• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.445.2-445.2
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• 2014

표면 조직화의 목적은 태양전지 표면에서의 입사되는 빛의 반사율을 감소 시키고, 웨이퍼 내에서 빛의 통과 길이를 길게 하며, 흡수되는 빛의 양을 증가시키는 것이다. 본 연구에서는 여러 가지 표면 조직화 공정 기술을 이용하여 표면 형상에 따른 광 변환 효율에 대해 연구하였으며, 셀을 제작하여 전기적 특성과 광학적 특성의 상관관계를 분석하였다. KOH를 이용한 표면 조직화, 산 증기를 이용한 표면 조직화, 반응성 이온 식각을 이용한 표면 조직화, 금속 촉매 반응을 이용한 표면 조직화 공정 기술을 이용하여 표면 조직화 공정을 진행하였다. 셀 제작 결과, 반사도 결과와는 상반되는 결과를 얻을 수 있었다. 표면 조직화 형상에 따른 셀 효율의 변화는 도핑 프로파일과 표면 재결합 속도의 변화 때문이라 생각되며 더 명확한 분석을 위해 양자 효율을 측정하여 분석을 시도하였다. 표면 조직화 공정 기술별 도핑 프로파일을 보면 KOH를 이용한 표면 조직화 공정을 제외한 나머지 표면 조직화 공정들의 도핑 프로파일은 불균일하게 형성되어 있는 것을 확인 할 수 있다. 양자 효율 측정 결과 단파장 대역에서 낮은 응답특성을 가지는 것을 확인 할 수 있었다. 그 이유는 낮은 반사도를 가지는 표면 조직화 공정의 경우 나노사이즈의 구조를 갖기 때문에 균일한 도핑 프로파일을 얻지 못해 전자, 정공의 분리가 제대로 이루어지지 못하였고 표면 재결합 속도증가의 원인으로 단락전류와 개방전압이 낮아져 효율이 떨어진 것으로 판단된다. 결과적으로 낮은 반사율을 갖는 표면 조직화 공정도 중요하지만 표면 조직화 공정 기술에 따른 균일한 도핑 프로파일을 갖는 공정을 개발한다면 단파장 응답도가 향상되어 단락전류밀도와 개방전압 상승효과를 얻을 수 있을 것이라 판단된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.315.1-315.1
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• 2013

표면 조직화의 목적은 태양전지 표면에서의 입사되는 빛의 반사율을 감소 시키고, 웨이퍼 내에서 빛의 통과 길이를 길게 하며, 흡수되는 빛의 양을 증가시키는 것이다. 본 연구에는 습식, 건식 표면조직화 방법에 따른 표면 형상과 표면 반사도를 분석 하였으며, 셀을 제작하여 전기적 특성과 광학적 특성의 상관관계를 분석하였다. 표면 조직화 공정은 염기성 용액인 KOH를 이용한 식각 방법과 Ag를 이용한 metal-assisted 식각, 산증기를 이용한 식각, 플라즈마를 이용한 반응성 이온식각을 적용하여 제작하였다. 표면 반사율을 400~1000 nm 사이의 파장에서 측정하였으며 KOH를 이용하여 식각한 샘플이 9.11%의 표면 반사율을 가졌으며 KOH를 이용하여 식각한 표면에 추가로 metal-assisted 식각을 한 샘플이 2%로 가장 낮은 표면 반사율을 보였다. 표면 조직화 후 동일 조건으로 셀을 제작 하여 효율 측정 결과 Ag를 이용한 2단계 metal-assisted chemical 식각이 15.83%의 가장 낮은 광변환 효율을 보였으며 RIE를 이용한 2단계 반응성 이온 식각공정이 17.78%로 가장 높은 광변환 효율을 보였다. 이 결과는 반사도 결과와 일치 하지 않았다. 표면 조직화 모양에 따른 셀 효율의 변화는 도핑 프로파일과 표면 재결합 속도의 변화 때문이라 생각되며 더 명확한 분석을 위해 양자 효율을 측정하여 분석을 시도하였다. 측정 결과 단파장 대역에서 낮은 응답특성을 가지는 것을 확인 할 수 있었는데 그 이유는 낮은 반사도를 가지는 표면조직화 공정의 경우 나노사이즈의 구조를 갖기 때문에 균일한 도핑 프로파일을 얻지 못해 전자 정공의 분리가 제대로 이루어지지 못하였고 표면 재결합 속도증가의 원인으로 단락전류와 개방전압이 낮아져 효율이 떨어진 것으로 판단된다. 실험 결과 도핑 프로파일의 균일성은 셀 효율 개선을 위해 낮은 표면 반사율 만큼 중요하다는 점을 알게되었다. 낮은 반사율을 갖는 표면조직화 공정도 중요하지만 표면에 따른 균일한 도핑 프로파일을 갖는 공정을 개발한다면 단파장 응답도가 향상되어 단락전류밀도의 상승효과를 얻을 수 있을 것이라 판단된다.

• Journal of the Korean Magnetics Society
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• v.16 no.6
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• pp.300-304
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• 2006

The varied heating temperatures were used for magnetic core materials, which nano sized ${\alpha}-Fe$ crystalline was created in nanocrystalline Fe-Si-B-Nb-Cu materials, with hish permeability and low power loss. The highest permeability and lowest power loss were obtained to the specimen heat-treated at $510^{\circ}C$. The signal transmission characteristics of inductive coupler, which was manufactured by using the magnetic core materials prepared in this study, at low frequency range, was influenced strongly by magnetic property of magnetic core materials as this result is corresponding to the permeability as a function of heat treatment temperature, as well, it was improved by impedance matching at high frequency range. Over $500{\mu}m$ of air gap in coupler is required to maintain the magnetic properties without magnetic saturation on the subterranean line transferred hish current of 300 A. The inductive coupler for PLC, which has an attenuation characteristics of less than 5dB, was manufactured using nano-crystalline magnetic core materials through the above mentioned research results.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.3
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• pp.149-156
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• 2002

Europium-activated $Ga_2O_3$ phosphor powders were prepared by homogeneous precipitation method. The resulting powders were characterized by means of TG/DTA, XRD, FT-IR and SEM, Two kinds of powders formed were the crystalline GaOOH and the amorphous-like $\gamma$-$Ga_2O_3$ phases. When the urea concentration was below 0,5 M, rod-like micrometer-sized GaOOH powders were formed. They were transformed via $\alpha$-$Ga_2O_3$ to $\beta$-$Ga_2O_3$ phases under heat treatment. On the other hand, the nanometer-sized $\gamma$-$Ga_2O_3$ powders were formed with urea concentrations higher than 1.0 M, and they were directly changed into $\beta$-$Ga_2O_3$.Photoluminescence (PL) spectra were observed at room temperature, and PL intensities of nanometer-sized $Ga_2O_3$ : $Eu^{3+}$ powders around 610 nm were higher than those of micrometer-sized ones.

• Corrosion Science and Technology
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• v.11 no.6
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• pp.275-279
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• 2012

Ni-W alloy deposits have lately attracted the interest as an alternative surface treatment method for hard chromium electrodeposits because of higher wear resistance, hardness at high temperature, and corrosion resistance. This study deals with influences of process variables, such as electodeposition current density, plating temperature and pH, on the internal stress of Ni-W nanocrystalline deposits. The internal stress was increased with increasing the applied current density. With increasing applied current density, the grain size of the deposit decreases and concentration of hydrogen in the deposit increases. The subsequent release of the hydrogen results in shrinkage of the deposit and the introduction of tensile stress in the deposit. Consequently, for layers deposited at high current density, cracking occurs readily owing to high tensile stress value. By increasing the temperature of the electrodeposition from $60^{\circ}C$ to $80^{\circ}C$, the internal stress was decreased. It seems that an increase in the number of active ions overcoming the activation energy at elevated temperature caused a decline in the concentration polarization and surface diffusion. It decreased the level of hydrogen absorption due to the lessened hydrogen evolution reaction. Therefore, the lower level of hydrogen absorption degenerated the hydride on the surface of the electrode, resulting in the reduction of the internal stress of the deposits. By increasing the pH of the electrodeposition from 5.6 to 6.8, the internal stress in the deposits were slightly decreased. It is considered that the decrease in internal stess of deposits was due to supply of W complex compound in cathode surface, and hydrogen ion resulted from decrease of activity.

• Current Photovoltaic Research
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• v.2 no.3
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• pp.103-109
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• 2014

Highly efficient hydrogenated nanocrystalline silicon (nc-Si:H) thin-film solar cells were prepared on flexible stainless steel substrates using plasma-enhanced chemical vapor deposition. To enhance the performance of solar cells, material properties of back reflectors, n-doped seed layers and wide bandgap nc-SiC:H window layers were optimized. The light scattering efficiency of Ag back reflectors was improved by increasing the surface roughness of the films deposited at elevated substrate temperatures. Using the n-doped seed layers with high crystallinity, the initial crystal growth of intrinsic nc-Si:H absorber layers was improved, resulting in the elimination of the defect-dense amorphous regions at the n/i interfaces. The nc-SiC:H window layers with high bandgap over 2.2 eV were deposited under high hydrogen dilution conditions. The vertical current flow of the films was enhanced by the formation of Si nanocrystallites in the amorphous SiC:H matrix. Under optimized conditions, a high conversion efficiency of 9.13% ($V_{oc}=0.52$, $J_{sc}=25.45mA/cm^2$, FF = 0.69) was achieved for the flexible nc-Si:H thin-film solar cells.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.75-80
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• 2014

Nanocrystalline diamond(NCD) films on steel(SKH51) has been investigated using SiC interlayer film. SiC was deposited on SKH51 or Si wafer by RF magnetron sputter. NCD was deposited on SiC at $600^{\circ}C$ for 0.5~4 h employing microwave plasma CVD. Film morphology was observed by FESEM and FIB. Film adherence was examined by Rockwell C adhesion test. The growth rate of NCD on SiC/Si substrate was much higher than that on SiC/SKH51. During particle coalescence, NCD growth rate was slow since overall rate was determined by the diffusion of carbon on SiC surface. After completion of particle coalescence, NCD growth became faster with the reaction of carbon on NCD film controlling the whole process. In the case of SiC/SKH51 substrate, a complete NCD film was not formed even after 4 h of deposition. The adhesion test of NCD/SiC/SKH51 samples revealed a delamination of film whereas that of SiC/SKH51 showed a good adhesion. Many voids of less than 0.1 ${\mu}m$ were detected on NCD/SiC interface. These voids were believed as the reason for the poor adhesion between NCD and SiC films. The origin of voids was due to the insufficient coalescence of diamond particles on SiC surface in the early stage of deposition.

• Journal of the Korean institute of surface engineering
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• v.46 no.1
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• pp.29-35
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• 2013

The effect of DC bias on the growth of nanocrystalline diamond films on silicon substrate by microwave plasma chemical vapor deposition has been studied varying the substrate temperature (400, 500, 600, and $700^{\circ}C$), deposition time (0.5, 1, and 2h), and bias voltage (-50, -100, -150, and -200 V) at the microwave power of 1.2 kW, working pressure of 110 torr, and gas ratio of Ar/1%$CH_4$. In the case of low negative bias voltages (-50 and -100 V), the diamond particles were observed to grow to thin film slower than the case without bias. Applying the moderate DC bias is believed to induce the bombardment of energetic carbon and argon ions on the substrate to result in etching the surfaces of growing diamond particles or film. In the case of higher negative voltages (-150 and -200 V), the growth rate of diamond film increased with the increasing DC bias. Applying the higher DC bias increased the number of nucleation sites, and, subsequently, enhanced the film growth rate. Under the -150 V bias, the height (h) of diamond films exhibited an $h=k{\sqrt{t}}$ relationship with deposition time (t), where the growth rate constant (k) showed an Arrhenius relationship with the activation energy of 7.19 kcal/mol. The rate determining step is believed to be the surface diffusion of activated carbon species, but the more subtle theoretical treatment is required for the more precise interpretation.

• Journal of the Korean institute of surface engineering
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• v.50 no.5
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• pp.352-359
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• 2017

The growth of nanocrystalline diamond films on a p-type poly silicon substrate was studied using microwave plasma chemical vapor deposition method. A 6 mm thick poly silicon plate was mirror polished and scratched in an ultrasonic bath containing slurries made of 30 cc ethanol and 1 gram of diamond powders having different sizes between 5 and 200 nm. Upon diamond deposition, the specimen scratched in a slurry with the smallest size of diamond powder exhibited the highest diamond particle density and, in turn, fastest diamond film growth rate. Diamond deposition was carried out applying different DC bias voltages (0, -50, -100, -150, -200 V) to the substrate. In the early stage of diamond deposition up to 2 h, the effect of voltage bias was not prominent probably because the diamond nucleation was retarded by ion bombardment onto the substrate. After 4 h of deposition, the film growth rate increased with the modest bias of -100 V and -150 V. With a bigger bias condition(-200 V), the growth rate decreased possibly due to the excessive ion bombardment on the substrate. The film grown under -150V bias exhibited the lowest contact angle and the highest surface roughness, which implied the most hydrophilic surface among the prepared samples. The film growth rate increased with the apparent activation energy of 21.04 kJ/mol as the deposition temperature increased in the range of $300{\sim}600^{\circ}C$.

• Journal of the Korean institute of surface engineering
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• v.47 no.5
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• pp.263-268
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• 2014

Nanocrystalline diamond(NCD) coated SiC balls were applied in a ball-on-disk tribometer. After seeding in an ultrasonic bath containing nanometer diamond powders, $2.2{\mu}m$ thick NCD films were deposited on sintered 3 mm diameter SiC balls at $600^{\circ}C$ in a 2.45 GHz microwave plasma CVD system. Bare $ZrO_2$ and SiC balls were prepared for comparison as test balls. Tribology tests were performed in air with pairs of three different balls and mirror polished steel(SKH51) disk. The wear tracks on balls and disks were examined by optical microscope and alpha step profiler. Under the load of 3 N, the friction coefficients of steel against $ZrO_2$, SiC and NCD-coated balls were between 0.4 and 0.8. After a few thousands sliding laps, the friction coefficient of NCD-coated balls dropped from 0.45 to below 0.1 and maintained thereafter. Under a higher load of 10 N or 20 N with a long sliding distance of 2 km, $ZrO_2$ and SiC balls exhibited the similar friction coefficients as above. The friction coefficient of NCD-coated balls was less than 0.1 from the beginning and increased to above 0.1 steadily or with some fluctuations as sliding distance increased. NCD coating layers were found worn out after long duration and/or high load sliding test, which resulted in the friction coefficient higher than 0.1.