• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.1 no.2
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• pp.117-127
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• 1991

The exposure level of chromium and nickel for chrome and nickel plating workers were evaluated. Chromium and nickel concentrations in serum from 82 exposed workers and 66 controls, who were not exposed occupationally to metals, were analyzed by flameless atomic absorption spectrophotometry. The results were as follows : 1. The recovery percent of chromium and nickel concentrations in personal air samples were 95-108.2%, 88.0-107.7%, precisions (C.V., %) were 2.7-3.1%, 2.1-4.4%. respectively. 2. The recovery percent of chromium and nickel concentrations in serum were 93.6-106.4%, 91.3-107.9% and precisions (C.V. %) were 1.1-7.6%, 2.4-5.4% respectively. 3. The exposure level of chromium and nickel concentrations in the place of preparation process were $2.0{\pm}2.00{\mu}g/m^3$, chromplating were $35.7{\pm}53.07{\mu}g/m^3$, $2.8{\pm}3.42{\mu}g/m^3$, nickelplating were $4.6.0{\pm}5.8{\mu}g/m^3$, $18.62{\pm}4.41{\mu}g/m^3$, and covering were $2.9{\pm}2.02{\mu}g/m^3$, $1.1{\pm}0.47{\mu}g/m^3$ respectively. There were significant difference of concentrations for chromium and nickel in workplaces by groups statistically. 4. Chromium concentrations in serum of exposed group and control were $0.68{\pm}0.399{\mu}g/l$, $1.41{\pm}0.748{\mu}g/l$, respectively. There were significant difference of concentrations for chromium and nickel in serum by groups statistically. 5. Chromium and nickel concentrations in serum of exposed group were not significant by workplaces.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.18-27
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• 2007

Laser welding process is widely used in the industrial field due to its numerous advantages: a small heat affected zone(HAZ), deep penetration, high welding speed, ease of automation, single-pass thick section capability, enhanced design flexibility, and small distortion after welding. The objective of this research works is to investigate the influence of the process parameters, such as the welding fur metals with CW Nd:YAG lasers. The bead-on-plate and Lap welding experiments are carried out for several combinations of the experimental conditions. In order to quantitatively examine the characteristics of the welding quality of the cross section, tensile stress behavior and the hardness of the welded part are investigated in comparison of the Nickel coated and Nickel uncoated S45C steel. As a result of experiment, nickel coated S45C Steel showed more even weld zone than Nickel uncoated counterpart upon lap welding. Also, it showed relatively small amount of internal defects and spatter, and Nickel coated S45C showed better weldability than Nickel uncoated S45C steel. The optimum welding process upon lap welding of Nickel coated S45C steel is when each laser power is 1900W; focal positions is -1mm; welding speed is $0.9{\sim}1.0m/min$. The heat input was $4.178{\sim}4.36{\times}103J/cm^2$.

• Journal of the Korean institute of surface engineering
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• v.4 no.1
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• pp.5-15
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• 1971

"Rapid Determination of Boric Acid in Nickel Plating Solution" by the addition of Na$_2$C$_2$O$_4$ and thus preventing the precipitation of i(OH)$_2$ during titiration , has previously been reported. In this paper, the exact amount of glycerine and the complexing possibility of oxalate with nickel has been determined by measn of conductivity titrations. This experimental work has been supported by the mathematical application of the Debye-Huckel and mass action equitions as well as statistical analysis. The results were ; (1) Fro determining boric acid in nickel plating solution, 20 ml of 400ml/ι glycerine was sufficient, since 97% of the H$_3$BO$_3$ was dissoicated by this addition. (2) In the absence of Na$_2$C$_2$O$_4$ the continious precipitation of Ni(OH)$_2$ during titration with NaOH even past end -point for boric acid determination resulted in considerable anlaytical error. (3) In the presence of Na$_2$C$_2$O$_4$ during titration , Ni++ combined with C$_2$O$_4$-to form NiC$_2$O$_4$. The solution with this precititate of very fine, colloidal , trantsparent particles, remained quite clear for approximately 2 hours. Therefore it was shown that the presence of Na$_2$C$_2$O$_4$ prevents the formation of gross Ni(OH)$_2$ precititation by forming NiC$_2$O$_4$ instead of a complex salt with Ni++ , which did not interfere with the visible determination of the end point for boric acid with NaOH titation. This observous may be interpreted in the light of the previously published solubility ratio for NiC$_2$O$_4$ and Ni(OH)$_2$, 0.3mg/100g H$_2$O(25$^{\circ}C$), respectively. Precipitation of the less soluble , albeit transparent salt, NiC$_2$O$_4$ precluded therefore the precipitation of the Ni(OH)$_2$ salt.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.30 no.6
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• pp.1-6
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode is formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer from the engine. Combustor size was determined to be 1mn scale. Piston in cylinder moves by fuel injection and reaction. In firing test, adequate engine operation including ignition, flame propagation and piston motion was observed. Present study warrants further application research on MEMS scale internal combustion power units.

• Journal of the Korean institute of surface engineering
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• v.40 no.3
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• pp.125-130
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• 2007

Many fundamental studies have been carried out regarding waste water and hazardous gas treatment technology using the photolysis effect of $TiO_2$. However, photolysis of both organic and organic-inorganic binders immobilizing $TiO_2$ makes permanent use impossible. In this study we manufactured a catalytic electrode by nickel-$TiO_2$ composite plating in order to immobilize $TiO_2$. The surface properties according to the current density changes of cathode and concentration changes of $TiO_2$ powder in nickel plating bath has been analysed with EDX, XRF, SEM, Raman spectrometer etc. The characterization of the catalytic electrode in decomposition of organic compound has been obtained by using UV-Visible spectrophotometer through analysing concentration changes of methyl orange solution containing the catalytic electrode vs. time with projecting UV-light in the solution. The study shows that a catalytic electrode of nickel-$TiO_2$ composite plating with high-efficiency in decompostion of organic compound has been formed under high concentration of $TiO_2$ powder and low current density of cathode.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.6
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• pp.367-374
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• 2000

This paper presents a method to fabricate freestanding structures by (100) silicon anisotropic etching and nickel electroless plating. The electroless plating process is simpler than the electroplating, and provides good coating uniformity and improved mechanical properties. Furthermore, the (100) silicon anisotropic etching in KOH solution with being aligned to <100> direction provides vertical (100) sidewalls on etched (100) surface. In this paper, the effects of the nickel electroless plating condition on the properties of electroless plated metal structures are investigated to apply fabrication of micro structures and then various micro structures are fabricated by nickel electroless plating. And then, the structures are released by silicon anisotropic etching in KOH solution with a large gap between the structure and the substrate. The fabricated cantilever structures are $210\mum$. wide, $5\mum$. thick and $15\mum$. over the silicon substrate, and the comb structure has the comb electrodes which are $4\mum$. wide and $4.3\mum$. thick separated by$1\mum$. It is released by silicon anisotropic etching in KOH solution. The gap between the structure and the substrate is $2.5\mum$.

• Journal of the Korean institute of surface engineering
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• v.43 no.2
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• pp.105-110
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• 2010

Electroless nickel plating on porous carbon substrate for the application of MCFC electrodes was investigated. Acidic and alkaline bath were used for the electroless nickel plating. The pore sizes of carbon substrates were 16-20 ${\mu}m$ and over 20 ${\mu}m$. The carbon surface was changed from hydrophobic to hydrophilic after immersing the substrate in an ammonia solution for 40 min at $60^{\circ}C$. The contact angle of water was decreased from $85^{\circ}C$ to less than $20^{\circ}$ after ammonia pretreatment. The deposition rate in the alkaline bath was higher than that in the acidic bath. The deposition rate was increased with increasing pH in both acidic and alkaline bath. The content of phosphorous in nickel deposit was decreased with increasing pH in both acidic and alkaline bath. The contents of phosphorous is low in alkaline bath. The minimum concentration of $PdCl_2$ for the electroless nickel plating was 10 ppm in alkaline bath and 5 ppm in acidic bath. The thickness of nickel was not affected by the concentration of $PdCl_2$.

• Journal of Practical Engineering Education
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• v.6 no.2
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• pp.105-110
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• 2014

In this work, mechanical characteristics of titanium diaphragm have been studied as a potential robust substrate and a diaphragm material for automotive tire pressure sensor. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on titanium diaphragm have been designed, fabricated and characterized. The fabrication process for micromachined titanium devices keeps the membrane and substrate being at the environment of 20 MPa pressure and $200^{\circ}C$ for a half hour and then subsequently cooled to $24^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated titanium film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the fabricated device is $9.45ppm\;kPa^{-1}$ with a net capacitance change of 0.18 pF over a range 0-210 kPa.

• Journal of the Korean institute of surface engineering
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• v.44 no.3
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• pp.117-123
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• 2011

We investigated the spectroscopic and electrochemical properties of the citrate-based CuNi solution at different solution pH and analyzed various surface properties of CuNi codeposition layer. By combining UV-Visible spectroscopic data with potentiodynamic polarization curves, it could be found that the complexation of $Ni^{2+}$-citrate pair was completed at lower solution pH than $Cu^{2+}$-citrate pair and was affected by the coexistent $Cu^{2+}$ ions, while the complexation between $Cu^{2+}$ ions and citrate was not sensitive to the presence of $Ni^{2+}$ ions. Also, the electron transfer from cathode to $Cu^{2+}$-citrate and$Ni^{2+}$-citrate was hindered by strong complexation between $Cu^{2+}/Ni^{2+}$ ions and citrate and so apparent codeposition current densities were reduced as the solution pH increases. CuNi codeposited layers had a higher Cu content when they were prepared at high pH solution due to the suppression of Ni deposition, and when codeposition was executed in an agitated condition due to the acceleration of mass transfer of $Cu^{2+}$ ions in the solution. Actually, solution pH had little effect on the surface morphology and deposits orientation, but greatly influenced the corrosion resistance in 3.5% NaCl solution by modifying the chemical composition of CuNi layers and so pH 3 was expected as the most suitable solution pH in the viewpoint of corrosion coatings.