• Journal of the Korean Society for Precision Engineering
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• v.17 no.9
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• pp.62-69
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• 2000

Uneven clearances in the left and right sides of a press die cause deformation of the punch in precision shearing process. This deformation results from the compression stress and bending moment from shearing force in vertical direction and from the side force in horizontal direction acting to the punch, In this study the behavior of punch deformation is investigated in order to clarify the deformation state of the punch by using strain gauge deformation to shearing force side force bending moment radius of curvature and shear plane of the punch. Also we presented the calculation method of deformation size for the punch.

• Proceedings of the Optical Society of Korea Conference
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• 2000.08a
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• pp.140-141
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• 2000

금속으로 코팅한 광섬유는 폴리머로 코팅한 광섬유에 비해 여러 가지 장점을 가지고 있다. 금속 코팅 광섬유는 열적, 화학적 안정성이 높고 고온에서 사용할 수 있으며 수분 침투에 강하고 높은 굽힘 강도를 가진다. 또 납땜을 할 수가 있어서 광섬유 소자 패키징에 있어서 매우 유리하다$^{(1)}$ . 장주기 광섬유 격자는 WDM 용 필터, 온도 및 변형도 센서, 광섬유 증폭기의 이득 평탄화 필터에 많은 유용성을 가지고 있다. 광섬유 격자를 소자로 사용하기 위해서는 재 코팅이 필수적인데 금속은 좋은 대안이 될 것이다. 금속을 재 코팅 재료로 사용하기 위해서는 금속 코팅이 격자에 미치는 영향에 대한 연구가 요구된다. 광섬유 격자 쌍은 단일 장주기 격자에 비해 분해능이 좋아 센서 및 필터 등에 유용하여 본 연구에서는 광섬유 격자쌍 위에 은을 코팅하여 투과 스펙트럼에 미치는 영향을 알아보았다. (중략)

• Proceedings of the Korea Information Processing Society Conference
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• 2022.11a
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• pp.661-663
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• 2022

이 논문에서는 변형 가능한 햅틱 컨트롤러와 포스 피드백 장치를 이용한 치과 수술 시뮬레이션 시스템을 제안한다. 이 시스템은 가상 환경에서 매복 사랑니 발치 수술을 수행하도록 설계되었다. 햅틱 하드웨어들은 신체와 수술도구의 상대적 위치를 계산하여 충돌여부를 파악하고 저항감과 진동감을 제공한다. 특히 길이 변화, 굽힘 발생과 같은 변형이 가능한 햅틱 컨트롤러는 사용하는 수술도구에 따라 느껴지는 촉감을 표현할 수 있다. 정교한 3 차원 모델로 구강내부와 치과용 수술도구를 표현한 후 햅틱 컨트롤러의 움직임과 버튼 클릭 등의 입력 값을 전달하는 모듈을 통해 가상 객체와 상호 작용하고 이에 대한 햅틱 피드백을 컨트롤러로 전달하여 사용자에게 현실적인 수술 경험을 제공한다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.9
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• pp.5769-5777
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• 2015

According to the forming or bending deformation in the press die, the thin plate occurs a work-hardening, the sheet hardening and cam unit's deformation causes incomplete forming during the cam molding process by the reacting spring forces. This study treated the input parameters of the stress and strain as given properties and also used Cam forming pressure considering the sheet hardening in the forming process of the aluminum sheet. The Hyperstudy are operated be linked with the Abaqus of the finite element analysis tool and the shape of Cam were carried out with non-linear shape optimization analysis. As a result removing the deformation of plate, the cam shape were optimized under conditions reduced deformation, having a minimum stress range and the minimum deformation. Therefore, a stress-strain curve and a normal distribution of stress-thickness can be obtained and optimization could be obtained for the shape of the stress and strain on the die plate hardened cam considering the thickness and reaction force of gas spring as iteration process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.2 s.173
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• pp.279-289
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• 2000

Residual stress induced in U-bending and tube-to-tubesheet joint processes of PWR's row-1 heat exchanger tube was measured by X-ray method and Hole-Drilling Method(HDM). Compressive residual stresses(-) at the extrados surface were induced in U-bending, and its maximum value reached -319 MPa in axial direction at the position of $\psi$ = $0^{\circ}$. Tensile residual stresses(+) of $\sigma_{zz}$ = 45 MPa and $\sigma_{\theta\theta}$ = 25 MPa were introduced in the intrados surface at the position of $\psi$ = $0^{\circ}$. Maximum tensile residual stress of 170 MPa was measured at the flank side at the position of $\psi$ = $90^{\circ}$, i.e., at apex region. It was observed that higher stress gradient was generated at the irregular transition regions (ITR). The trend of residual stress induced by U bending process of the tubes was found to be related with the change of ovality. The residual stress induced by the explosive joint method was found to be lower than that by the mechanical roll method. The gradient of residual stress along the expanded tube was highest at the transition region (TR), and the residual stress in circumferential direction was found to be higher than the residual stress in axial direction.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.11
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• pp.1105-1110
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• 2012

The spine is one of the most important skeletal joints, and it strongly affects the health of the musculoskeletal system. A normal spine has an S-shape, and it is very important to maintain this shape. Recently, spinal diseases such as low back pain have increased rapidly, especially among the elderly. Some of these diseases are caused by congenital spinal disorders and sporting and accident injuries as well as by bad postures. Improper spinal postures could generate excessive disc pressure, which is related to degeneration and pain. Therefore, in this study, we investigated the three-dimensional kinematic parameters of the thoraco-lumbar joint in several bad postures using a motion capture analysis technique. Different bad postures created a significant amount of flexion/extension, side bending, and axial rotation angle compared with neutral postures. Further study is necessary to investigate the disc pressure and ligament force due to the increase in joint rotation from the bad postures.

• Journal of Sericultural and Entomological Science
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• v.29 no.2
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• pp.58-66
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• 1987

This study was investigated on the effect of degumming of cocoon shell, raw silk yarn and grey silk crepe by use of Papain, comparing with soap, soda and soap-soda. The obtained results may be summarized as follows : 1. Degumming loss, when the pretreatment was done, was completed by Papain more than by alkali. 2. Lousiness result of Papain degummed silk yarn was apt to be improved more than that of alkali degummed one. 3. As a result of tensile property test, elasticity and resilience of Papain degummed crepe were good compared to those of alkali degummed one. 4. Not only bending rigidity of Papain degummed crepe was reduced more than that of alkali degummed one but also hysteresis of bending moment was decreased in papain degummed crepe. 5. Handle of Papain degummed crepe was superior to that of alkali degummed one.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.57-65
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• 2017

The electronic components in mobile device are composed of electronic chips and various other materials. These components become extremely thin and the constituent materials have different coefficient of thermal expansion, so that considerable warpages occurs easily due to temperature change or external load. Shadow $moir{\acute{e}}$ is non-contact, whole field technique for measuring out-of-plane displacement, but the measurement sensitivity is not less than $50{\mu}m/fringe$, which is not suitable for measuring the warpage of the electronic components. In this paper, we implemented a measurement method with enhanced sensitivity of $25{\mu}m/fringe$ by investigating and optimizing various experimental conditions of the shadow $moir{\acute{e}}$. In addition, four $moir{\acute{e}}$ fringe patterns recorded by the phase shift are processes to obtain a $moir{\acute{e}}$ fringe patterns with a sensitivity four times higher. The measurement technique is applied to small electronic components of a smart phone for measuring warpage with a high sensitivity of $5{\mu}m/fringe$ at room temperature and at the temperature of $100^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.1-7
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• 2006

In this paper, warpage magnitude and shape of printed-circuit board in case that properties of core and thickness of solder resist are varied are investigated. The cause of warpage is coefficient of thermal expansion differences of stacked materials. Therefore, we need small difference of coefficient of thermal expansion that laminated material, and need to decrease asymmetric of top side and bottom side in structure shape. Also, we can control occurrence of warpage heightening hardness of core in laminated material. Composite material that make core are exploited in connection with the structural bending twisting coupling resulting from directional properties of fiber reinforced composite materials and from ply stacking sequence. If we use such characteristic, we can control warpage with change of material properties. In this paper, warpage of two layer stacked chip scale package is investigated, and evaluate improvement result using an experiment and finite element method tool.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.21-26
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• 2013

This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.