• Title/Summary/Keyword: 굽힘변위

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Minimization of the Bending Deflection of the Human-powered Aircraft Wing Induced by Change of an Incidence Angle (인간동력항공기의 붙임각 변화에 따른 날개 끝단 굽힘변위 최소화 연구)

  • Lee, Chang-Bae;Im, Byeong-Uk;Joo, Hyun-Shik;Shin, Sang-Joon
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.47 no.2
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    • pp.98-106
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    • 2019
  • Human-powered aircraft has wings with a shape of high aspect ratio which results in large bending displacement. This paper aims to improve the structural limitation by changing an incidence angle of the wings. The tendency change of bending displacement at the wing tip is observed assuming that airfoil and cross-sectional shape of the wing is fixed, and amount of the total lift generated is satisfied. Quasi-steady lift, drag and the aerodynamic moment are distributed with regard to sections of the wing. Those are analyzed using a numerical nonlinear lifting-line method and 'geometrically exact beam' (GEB) program in EDISON. 'Variational Asymptotic Beam Sectional Analysis' (VABS) program is used to check if the present wing is structurally solid. Furthermore, the predicted tip deflections are verified by comparing with DYMORE.

Composite Hollow Bushing의 변위 특성 해석에 관한 연구

  • Jo, Han-Gu;Kim, Gwang-Yong;Seong, Yun-Gi;Lee, Cheol-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.113-113
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    • 2010
  • 본 논문에서는 composite hollow bushing에 사용되는 FRP tube의 winding 각도 및 장력 변화에 의한 변위 특성을 해석하였다. Winding 각도 및 장력에 따라 FRP tube의 인장 및 굽힘강도 특성이 변화되므로 최적의 composite bushing의 설계하기 위해서는 이에 대한 해석 및 시험이 요구된다. 따라서, 본 논문에서는 와인딩 각도 및 와인딩 장력에 따른 굽힘강도와 변위에 대하여 고찰하였으며, 와인딩 장력에 따른 각각의 특성에 대해서도 검토하였다.

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Analysis of Ship Hull Plate Bending By Roll Bending Machine (Roll bending machine에 의한 선체외판의 곡면가공 해석)

  • Kim, You-Il;Shin, Jong-Gye;Lee, Jang-Hyun
    • Journal of the Society of Naval Architects of Korea
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    • v.33 no.4
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    • pp.142-149
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    • 1996
  • Pyramid type three roll bending machines are widely used in roll-bending process to produce singly curved plate. In forming singly curved plate, controlling the vertical displacement of the center roller is most important to acquire the shape required and automation system of the process. In this paper roller bending process is modeled as an elastic-plastic phenomenon and analyzed using beam theory and finite element method. In finite element analysis the workpiece is modeled by using beam elements and plane strain elements respectively. Through the analyses vertical center roller displacement is obtained to get constant curvature distribution along arc length. The relationship between center roller displacement and curvature in steady state as well as residual stress and strain along plate thickness direction are calculated through finite element analysis.

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Study on the Dynamic Stress-Strain Behavior of Solid Propellant Using Low-Velocity Impact Test (저속충격시험을 이용한 고체추진제의 동적 응력-변형률 특성 연구)

  • Hwang, Jae-Min;Go, Eun-Su;Jo, Hyun-Jun;Kim, In-Gul;Kim, Jae-Hoon
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.49 no.10
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    • pp.813-820
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    • 2021
  • In this study, a low-velocity impact test was performed to obtain the dynamic properties of solid propellants. The dynamic behavior of the solid propellant was examined by measuring the force and displacement of the impactor during the low-velocity impact test. The bending displacement was calculated by compensating for the local displacement caused by the low-velocity impact test in the form of three point bending and the shear displacement caused by using a short and thick solid propellant specimen. Stress and strain were calculated using compensated displacements and measured force, and dynamic properties of solid propellants were obtained from the stress-strain curve and compared with static bending test. The dynamic properties of solid propellant under the low-velocity impact loading at various operating temperature conditions such as room temperature(20 ℃), high temperature(63 ℃), and low temperature(-32 ℃) were compared and investigated.

A Probe of Fiber Optic OTDR Displacement Sensor (광섬유 OTDR변위 센서의 탐촉자)

  • Kwon, Il-Bum;Kim, Chi-Yeop;Seo, Dae-Cheol
    • Journal of the Korean Society for Nondestructive Testing
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    • v.25 no.5
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    • pp.350-355
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    • 2005
  • The probes of fiber optic OTDR (Optical Time Domain Reflectometry) sensor was developed to measure displacements of social infrastructures. This probe was simply constructed with two conventional optical fiber connectors, and a fiber bending part, which transforms displacement to optical loss. When the displacement was affected on the bending loss part, the reflected light intensity of one optical connector was changed. The displacement was determined from this reflected light intensity change of the connector. fiber optic OTDR displacement sensor was developed as the multiplexed type of one fiber line with 5 sensor probes. Multiplexing operation was tested by these 5 sensor probes.

Multiplexed Bend Loss Type Single-Mode Fiber-Optic Displacement Sensor Using Reflection Signals Generated at Optical Connectors (광커넥터의 반사를 이용한 다중화된 굽힘 손실형 단일모드 광섬유 변위센서)

  • Yoo Jung-Ae;Jo Jae Heung;Kwon Il-Bum
    • Korean Journal of Optics and Photonics
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    • v.15 no.5
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    • pp.415-422
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    • 2004
  • We propose and present a new multiplexed bend loss type single-mode fiber-optic sensor system for displacement measurement in order to measure the displacement of several mm of civil engineering structures such as bridges and buildings. We make a bend loss type fiber-optic sensor for measuring displacements using the signal difference between two reflection signals due to various bend losses generating at a pair of optical connectors by using the optical time domain reflectometer. And we fabricate a multiplexed bend loss type fiber-optic sensor detecting linear displacements of 4 measuring positions of an object by setting these new 4 fiber-optic sensors on a single mode fiber simultaneously. We find that the multiplexed fiber-optics displacement sensor has linearity of 0.9942, maximum displacement of 6 mm, and accuracy of 6% for 4 measuring points.

굽힘 곡선을 이용한 공작기계 주축의 취약부 규명

  • 이찬홍;이후상
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1994.04b
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    • pp.449-453
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    • 1994
  • 공작기계의 가공정밀도는 공구와 공작물간의 상대변위 크기로서 평가되는데, 이 상대변위는 가공중에 발생 하는 절삭력이 공구-척-주축-기계구조물-안내면-가공테이블-공작물로 이어지는 하중전달 폐곡선을 흐르면서 경로상의 정적, 동적 취약부의 주된 영향을 받아 생기거나 각 요소부품의 변형이 누적되어 생겨난다. 본 연구에서는 주축의 취약부를 규명하기 위하여 정적으로는 정적 처짐곡선을 이용하고, 동적으로는 진동모우드의 굽힘곡선을 이용하여 주축선단의 처짐에 가장 영향을 많이주는 부위를 파악하였다. 취약부의 개선방법으로는 주축지름을 변화시켜 주축선단 근처에서 굽힘이 집중되지 않도록 유도하였다. 그리고 구조개선의 효과를 확인 하기 위해서 기존 주축시스템과 개선 주축시스템의 정적, 동적 특성변화를 비교하였다.

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Various Dynamic Behavior of Three Point Bend Specimens under Rapid Loading (빠른 하중을 받고 있는 3점 굽힘 시험편들의 다양한 동적거동)

  • Lee, Ouk-Sub;Cho, Jae-Ung;Han, Moon-sik
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.4 s.97
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    • pp.178-188
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    • 1999
  • 충격하중을 받는 시험편 높이의 1/4 길이의 notch를 가진 3점 굽힘시험편들의 기계적 거동에 관한 컴퓨터 시뮬레이션을 하고 이 시뮬레이션에 대한 실험적 검증도 하여 그 타당성을 입증하였다. 시험편들의 양쪽 가장자리(지지점)에서 작용되어지는 여러 가지의 하중속도에 대한 경우들과 탄소성 von Mises 재질인 모델들을 시뮬레이션에 포함시켰으며 이들에 대한 결과들을 간극 개구 변위, 반력, 크랙선단 개구 변위 및 변형률등이 속도에 의존되는 재질(점소성 재질)에 대한 시뮬레이션 결과와 비교하였다. 또한 여러가지의 동적 하중을 받는 상황하에서의 안정성이 본 연구의 시뮬레이션을 통하여 비교되었으며 그 차이점들이 규명되었다.

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Thermo-mechanical Deformation Analysis of Filu Chip PBGA Packages Subjected to Temperature Change (Flip Chip PBGA 패키지의 온도변화에 대한 변형거동 해석)

  • Joo, Jin-Won;Kim, Do-Hyung
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.4
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    • pp.17-25
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    • 2006
  • Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $moir\'{e}$ interferometry. $Moir\'{e}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for both single and double-sided package assemblies are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one because of its symmetric structure. The largest effective strain occurred at the solder ball located on the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one by 50%.

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