• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2004.05a
• /
• pp.687-687
• /
• 2004

예술의 전당 하부를 통과하는 우면산터널은 예술의 전당 자료관, 오페라하우스, 음악당, 서예관, 미술관 등의 건물과 인접하여 설계되었다. 이들 건물은 진동의 전달경로에 따라 구조-구조의 전달경로인 자료관과 구조-지반-구조의 전달경로인 오페라하우스, 음악당, 서예관으로 분류할 수 있다. 자료관은 하부의 기조 중 일부가 우면산 터널의 통과를 위해 설치한 박스(box) 터널 상부와 구조계를 형성하고 있고, 오페라하우스와 음악당 및 서예관 주변으로는 우면산 터널의 상행선과 하행선이 각각 인접하여 통과하는 구조계를 형성하고 있다. 본 연구는 서울시 서초구 서초동～우면동에 이르는 우면산 터널에 실험 차량이 통과할 때 차량 통행으로 인해 발생하는 진동이 예술의전당 자료관, 오페라하우스, 음악당, 서예관 등의 건축구조물에 전달되는 고체전파음의 발생특성 파악하고, 예술의전당 통과구간에 방진패드에 의한 도로포장 공사 후 그에 대한 효과를 비교하였다. 또한, 우면산 터널 예술의 전당 통과구간에 대하여 다공성 아스팔트로 도로포장한 후 그에 대한 효과도 파악하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.05a
• /
• pp.239-239
• /
• 2004

화학적 기계연마 공정(CMP)은 반도체 웨이퍼를 수 천$\AA$m/min의 MRR로 2$\mu\textrm{m}$ 이내의 W(Total Thickness Variable) 조건을 만족시키는 초정밀 광역 평탄화 기술이다. 일반적인 CMP 방법은 서로 다른 회전 중심을 갖고 동일한 방향으로 회전하는 웨이퍼와 다공성 패드 사이에 연마액인 슬러리를 넣어 연마하는 것이다. CMP 공정기술은 1990년 대 중반에 개발되었으나, 아직까지 연마 메커니즘이 완벽하게 밝혀지지 않았다. 따라서 장비를 최적화하기 위해 실험에 의존적일 수밖에 없으나, 이러한 방법은 막대한 자금과 노력뿐만 아니라 상당한 시간을 필요로 하기 때문에, 앞으로 가속될 연마대상 재료의 변화 및 다양한 속도에 발맞출 수 없다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.231-236
• /
• 2004

The area of flat glass panel displays such as LCD (Liquid crystal display) and PDP (Plasma display panel) has been increased more than 2 $\times$ 2 m$^2$ for productivity improvement. However, such a large panel area incurs large panel deflection during panel transfer using robots or AGV (Automated guided vehicle) systems. Therefore, electronic industries are making an effort to find an alternative transfer system for the large glass panels with small deflection. The air conveyor with porous pads is one plausible solution, but it becomes expensive because the large porous pads cost much and air consumption increases as the panel area increases. In this work, a simple air slit levitating conveyor was devised to lower the equipment cost and to reduce the air consumption of system. The air flow model between the LCD glass panel and conveyor was constructed and its validity was verified by experiments. To minimize the air consumption, the conveyor dimensions were optimized, and the air consumptions between the air conveyors with the air slit and that with the porous pad were compared.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.22 no.6
• /
• pp.913-920
• /
• 2013

This paper presents an applicable basic design that can configure non-contact levitation table for conveying a large sheet of glass. The suggested air levitation table consists of a series of air chambers with porous pads and fans as the conveyor system. The air supply chambers are arrayed to supply an adequately strong upward airflow for supporting the glass. Levitation is controlled by the size and discharge velocity, of the chamber arrays, as well as the glass supporting height. After pre-evaluation of the glass rigidity and the filer functional performance, a one-way fluid structure interface (FSI) analysis is performed for predicting pressure and deflection working of the 8G glass in the transverse and longitudinal directions, respectively. After comparing calculated levels of flatness of the glass, it determines the chamber array for the linear non-contact conveying motion.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.5
• /
• pp.385-389
• /
• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.