• Journal of Korean Society of Environmental Engineers
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• v.29 no.9
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• pp.1013-1019
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• 2007

Electronic wastes have increased tremendously. However, any reliable treatment methodologies have rarely been established. Electronic wastes have posed serious disposal problem due to their physico-chemical stability. This paper investigated the application possibility of pyrolysis for the purpose of recycling the p-CCL(phenol based Copper Clad Laminate). Thermogravimetric analysis(TGA) was used to investigate the thermal decomposition pattern of p-CCL. We elucidated the characteristics of pyrolysis by-products at operating temperatures of 280, 350 and $600^{\circ}C$. GC/MS and FT-IR were used to characterize the liquid by-products along with general characterization methods such as Ultimate Analysis, Proximate Analysis and Heating Value, whereas general characterization methods were only introduced for the solid by-products. At a heating rate of $5^{\circ}C$/min, TGA curves exhibited three decomposition stages: (1) low-temperature decomposition region$(<280^{\circ}C)$, (2) medium temperature region$(280\sim350^{\circ}C)$ and (3) high-temperature region$(>350^{\circ}C)$. The major compounds of liquid by-products at low- and medium-temperatures were accounted for by water and phenol, whereas branched phenols and furans were major compounds at high-temperatures. As the temperature increases, volatile quantities decreased but the fixed carbon increased. High heating values of solid by-products($7,400\sim7,600$ kcal/kg) would suggest that the solid by-products could be applicable as fuel. In addition, high fixed carbon but low ash content of the solid by-products offered an implication that they are capable of being upgradable for adsorbent after applying appropriate activating process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.275-276
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• 2015

기존의 상용화된 Ni-Cr tie-coating 물질은 내열성 시험 후 강도가 저하되고, Cr 성분이 patterning후에 완벽하게 제거 되지 않아서 누설 전류를 만드는 단점을 갖고 있다. 따라서 이 연구에서는 기존의 Ni-Cr 과 삼원계 Ni-Cr-X(X는 Nb, V, Mo, Ti) 물질의 패터닝성과 내열성을 비교하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.5
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• pp.421-426
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• 2017

In this study, we propose a method for predicting the mechanical properties of the printed circuit board (PCB) that has transversely isotropic characteristics. Unlike the isotropic material, there is no specific test standard for acquisition of the transversely isotropic properties. In addition, common material test methods are not readily applicable to that type of laminated thin plate. Utilizing the natural frequency obtained by a modal test and the sizing optimization technique provided in $OptiStruct^{(R)}$, the mechanical properties of a PCB were derived to minimize the difference between test and analysis results. In addition, the validity of the predicted mechanical properties was confirmed by the MAC (Modal Assurance Criteria) value of each of the compared mode shapes. This proposed approach is expected to be extended to the structural analysis for the design verification of the top product that includes a PCB.

• Polymer(Korea)
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• v.33 no.6
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• pp.525-529
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• 2009

In order to manufacture 2-layer flexible copper clad laminate (FCCL) s having the excellent performance high adhesion properties between copper foil and polyimide film are required. Silane coupling agents with specific functional groups as an adhesion promoter are generally used to enhance the adhesion. In our study, we synthesized a novel silane coupling agent for increasing the adhesive property between copper layer and polyimide layer. The surface morphology of rolled copper foil, as a function of the concentrations of the coated silane coupling agent, was fully characterized. As fabricated 2-layer FCCL, we observed that adhesive properties were changed by the surface morphology and we confirmed that the novel silane coupling agent affects adhesive properties in FCCL with two types of poly (amic acid)s.