increased gradually from around 7 to 9 with time. The increases in metal removal at higher pH appear to be associated with metal hydroxides precipitation. Comparative experiments, which were carried out changing the pH by reacting with commercial activated carbon (CAC), natural yellow soil (NYS), and calcined yellow soil (CYS), showed that the pH of the CYS only increased with time. Calcination processes might lead to a change in the physical properties of the soil matrix resulting in a high pH when reacted with water. Apart from adsorption onto the surface of the absorbents, these results show that the adsorption and/or precipitation of hydroxides onto the surface of adsorbents also play important roles in regulating the dissolved metals under alkaline conditions.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.11-18
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• 2021

A novel microwave dielectric composite material for ultra-low temperature co-fired ceramics (ULTCC) with (1-x)BaWO₄-xBaV₂O₆ (x=0.54~0.85) composition was prepared by firing a mixture of BaWO₄ and BaV₂O₆. Shrinkage tests showed that the ceramic composite begins to densify at a temperature as low as 550℃ and can be sintered at 650℃ with 98% of relative density under the influence of BaV₂O₆. X-ray diffraction analysis showed that BaWO₄ and BaV₂O₆ coexisted and no secondary phase was detected in the sintered bodies, implying good chemical compatibility between the two phases. Near-zero temperature coefficients of the resonant frequency (𝛕_f) could be achieved by controlling the relative content of the two phases, due to their positive and negative 𝛕_f values, respectively. With increasing BaV₂O₆ (x from 0.53 to 0.85), the 𝛕_f value of the composites increased from -7.54 to 14.49 ppm/℃, ε_r increased from 10.08 to 11.17 and the quality factor (Q×f value) decreased from 47,661 to 37,131 GHz. The best microwave dielectric properties were obtained for x=0.6 samples with ε_r=10.4, Q×f=44,090 GHz, and 𝛕_f=-2.38 ppm/℃. Chemical compatibility experiments showed the developed composites are compatible with aluminum electrode during co-firing process.