• Transactions of the Korean Society of Mechanical Engineers
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• v.8 no.4
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• pp.385-393
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• 1984

본 연구에서는 다트식 낙하충격 시험에 있어서 인성의 강소성 플라스틱 재료 의 준정적 선형의 점탄성 모델이 구성되어 해석되었다. 완화계수함수, E(t)=E$_{f}$ +(E$_{o}$ -E$_{f}$ )e$^{-t/tR}$ 형태의 점탄성 재료의 수정된 Maxwell요소모델을 근거 로 충격속도, 파괴에너지, 임계응력등의 중요변수들의 상대적 종속성이 근사계산으로 평가되었다.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.7 no.1
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• pp.9-16
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• 2009

Transport package for radioactive material should be structurally safe under puncture drop condition and its safety should be verified by test and numerical analysis. Most finite element analyses for puncture drop have been performed without modeling the impact limiter since failure is occurred in the materials of the impact limiter. This paper presents a new modeling methodology, where an element is eroded in case that the material's failure criteria are reached at the element's integration point, to investigate the effect of the impact limiter in the puncture process. The effectiveness of the proposed scheme is shown through the puncture drop analysis of hotcell transport cask, which is under design in KAERI. The results show that about 80 percent of the total impact energy is absorbed due to the deformation of impact limiter. Using the present method the puncture drop can be analyzed more accurately, but it would give conservative results compared to the actual test condition.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1998.04a
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• pp.25-25
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• 1998

진동시험기를 사용한 충격시험은 자유 낙하식 충격시험기를 이용하는 것 보다 여러 가지 장점이 있으며, 충격반응 스펙트럼 시험의 요구가 점점 증가하고 있다. 진동시험기를 이용하여 충격반응 스펙트럼 시험을 실시하는데 진동시험기에서 허용하는 최대 힘, 속도, 변위에 의하여 제약을 받게 된다. 충격반응 스펙트럼을 만족하는 충격파형은 무수히 많으나 최대 가속도, 속도, 변위 등이 작으면 작을수록 그 충격파형의 품질이 우수하다고 말할 수 있다. 충격 지속시간이 짧고 충격가속도의 최대치가 큰 충격파형을 인가할 수 없지만, 충격 지속시간이 보다 길고 충격가속도의 최대치가 작은 파형이 동일한 충격반응 스펙트럼 규격을 만족할 수 있다. 진동시험기를 사용하여 충격반응 스펙트럼 시험을 수행하기 위한 충격파형이 웨이브레트를 이용하여 시험규격의 충격반응 스펙트럼을 만족하도록 합성된다. 웨이브레트의 매개변수는 주파수, 반파의 개수, 지연시간, 극성이다. 각 웨이브레트의 진폭은 시험규격의 충격반응 스펙트럼을 만족하도록·반복적으로 조절된다. 이렇게 합성된 충격파형은 진동시험기를 사용한 충격반응 스펙트럼 시험의 참조 가속도 파형으로 간주된다.

• Transactions of the KSME C: Technology and Education
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• v.3 no.1
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• pp.37-44
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• 2015

In this paper dynamic deformation of lower hinge of refrigerator is simulated using dynamic finite element analysis while refrigerator is being dropped. The flow stress curves considering velocity dependency of hinge and lower packing material are determined through bending test and compression test at several dropping speeds. The determined material properties and flow stress from reverse engineering were used as input data for refrigerator's drop test using a dynamic finite element analysis software LS-DYNA. Additionally the result between CAE and 3D deformation measurement from real refrigerator drop test are compared and the result shows that the proposed analysis model is very useful to design lower hinge and lower packing endurable to the impulsive drop impact.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.41-47
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• 2010

The effect of PCB and BGA pad designs was investigated on the mechanical property of Pb-free solder joints. The mechanical property of solder joint was tested by three different test methods of drop impact tests, bending impact test, and high speed shear test. Two kinds of pad design such as NSMD (Non-Solder Mask Defined) and SMD (Solder Mask Defined) were applied with the OSP finished Pb-free solder (Sn-3.0Ag-0.5Cu, Sn-1.2Ag-0.5Cu). in the drop impact test and bending impact test, the characterized lifetime showed the same tendency, and SMD design showed better mechanical property of solder joint than NSMD regardless of test method, which was due to the different crack path. The fracture crack on SMD pad was propagated along the intermetallic compound (IMC) layer of solder joint, while the fracture crack on NSMD pad propagated through upper edge of land which shields pattern. In the high speed shear test, pad lift occurred on the solder joint of NSMD. SMD/SMD combination of pad design consequently illustrated the best mechanical property of BGA/PCB solder joint, followed by SMD/NSMD, NSMD/SMD, and NSMD/NSMD.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5051-5059
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• 2015

Structural behaviour of the front loader for an agricultural tractor was analyzed for three impact test conditions: drop and catch, corner pull, and corner push. Rigid-body dynamic, transient structural, and static structural analyses were conducted using a commercial finite element software. Analysis of the drop and catch test dealt with the case that the bucket located at the maximum elevation was dropped and catched through three steps. Analysis of the corner pull test dealt with the case that the bucket constrained to the ground by a chain at its corner was raised suddenly. Analysis of the corner push test dealt with the case that the corner of the bucket collided with an obstacle. Results of analyses of the three test conditions showed that maximum stress occurs at the geometrically discontinuous location in the mount and is caused from local stress concentration. Results of the present research can be utilized as a guideline to achieve more reliable and safe structural design of the front loaders.

• Proceedings of the Safety Management and Science Conference
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• 2011.11a
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• pp.93-99
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• 2011

안전모는 낙하, 비례물에 대한 두부를 보호하는 보호구로 낙하물의 충격을 일부 흡수하여 완화시켜주는 기능을 하고 있다. 안전모 충격 흡수 성능으로 최고전달충격력이 있으나 낮을수록 성능이 좋은 것으로 나타나지만 안전모 제조과정에서 얼마 만큼의 충격이 흡수되는지는 알 수 없었다. 이로 인하여 성능 향상을 위한 충격력의 명확한 제어 가능한 성능 향상의 기준을 잡는데 어려움이 있었다. 본 연구에서는 충격량과 연관된 반발계수로 충격흡수 성능의 정도를 찾고자 하였다. 연구 대상은 시중에서 주로 착용되고 있는 ABS 재질의 안전인증 합격품을 대상으로 선정 하였다. 연구 방법으로는 운동량과 충격량의 이론으로 안전모 충격흡수성능 시험장치를 활용하여 인두에 전달된 충격량을 활용하여 충격흡수시의 반발계수를 구하고, 충격을 흡수치 않을 때를 가정하여 추정 충격력 곡선을 유도하고 충격흡수 전의 추정 최고 전달충격력과 반발계수를 구하여 충격흡수의 성능을 나타내었다. 연구결과 국내 안전인증 H사의 안전모의 최고전달충격력은 4100 N 이였고, 충격흡수 성능은 400 N 으로 약 9 %를 흡수되는 것으로 나타났다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.111-116
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• 2018

This research examines the drop impact of an external cooling unit package of an air conditioner system. The packaging is composed of a shock-absorbing material, which protects the package contents by absorbing the impact energy and other parts for fixture. Accurate quantification of the impact acceleration experienced by the package contents is necessary to design an effective packaging with minimal volume and sufficient shock absorbing capacity. Explicit time integration was used for the drop impact analyses. A finite element model of the package was constructed, material testing and material model selection were carried out, and sensors for data acquisition were modeled to obtain accurate simulation results. The results were compared with real physical test data. Due to imprecise modeling of the damping, the acceleration and strain values predicted by the simulation were larger than those from physical test. However, the trend of the history data and the peak deceleration value in the direction of impact showed good agreements. Thus, the analysis model and scheme are suitable for the design of an air conditioner cooling unit package.

• Proceedings of the Korean Nuclear Society Conference
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• 2002.05a
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• pp.281-281
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• 2002