• Title/Summary/Keyword: 국부결함

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A Study on the Degradation of Polymer-Coated Stesl in 0.5M NaCl Solution (0.5M NaCl 용액내에서 일어나는 고분자재료로 피복된 강의 퇴화에 관한 연구)

  • Byeon, Su-Il;Jeong, In-Jo;Mun, Seong-Mo;An, Sang-Ho
    • Korean Journal of Materials Research
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    • v.6 no.10
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    • pp.1025-1033
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    • 1996
  • 본 연구에서는 0.5M NaCI 용액내에서 일어나는 고분자재료로 피복된 강의 퇴화현상을 광학현미경 관찰 및 A.C. impedance spectroscopy를 이용하여 연구하였다. 강의 부식은 고분자재료로 피복된 강의 경우 국부부식(localized corrosion)의 형태로 나타난 반면, 피복되지 않은 강의 경우에는 전면부식(uniform corrosion)의 형태로 진행되었다. 고분자재료로 피복된 강의 부식이 국부적으로 진행되는 것은 피복층내에 존재하는 기공이나 크랙과 같은 결함 등에서 부식이 선택적으로 일어나기 때문으로 사료된다. 피복층의 박리(delamination) 현상은 고분자재료로 피복된 강/구리 갈바닉쌍(galvanic couple)의 경우 구리표면 위의 피복층에서만 관찰되었다. 이는 캐소드(cathode)로 작용하는 구리의표면에서 산소의 환원반응에 의해서 형성된 수산화이온(OH-)이 피복층의 박리를 조장하고 있음을 보여준다. 또한, 고분자재료 피복층의 파손 현상은 고분자재료/강의계면에서 석출된 부식생성물에 의해서 크게 조장되고 있음을 알 수 있다.

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Solid State $^{27}Al$, $^{29}Si$ MAS NMR Spectroscopic Studies on Crystallization of ZSM-5 Synthesized at Low Temperature and Atomospheric Pressure (저온상압에서 합성된 Na,TPA-ZSM-5의 결정화에 관한 Solid State $^{27}Al$$^{29}Si$ MAS NMR 분광학적 고찰)

  • Yun, Young Ja;Ha, Jae Mok
    • Journal of the Korean Chemical Society
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    • v.40 no.10
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    • pp.656-662
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    • 1996
  • Using low temperature and atmospheric pressure method, we synthesized Na, TPA-ZSM-5 with Si/Al ratio of about 100. We employed 27Al and 29Si MAS NMR spectroscopy and FT-IR to investigate the crystallization process as a function of time. The chemical shift depends on the initial composition of reactants and changes during the course of synthesis different from those reported by others earlier. However, the chemical shift of our final product showed in the range of typical ZSM-5. And the defect site was removed by the calcine. From XRD and SEM data, the formation of ZSM-5 was also confirmed.

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A Method of Detecting Short and Protrusion-type FAB Defects Based on Local Binary Pattern Analysis (국부지역 이진 패턴 분석법에 기초한 단락 및 돌기형 FAB불량 검출기법)

  • Kim, Jin-soo
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2013.10a
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    • pp.1018-1020
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    • 2013
  • Conventionally, PCB fabrication processes detects simply electrical characteristics of TCP and COF by automatic manufacturing system and additionally, by introducing human visual detection, those are very ineffective in view of low cost implementation. So, this paper presents an efficient detection algorithm for short and protrusion-type defects based on reference images by using local binary pattern analysis. The proposed methods include several preprocessing techniques such as histogram equalizing, the compensation of spatial position and maximum distortion coordination Through several experiments, it is shown that the proposed method can improve the defect detection performance compared to the conventional schemes.

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Spectroscopic Studies on Crystallization of Na, TPA-ZSM-5 synthesized at Low Temperature and Atomospheric pressure (저온 상압에서 합성된 Na, TPA-ZSM-5의 결정화에 관한 분광학적 고찰)

  • Yun, Young Ja;Ha, Jae Mok
    • Analytical Science and Technology
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    • v.10 no.1
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    • pp.18-30
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    • 1997
  • Na, TPA-ZSM-5 with Si / Al mole ratio of about 130 was synthesized at low temperature and atmospheric pressure. These intermediate products were characterized by using XRD, XRF, FT-IR, NMR, and SEM. As a result, intermediate product were different from those that synthesized by autoclave method but spectroscopic characteristics of the final products showed to be in the typical ZSM-5 region. The defect sites were observed in the final product and removed by calcination at $540^{\circ}C$. Na, TPA-ZSM-5, aboveall, was synthesized at this condition within 48hr.

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EMTP Simulations and Analysis for Detection of Fault Location in High Temperature Superconducting Cables (고온 초전도 케이블 고장점 탐지를 위한 EMTP 시뮬레이션 및 분석)

  • Bang, Su Sik;Jang, Seung-Jin;Lee, Geon Seok;Kwon, Gu-Young;Lee, Yeong Ho;Hwang, Min-Jae;Sohn, Song-ho;Park, Kijun;Shin, Yong-June
    • Proceedings of the KIEE Conference
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    • 2015.07a
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    • pp.357-358
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    • 2015
  • 본 논문에서는 고온 초전도 케이블 고장점 탐지를 위해 시간-주파수 반사파 계측법(Time-Frequency Domain Reflectometry)을 적용하여 EMTP 시뮬레이션을 수행하고, 고온 초전도 케이블에 적합한 가우시안 첩 포락선 선형 기준 신호를 제시하였다. 고온 초전도 케이블을 EMTP로 모델링하여 TFDR 기법을 통해 케이블의 종단점을 추정하고 기준 신호의 전파 속도를 계산하였다. EMTP를 활용하여 국부적 결함이 발생한 고온 초전도 케이블을 모델링하였고, 결함 발생 케이블의 고장점 탐지 시뮬레이션 결과를 확인하였다.

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X-Ray Tomography Based Simulation Feasibility Analysis of Nuclear Fuel Pellets (핵연료 펠릿의 X-선 단층촬영 기반 시뮬레이션 타당성 해석)

  • Kim, Jae-Joon
    • Journal of the Korean Society for Nondestructive Testing
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    • v.30 no.4
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    • pp.324-329
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    • 2010
  • Fuel rods using in nuclear power plants consist of uranium dioxide pellets enclosed in zirconium alloy(zircaloy) tubes. It is vitally important for the pellet surface to remain free from pits, cracks and chipping defects after it is loaded into the tubes to prevent local hot spots during reactor operation. This paper investigates the feasibility study for detecting surface flaws of pellets contained within nuclear fuel rod through X-ray tomography simulation. Reconstructed images used by parallel and fan-beam filtered back projection method were presented and confirmed the accessibility between simulation data and MPS(missing pellet surface) image data.

Microstructure and Corrosion Properties of TiNX Thin Films Prepared by High Density Plasma Reactive Magnetron Sputtering with Electromagnetic Field System

  • Kim, Jeong-Hyeok;Park, Ji-Bong;Song, Pung-Geun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.311-311
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    • 2011
  • $TiN{\times}$박막은 우수한 내마모성 및 내부식성, 높은 경도 그리고 열적 안정성 등으로 인하여, 절삭공구 및 기계적 부품의 하드코팅, 2차 연료 전지용 확산방지막의 코팅재료로서 광범위하게 사용되어지고 있다. 일반적으로 $TiN{\times}$ 박막은 화학 기상 증착법(CVD)을 이용하였으나, 최근에는 대면적에 균일한 코팅이 가능하고 기판과 박막상의 부착력이 우수하며, 프로세스를 제어하기 쉬운 물리적 기상 증착법(PVD)의 스퍼터링법에 대한 관심이 고조되고 있다. 그러나 스퍼터링법으로 증착된 $TiN{\times}$ 박막의 물성은 주상구조와 국부적 표면결함을 포함하는 박막의 미세구조에 의존하기 때문에 주상구조 사이에 존재하는 Void 와 Pinhole 그리고 crack들이 원인으로 작용하여, 내부식성 및 기계적 특성이 급속도로 저하되는 단점이 있다. 이러한 단점을 보완하기 위해서, 본 연구에서는 기판온도를(RT, $200^{\circ}C$, $400^{\circ}C$)증가시켜 실험 하였다. 이는 온도증가에 따른 박막의 치밀화가 이루어지고 결함이 감소하여 내부식성 특성향상이 기대되어진다. 또한 플라즈마 밀도를 높이기 위해서, 기존 DC 마그네트론 스퍼터링법에 전자기장을 추가로 인가하였다. 이는 플라즈마 밀도증가에 따른 고반응성의 질소 래디컬의 생성율 증가에 기인하여 박막 형성시 질화반응을 촉진시킴으로써 박막의 치밀화 및 내부식성 특성향상이 기대되어진다.

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Flange Local Buckling(FLB) for Flexural Strength of Plate Girders with High Performance Steel(HSB 800) (고성능 강재(HSB 800)를 적용한 플레이트 거더의 휨강도에 대한 플랜지 국부좌굴)

  • Kim, Jeong Hun;Kim, Kyoung Yul;Lee, Jeong Hwa;Kim, Kyung Sik;Kang, Young Jong
    • Journal of Korean Society of Steel Construction
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    • v.26 no.2
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    • pp.91-103
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    • 2014
  • High performance steel for bridges(HSB 800) with a minimum tensile stress of 800MPa was recently developed. However, the study for local buckling behavior of plate girders considering interactive effects of flanges and webs is still insufficient. In this study, the flange local buckling(FLB) strength of plate girders with HSB 800 was evaluated by nonlinear finite element analysis. The flanges and webs of plate girders having I-section were modeled as 3D shell elements in the nonlinear analysis. Initial imperfection and residual stress were imposed on the plate girder. The high performance steel was modeled as a multi-linear material. Thus, parametric study of compression flanges with a compact, noncompact and slender web was performed. The flange local buckling behavior of plate girders was analyzed, and the nonlinear analysis results were compared with the nominal flexural strength of both AASHTO LRFD(2012) and KHBDC LSD(2012) codes.

Through-Silicon-Via Filling Process Using Cu Electrodeposition (구리 전해 도금을 이용한 실리콘 관통 비아 채움 공정)

  • Kim, Hoe Chul;Kim, Jae Jeong
    • Korean Chemical Engineering Research
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    • v.54 no.6
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    • pp.723-733
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    • 2016
  • Intensive researches have been focused on the 3-dimensional packaging technology using through silicon via (TSV) to overcome the limitation in Cu interconnection scaling. Void-free filling of TSV by the Cu electrodeposition is required for the fabrication of reliable electronic devices. It is generally known that sufficient inhibition on the top and the sidewall of TSV, accompanying the selective Cu deposition on the bottom, enables the void-free bottom-up filling. Organic additives contained in the electrolyte locally determine the deposition rate of Cu inside the TSV. Investigation on the additive chemistry is essential for understanding the filling mechanisms of TSV based on the effects of additives in the Cu electrodeposition process. In this review, we introduce various filling mechanisms suggested by analyzing the additives effect, research on the three-additive system containing new levelers synthesized to increase efficiency of the filling process, and methods to improve the filling performance by modifying the functional groups of the additives or deposition mode.

A Study on Real-Time Defect Detection Using Ultrasound Excited Thermography (초음파 서모그라피를 이용한 실시간 결함 검출에 대한 연구)

  • Cho, Jai-Wan;Seo, Yong-Chil;Jung, Seung-Ho;Jung, Hyun-Kyu;Kim, Seung-Ho
    • Journal of the Korean Society for Nondestructive Testing
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    • v.26 no.4
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    • pp.211-219
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    • 2006
  • The UET(ultrasound excited thermography) for the ,eat-time diagnostics of the object employs an infrared camera to image defects of the surface and subsurface which are locally heated using high-frequency putted ultrasonic excitation. The dissipation of high-power ultrasonic energy around the feces of the defects causes an increase In temperature. The defect's image appears as a hot spot (bright IR source) within a dark background field. The UET for nondestructive diagnostic and evaluation is based on the image analysis of the hot spot as a local response to ultrasonic excited heat deposition. In this paper the applicability of VET for fast imaging of defect is described. The ultrasonic energy is injected into the sample through a transducer in the vertical and horizontal directions respectively. The voltage applied to the transducer is measured by digital oscilloscope, and the waveform are compared. Measurements were performed on four kinds of materials: SUS fatigue crack specimen(thickness 14mm), PCB plate(1.8 mm), CFRP plate(3 mm) and Inconel 600 plate (1 mm). A high power ultrasonic energy with pulse durations of 250ms Is injected into the samples in the horizontal and vertical directions respectively The obtained experimental result reveals that the dissipation loss of the ultrasonic energy In the vertical injection is less than that in the horizontal direction. In the cafe or PCB, CFRP, the size of hot spot in the vortical injection if larger than that in horizontal direction. Duration time of the hot spot in the vertical direction is three times as long as that in the horizontal direction. In the case of Inconel 600 plate and SUS sample, the hot spot in the horizontal injection was detected faster than that in the vertical direction