• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.23-30
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• 2004

Interfacial reaction of Pb-free $Sn0.7wt{\%}Cu$ and $Sn3.8wt{\%}Ag0.7wt{\%}Cu$ solders and Pt during aging has been investigated. After the $Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens were reflowed at $250^{\circ}C$ for 30s and the $Sn0.7wt{\%}Cu/Pt$ specimens were reflowed at $260^{\circ}C$, the specimens were aged at $125^{\circ}C,\;150^{\circ}C$ and $170^{\circ}C$ for 25-121 hours. The intermetallic thitkness and morphology change during aging were characterized using SEM, EDS and XRD. $PtSn_4$ and $PtSn_2$ were observed in the solder/pt interface and the intermetallic formation was governed by diffusion. The activation energy of intermetallic formation was 145.3 kJ/mol for$Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens for $Sn0.7wt{\%}Cu/Pt$ specimens from the measurement of the intermetallic thickness with aging temperature and time.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.15-20
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• 2007

Growth kinetics of intermetallic compound (IMC) at various interface in Cu pillar bump during aging have been studied by thermal aging at 120, 150 and $165^{\circ}C$ for 300h. In result, $Cu_6Sn_5\;and\;Cu_3Sn$ were observed in the Cu pillar/SnPb interface and IMC growth followed parabolic law with increasing aging temperatures and time. Also, growth kinetics of IMC layer was faster for higher aging temperature with time. Kirkendall void formed at interface between Cu pillar and $Cu_3Sn$ as well as within the $Cu_3Sn$ layer and propagated with increasing time. $(Cu,Ni)_6Sn_5$ formed at interface between SnPb and Ni(P) after reflow and thickness change of $(Cu,Ni)_6Sn_5$ didn't observe with aging time. The apparent activation energies for growth of total $(Cu_6Sn_5+Cu_3Sn),\;Cu_6Sn_5\;and\;Cu_3Sn$ intermetallics from measurement of the IMC thickness with thermal aging temperature and time were 1.53, 1.84 and 0.81 eV, respectively.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.720-725
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• 1998

As a basic study on the production of $Sm_{2}Fe_{17}N_{x}$ system rare earth permanent magnet by the reduction and diffusion(R- D) process, firstly the reduction reaction of $Sm_2O_3$ by metallic Ca and diffusion of Sm into Fe powder was investigated for the production the $Sm_{2}Fe_{17}$intermetallic compound. We concluded that the former case was very rapidly completed under the high temperature greater than 100$0^{\circ}C$ and the latter case of completion of diffusion reaction of Sm into the center of Fe powder(perfect homogenization condition) was required through 3h R- D reaction at 110$0^{\circ}C$ and identified as a rate determining step(RDS) on the whole reaction. Though $SmFe_2,SmFe_3$, and $Sm_{2}Fe_{17}$phases in the growth of phases of intermetallic compound in the Sm - Fe binary system were obseved below 100$0^{\circ}C$, but only $Sm_{2}Fe_{17}$phase was observed at lIOO$^{\circ}C$. Oxygen and Ca contents of the final sample in this work were 0.72wt% and O. 11 wt% respectively.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.59-64
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• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

• Korean Journal of Materials Research
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• v.11 no.5
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• pp.393-397
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• 2001

Fer the purpose of improving ductility of $Al_3$Ti intermetallic compound has potential to industrial application, we investigated formation behavior of cubic Ll$_2$ structure and effect of Mn addition. Nanocrystalline cubic Ll$_2$Al$_3$Ti intermetallic compound, has 10nm size of grain, was fabricated by mechanical alloying for 20hr at the composition of Al-8Mn-25Ti. Ternary cubic Ll$_2$Al$_3$Ti, added Mn, did not showed phase transformation from Ll$_2$ to D0$_{23}$ or D0$_{22}$ unlike binary cubic Ll$_2$Al$_3$Ti and maintained Ll$_2$ structure.

• Korean Journal of Materials Research
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• v.10 no.8
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• pp.569-574
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• 2000

To improve the ductility of $Al_3Hf$ and $Al_3Ta$ intermetallic compounds, which are the potential temperature structural materials, the mechanical alloying behaviour and the effect of ternary additions on the $Ll_2$ phase formation were investigated. During the mechanical alloying by the SPEX mill, the $Ll_2$ $Al_3Hf$ intermetallic compound was formed after 6 hours of milling in AL-25%Hf system. In AL-25%Ta system, however, only the $D0_{22}$ $Al_3Ta$ intermetallic compound was formed until 30 hours of milling and the $Ll_2$ phase was not observed. In AL-12.5%M-25%Ta(M=Cu, Zn, Mn, Fe, Ni) systems, the additions of Cu and Zn had no effect on the $D0_{22}$ structure of the binary $Al_3Hf$ and the additions of Mn, Fe and Ni produced the amorphous phase. Therefore it was considered that these ternary additions could not overcome the energy difference between $Ll_2$ and $D0_{22}$ structures in the $Al_3Hf$ intermetallic compound. In AL-12.5%M-25%Hf(M=Cu, Zn, Mn, Fe, Ni)systems, the additions of Cu and Zn did not affect the $Ll_2$ structure of the binary $Al_3Hf$ but the additions of oMn, Fe and Ni produced the amorphous phase as they did in AL-12.5%M-25%Ta systems. Therefore, it was considered that the Ni, Mn and Fe additions promote the formation of amorphous phase in $Al_3X$ intermetallic compounds.

• Journal of Korea Foundry Society
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• v.11 no.4
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• pp.266-275
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• 1991

• Journal of the Korean Society for Heat Treatment
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• v.18 no.5
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• pp.324-333
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• 2005

• Journal of the Korean Society for Heat Treatment
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• v.19 no.1
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• pp.37-49
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• 2006

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.28-28
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• 1992