• Title/Summary/Keyword: 니켈박막

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Development of Oxo-biodegradable Bio Film by Using Biodegradable Catalyst (생분해 촉매제를 이용한 산화생분해 바이오 필름 개발)

  • Rhee, Jin-Kyu;Jung, Dong Seok;You, Young-Sun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.22 no.3
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    • pp.127-134
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    • 2016
  • In this study, Biodegradable masterbatch (M/B) was prepared by different kinds and content of biodegradable catalysts added to oxo biodegradable plastics. The bio film was prepared by adding biodegradable M/B to the polyethylene pellet, and the change of physical properties by UV and heat treatment and the stability as food packaging material were confirmed. As a result of the physical property change, Fe salt and Al salt bio film was superior to Ni salt bio film about a decrease in physical property. However, considering the raw material cost and industrial availability, M/B containing Fe salt was selected and additional experiments were conducted by concentration. The bio films prepared with Fe salt M/B 1.0, 1.5 and 2.0 wt% showed excellent physical properties.

Improvement of Transglycosylation Efficiency using a Glycosynthase Mutant derived from Thermoplasma acidophilum ${\alpha}$-Glucosidase (Thermoplasma acidophilum 유래 ${\alpha}$-glucosidase로 부터 생산된 glycosynthase 돌연변이 단백질의 개선된 당전이 효율)

  • Hwang, Sung-Min;Seo, Seong-Hwa;Park, In-Myoung;Choi, Kyoung-Hwa;Kim, Do-Man;Cha, Jae-Ho
    • Microbiology and Biotechnology Letters
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    • v.40 no.2
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    • pp.104-110
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    • 2012
  • Glycosynthase is an active site nucleophile mutant enzyme, prepared from glycosidase, which is capable of synthesizing oligosaccharide derivatives without the hydrolysis of the product. Thermoacidophilic ${\alpha}$-glucosidase of Thermoplasma acidophilum (AglA) exhibits a transglycosylating activity yielding various glycosides. AglA was converted to glycosynthase by the substitution of the catalytic nucleophile Asp-408 residue into non-nucleophile glycine in order to increase its ability to synthesize various glycosides by transglycosylation. The glycosynthase mutant was purified by Ni-NTA chromatography and its glycoside-synthesizing activity was measured by using an external nucleophile, sodium formate buffer, providing maltose as a donor and p-nitrophenyl-${\alpha}$-D-glucopyranoside ($pNP{\alpha}G$) as an acceptor, respectively. In addition, $pNP{\alpha}G$ was examined for its feasibility to act as both a donor and an acceptor, and products were compared with those of the wildtype enzyme. The mutant enzyme was found to catalyze the formation of a specific product from $pNP{\alpha}G$ with a yield of 42.5% without further hydrolysis, while the wild-type enzyme produced two $pNP{\alpha}G$ products at low yields. The results demonstrate the possibility of satisfactory yields for the reactions in the presence of small amounts of acceptor, and demonstrate that the high activity of the mutant, at pHs below neutrality, was applicable in the transfer of glucose from the natural donor.

그래핀-탄소나노튜브 복합체로 제작한 유연성 투명 전도막의 반복 변형에 대한 내구성 향상

  • Lee, Byeong-Ju;Jeong, Gu-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.202-202
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    • 2012
  • 유연성 투명 전도막은 현대 전자산업의 발전에 있어 필수적인 부품소재로서, 가시광선의 투과율이 80% 이상이고 면저항이 $100{\Omega}/sq.$ 전후이며 휘거나 접히고 나아가 두루마리의 형태로도 응용이 가능한 소재를 일컫는다. 이러한 유연성 투명 전도막은 차세대 정보디스플레이 산업 및 유비쿼터스 사회의 중심이 되는 유연성 디스플레이, 터치패널, 발광다이오드, 태양전지 등 매우 다양한 분야에 응용이 기대된다. 이러한 이유로 고 신뢰성 유연성 투명 전도막 개발기술은 차세대 산업에 있어서의 핵심기술로 인식되고 있다. 현재로서는 인듐 주석 산화물(indium tin oxide; ITO) 및 전도성 유기고분자를 사용하여 투명 전도막을 제조하고 있으나, ITO 박막의 경우 인듐 자원의 고갈로 인한 가격상승 및 기판과의 낮은 접착력, 열팽창계수의 차이로 인한 공정상의 문제, 산화물 특유의 취성으로 인한 유연소자로서의 내구성 저하 등의 문제가 제기되고 있다. 전도성 유기고분자의 경우는 낮은 전기전도도와 기계적강도, 유기용매 처리 등의 문제점이 지적되고 있다. 따라서 높은 전기전도도와 투광도 뿐만 아니라 유연성을 지니는 재료의 개발이 요구되고 있는 실정이다. 최근 이러한 재료로서 그래핀(graphene)과 탄소나노튜브(carbon nanotube; CNT)를 중심으로 하는 탄소나노재료가 주목받고 있으며 많은 연구가 활발히 진행되고 있다. 본 연구에서는 열화학기상증착법(thermal vapor deposition; TCVD)으로 합성된 그래핀 및 CNT를 이용하여 탄소나노재료 복합체 기반의 유연성 투명 전도막을 제작하고 그 특성을 평가하였다. 그래핀과 CNT합성을 위한 기판으로는 각각 300 nm 두께의 니켈과 1 nm 철이 증착된 실리콘 웨이퍼를 이용하였으며, 원료가스로는 메탄(CH4)과 아세틸렌(C2H2)등의 탄화수소가스를 이용하였다. 그래핀의 경우 원료가스의 유량, 합성온도, 냉각속도를 변경하여 대면적으로 두께균일도가 높은 그래핀을 합성하였으며, CNT의 경우 합성시간을 변수로 길이 제어합성을 도모하였다. 합성된 그래핀은 식각공정을, CNT는 스프레이 증착공정을 통해 고분자 기판(polyethylene terephthalate; PET) 위에 순차적으로 전사 및 증착하여 탄소나노재료 복합체 기반의 유연성 투명 전도막을 제작하였다. 제작된 탄소나노재료 복합체 기반의 유연성 투명 전도막은 물리적 과부하를 받았을 때 발생할 수 있는 유연성 투명 전도막의 구조적결함에 기인하는 전도성 저하를 보상하는 특징이 있어, 그래핀과 탄소나노튜브 각각으로 제조된 유연성 투명 전도막보다 물리적인 하중이 반복적으로 인가되었을 때 내구성이 향상되는 효과가 있다. 40% 스트레인을 반복적으로 인가하였을 때 그래핀 투명 전도막은 20 사이클 이후에 면저항이 $1-2{\Omega}/sq.$에서 $15{\Omega}/sq.$ 이상으로 급증한 반면 그래핀-CNT 복합체 투명 전도막은 30사이클까지 $1-2{\Omega}/sq.$ 정도의 면저항을 유지하였다.

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A STUDY OF ION BEAM ASSISTED DEPOSITION(IBAD) OF TiN ON Ni-Cr Be ALLOY FOR SURFACE CHARACTERISTIC (이온빔 보조 증착법에 의한 TiN 박막도포가 니켈-크롬-베릴륨 합금의 표면 성상에 미치는 영향에 관한 연구)

  • Choi, Soo-Young;Lee, Sun-Hyung;Chang, Ik-Tae;Yang, Jae-Ho;Chung, Hun-Young
    • The Journal of Korean Academy of Prosthodontics
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    • v.37 no.2
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    • pp.212-234
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    • 1999
  • Dental restorative materials must have the physical properties to withstand wear and corrosion. Base metal alloys possess better mechanical properties and lower price than the gold alloys. For these reasons such alloys have largely replaced the precious metal alloys. One aspect to con-sider is the release of metal substances to oral environment. The release of elements from dental alloys is a continuing concern because the elements may have the potentially harmful biological effects on local tissues. The purpose of this study was to minimize metal release on the nonprecious metal surfaces by ion beam assisted deposition(IBAD) of titanium nitride (TiN) Ni-Cr-Be alloys with and without TiN coatings were secured in an wear test machine opposing ruby ball to determine their relative resistance to wear with loom, 200m, 300m and 400m sliding distance. And the corrosion behavior of the Ni-Cr-Be alloys with and without TiN coatings and 3 dental noble alloys have been studied. Potentiodynamic curves were used to analyse the corrosion characteristics of the alloys. The measurement of the released Ni and Cr ions was conducted by analysis of the electrolyte solution with atomic absorption spectroscopy. The results were as follows : 1. The critical sliding distance that wore down TiN coatings of $2.5{\mu}m$ thickness in this study condition was 300m. 2. Ion beam assisted deposition of TiN showed a good surface modification with respect to the properties of wear and corrosion resistance. 3. X-ray diffraction showed that the strongest peak of TiN is TiN(111) in the coatings. 4. The release of Ni and Cr ions from alloys measured by means of atomic absorption spectroscopy was reduced by ion beam assisted deposition of TiN.

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The Effects of Levelers on Electroplating of Thin Copper Foil for FCCL (전기도금법을 이용한 FCCL용 구리박막 제조시 레벨러의 영향 연구)

  • Kang, In-Seok;Koo, Yeon-Soo;Lee, Jae-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.2
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    • pp.67-72
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    • 2012
  • In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.