• Applied Chemistry for Engineering
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• v.2 no.4
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• pp.363-371
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• 1991

The catalytic performance and availability of heteropoly compounds for the conversion of methanol to hydrocarbons have been studied. The effects of reaction conditions such as reaction temperature, methanol partial pressure and residence time and the effects of ion-exchange of the catalysts were examined for enhancing the yield of hydrocarbons and the selectivity of low olefins. Their acid strength depended on the kind of countercation, and the yield of hydrocarbons and the selectivity for propylene to propane were closely related to the electronegativity of the corresponding countercations. In contrast to the other heteropoly compounds, the ammonium salt showed a considerably high catalytic activity and a high selectivity for paraffins to low olefins.

• Applied Chemistry for Engineering
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• v.2 no.3
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• pp.229-237
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• 1991

Vinylester was syntheszed in the presence of amine and metal catalysts, such as triethylamine(TEA), triethylbenzyl ammonium chloride (TEBAC), cetyltrimethyl ammonium bromide (CTMAB), chromium acety] acetate (CAA), and triphenylantimony (TPA). Apropriate use of amine and organometal catalysts were 1.7~2.2 % (Wt. %), 2.5~3.1 % (Wt %) of charged methacrylic acid (MAA) in respect of reactivity, gel-time, and storage stability. The Order of reactivity was TEA>TEBAC>CTMAB>CAA>TPA. Temperature independence of catalyst showed more large deviation above $110^{\circ}C$. Storage stability could be improved without delay of gel-time by adding TPA in 2.0 % (Wt %) of charged MAA after synthesis.

• Applied Chemistry for Engineering
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• v.17 no.4
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• pp.343-348
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• 2006

The object of this experiment is to recover precious metals from plating rinsed wastewater generated from Lead Frame manufacturing process using electrolysis coupled hybrid process. This was achieved from Amberlite IRA 400 at 1.15 V electrolysis potential using the oxide electrode and at 1.30 V using the Al electrode and from Amberlite IRA 402 at 1.10 V using the oxide electrode and at 1.20 V using the Al electrode. During the first 10~30 min of the process, 90~95% of the silver can be recovered.

• Journal of the Korea Institute of Military Science and Technology
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• v.15 no.3
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• pp.231-240
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• 2012

During the past two decades, Metal Injection Molding(MIM) has become a very competitive technology to fabricate small, precise and complex-shaped parts in large quantities. In this research, the applicability of MIM technology in the mass-production of the high precision fuze parts to save manufacturing cost was investigated. The water-atomized 17-4PH stainless steel powder, one of the best corrosion-resistant high strength materials, was injection-molded into real-shape fuze part and flat tensile specimens. The injection-molded parts were thermally debound in hydrogen gas flow without solvent extraction. Sintering of the debound parts was carried out in vacuum at temperatures ranging from $1150^{\circ}C$ to $1370^{\circ}C$. The sintering behavior, mechanical properties, dimensional precision, corrosion resistance of the MIMed 17-4PH stainless parts were investigated. It was found that almost all the properties of the MIMed parts were comparable to those of the mechanically machined parts. Also, actual military field tests using both MIMed and mechanically machined fuze parts were performed as well and were found to be very successful.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.437-437
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• 2013

3족 질화물은 우수한 광학 특성과 특히 3족 물질의 조성비 조절로 넓은 대역의 밴드갭 엔지니어링으로 발광다이오드의 물질로 각광 받고 있다. 이와 더불어 발광다이오드의 광추출효율을 향상시키기 위해 다양한 연구들이 활발히 이루어지고 있다. 그 연구 중 하나로 나노, 마이크로 사이즈의 막대와 같은 일차원적 구조와 최근 ITO를 활용한 투명 전극을 대체하여 전도도가 100배 정도 높은 금속을 이용한 옆면 접촉 전극을 도입한 것이 최근 발표되었다. 그러나 옆면 접촉 전극을 형성하기 위해서는 기존의 약 100 nm 정도의 두께의 p-형질화갈륨층은 공정 마진 등에 어려움이 있다. 따라서 기존에 비해 두꺼운 p-형 질화갈륨층이 필요하다. 보통 상용화된 유기 금속화학 증착법을 이용한 p-형 질화갈륨층은 도핑 물질인 Mg의 낮은 활성화와 성장 분위기 중 수소로 인해 양질의 것을 얻기 어렵고 이를 위해 성장 후 추가적인 활성화가 필요하다. 따라서 두꺼워진 p-형 질화갈륨층에 대해서도 기존의 성장 조건과 활성화 조건의 적합 여부와 이에 대한 연구가 필요하다. 따라서 본 연구에서는 양질의 p-형 질화갈륨을 얻기 위하여 성장 조건 및 성장 후 급속 열처리 온도, 시간에 대한 최적화와 약 630 nm 두께의 p-형 갈륨질화층을 가지는 발광다이오드에 대해 급속 열처리 조건에 대한 특성 연구를 실시한다.

• Analytical Science and Technology
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• v.5 no.1
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• pp.33-39
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• 1992

THF-based crown-4 of 16-membered rings having tetrahydrofuran unit was synthesized by an acid-catalyzed condensation of furan and acetone followed by hydrogenation in an effort to obtain highly elective ionophores for lithium ions. The new ionophore was compared with previously reported ionophores under similar measurement conditions with the same plasticizer, tris(2-ethylhexyl) phosphate in poly(vinyl chloride)(PVC) membrane electrodes. Separate solution method was used to determine relative selectivity coefficients for the electrode. The selectivity coefficients($K_{LiM}^{POT}$) of lithium over ammonium, alkali and alkaline earth metal ions go from about $2.4{\times}10^{-1}$ to $2.3{\times}10^{-4}$ to working range and pH dependence have also been studied.

• The Korean Journal of Pesticide Science
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• v.10 no.1
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• pp.66-68
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• 2006

New synthetic method of 2-mercaptobenzoxazoles and 2-mercaptobenzimidazoles was established using elemental sulfur, dichloromethane, inorganic base and catalysts in alcohol solvents. This reaction condition gave products in high yields.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.19-22
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• 2007

반도체 산업은 회로의 고밀도화, 고집적화에 따라 웨이퍼 표면의 입자, 금속, 금속 이온, 유기물 등 오염물의 크기가 미세해 지고 세정에 대한 요구 조건이 더욱 엄격해지고 있다. 현재 세정 공정은 반도체 제조공정 전체에서 약 30%를 차지하고 있으며, 습식 세정 방식이 주로 사용되고 있다.[1] 습식 세정방식은 탈이온수로 린스하고 건조하는 공정이 필연적으로 따르며, 기판 표면에 건조과정에서 물반점이 남는 문제가 가장 큰 이슈로 남아 있다. 본 연구는 웨이퍼의 습식 세정 공정에 사용되는 DHF Final Clean Process후 IPA Vapor를 이용한 건조 방법을 기술 하였다. Single wafer spin process를 이용하였으며, 웨이퍼 Process 공간을 밀폐 후 N2가스를 충진하여 대기중의 산소 오염원 유입을 차단하고 수세 및 건조 가스를 이용하여 건조시킴으로써 SiFx의 SiOx로의 치환을 방지 하여 건조 효율 향상을 목적으로 한다. Bare 웨이퍼에서 65nm 이상 오염 발생 증가량을 측정 하였으며, 공정 후 웨이퍼 오염 발생량을 35개 이하로 확보 하였다.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.11-16
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• 2004

Electronic devices are getting smaller due to integration of electronic chip, and heat generated in electronic devices can cause loss of performance and/or reliability of the devices. In this research, metals such as gold, nickel and copper are plated onto a porous membrane by electroless plating method to make an efficient micro-heatsinks. Electroless plating includes sensitization and activation steps in pre-treatment steps. A polycarbonate(PC) membrane was sensitizied, activated and deposited in each metal solution for plating. Among manufactured microfibrils, heat transfer and radiation properties of Ni-microfibril with high surface area were more effective than those of $Au^-$ and Cu-microfibril.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.9
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• pp.1831-1841
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• 2002

The effect of a rubber mould on densification and deformation of aluminum alloy powder was investigated during warm isostatic pressing. The hyperelastic constitutive equations based on various strain energy potentials were employed to analyze deformation of rubber. The parameters in the strain energy potentials were obtained from experimental data for uniaxial and volumetric compression of Viton rubber at two warm temperatures. For elastoplastic response, the yield function of Shima and Oyane was implemented into a finite element program (ABAQUS) to predict compaction responses of metal powder during warm isostatic pressing. Finite element results were compared with experimental data for densification and deformation of aluminum alloy powder with/without a rubber mould under warm die pressing.