• 한국소음진동공학회논문집
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• 제25권3호
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• pp.176-183
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• 2015

This research proposes a method to estimate the fatigue life of SSD(solid-state drive) due to the effect of dummy solder ball under forced vibration. A finite element model of the SSD was developed to simulate the forced vibration and a modal testing was performed to verify the developed finite element model. Fatigue life of the SSD under vibration was experimentally determined according to JEDEC standard in which the SSD was excited by a sinusoidal sweep vibration within the narrow frequency band around the first natural frequency until the SSD fails. Basquin's equation was introduced to estimate the fatigue life of the SSD due to the effect of dummy solder balls. It shows that the dummy solder balls are effective elements of the SSD to increase the fatigue life of an SSD by increasing 700 times of the fatigue life of the given SSD.

• 한국통신학회논문지
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• 제35권4A호
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• pp.408-416
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• 2010

플립 칩(Flip-Chip) 본딩을 적용하는 광 송신용 모듈에서 구동 IC(Driver IC)와 VCSEL(Vertical Cavity Surface Emitting Laser) 사이의 전송선에서 반사특성을 개선시키기 위한 덤벨 형태의 CPW 전송선 구조를 제안하였다. 제안된 구조는 반사특성을 개선시키기 위하여 기판 측면의 플립 칩 본딩 구조에 그라운드 더미 솔더 볼을 이용하여 CPW 전송선 구조를 유지하였고, 덤벨 형태의 CPW 전송선으로 설계하여 반사특성을 개선시켰다. 시뮬레이션 결과, 덤벨형태의 CPW 전송선의 반사 특성이 일반적인 CPW 전송선보다 13 dB 정도 우수한 것으로 나타났으며, CPW 전송선의 형태를 유지시키는 더미 그라운드 솔더 볼이 있을 때 4 dB 정도 반사특성이 개선되었다. 구동 IC 와 VCSEL의 임피던스 변화에 기인하는 전송선의 입출력 임피던스의 변화에 따른 반사특성의 변화율은 ${\pm}2.5\;dB$ 정도로 나타났다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2014년도 추계학술대회 논문집
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• pp.978-983
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• 2014

This research proposes a method to estimate the fatigue life of solid-state drive(SSD) due to the effect of dummy solder ball under forced vibration. Mechanical jig is developed to describe the SSD in laptop computer. The jig with SSD is mounted on a shaker, and excited by a sinusoidal sweep vibration within the narrow frequency band around the first resonant frequency until the SSD fails. A finite element model of SSD is also developed to simulate the forced vibration. It shows that the solder joints at the corners of controller package are most vulnerable components and that placing dummy solder balls at those area is effective method to increase fatigue life of SSD.