• Applied Chemistry for Engineering
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• v.35 no.2
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• pp.96-99
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• 2024

A sintering paste for bonding copper plates was synthesized using Cu formate nanofibers on Cu microparticles, mixed with formic acid. Copper oxide nanofibers of 10 ㎛ grown at 400 ℃ on Cu microparticles on the surface were transformed into copper formate nanofibers through the mixing of formic acid. Compared to Cu bulk particles or nanoparticles, Cu formate on Cu microparticles decomposed into metallic Cu at a lower temperature of 210 ℃, facilitating the sintering of copper paste. The growth of nanofiber on Cu microparticles allowed for an increase in the reaction rate of formation to copper formate, aggregating surface area, and decomposition rate of copper formate, resulting in fast sintering.

• The Journal of the Convergence on Culture Technology
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• v.9 no.6
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• pp.855-859
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• 2023

Copper oxide (CuO) nanoparticles were successfully synthesized using a precursor in which industrial starch was impregnated with an aqueous solution of copper (II) nitrate trihydrate. The microstructure of the precursor impregnated with an aqueous solution of copper nitrate trihydrate was confirmed with a scanning electron microscope (SEM), and the particle size and the crystal structure of the copper oxide particles produced as the temperature of the heat treatment of the precursor increased was analyzed by X-ray diffraction (XRD) and the scanning electron microscope (SEM). As a result of the analysis, it was confirmed that the temperature at which the organic matter of the precursor is completely thermally decomposed is 450-490℃, and that the size and crystallinity of the copper oxide particles increased as the heat treatment temperature increased. The size of the copper oxide particles obtained through heat treatment at 500-800℃ during 1 hour was 100nm~2㎛. It was confirmed that the copper oxide crystalline phase is formed at a heat treatment temperature of 400℃, and only the copper oxide single phase existed up to 800℃. And it was also confirmed that the size of particles produced increased as the calcination temperature increased.

• Korean Chemical Engineering Research
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• v.46 no.6
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• pp.1069-1074
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• 2008

In this work, we made a study for the 3D SAM formation of octanethiol, decanethiol, and dodecanethiol on copper nanoparticles and we verified stability of the copper particle depending on the ratio of dodecanethiol to copper. The reaction was performed in a one-phase system under nitrogen atmosphere and the thiolated copper particles could be obtained by centrifugation. We could confirm that the nanoparticles consisted of a spherical shape of 3~6 nm from TEM images. FT-IR, XPS and TGA results showed that alkanethiols were chemisorbed via thiol group and the packing density of the alkanethiols on copper surface increased with the alkyl chain lengths. XRD patterns gave us useful information about superlattice formations. Finally, $Cu_2O$ was formed when the molar ratio of dodecanethiol to copper is less than unity and copper nanoparticles formed more compact 3D SAMs when the molar ratio of dodecanethiol to copper was 1.25.

• Journal of the Korean Society of Propulsion Engineers
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• v.21 no.1
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• pp.1-7
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• 2017

As a part of studies to lower the infrared (IR) emissivity from the surface of exhaust nozzle in the turbo jet engine, stainless steel plate was coated with copper particle/meta-aramid resin composites and the IR emissivity of the plate were investigated. Binders of filler particles based on synthetic polymers generally undergo thermal decomposition before $300^{\circ}C$. It was found that the meta aramid resin was thermally stable after the test at $320^{\circ}C$, confirming the excellent thermal stability. Contents of copper particles in the composites were varied from 0 to 70% by volume. It was observed that the copper particle/meta aramid resin composites showed good adhesion after the tests at $320^{\circ}C$. The specimen coated with the composite containing 50 vol% of copper particles showed the lowest IR emissivity, 0.6, at $320^{\circ}C$.

• Resources Recycling
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• v.10 no.6
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• pp.15-21
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• 2001

Shape-controlled copper oxides have been recovered from copper-containing waste etchant by neutralization with alkalihydroxide. Large amount of copper-containing waste etchant is generated from Printed Circuit Board industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the waste is important. In recycling process of copper oxide from the waste etchant, reaction temperature controls shapes and sizes of the products. Copper oxide recovered below reaction temperature $40^{\circ}C$ was of a needle shape, while copper oxide comes in a platy shape above $40 ^{\circ}C$ . Physical properties of samples have been characterized using SEM, XRD, TGA and Atomic absorption spectroscopy.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.118.2-118.2
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• 2016

몇몇의 박테리아들은 바이오필름을 형성하여 그들 스스로를 보호한다. 하지만 바이오필름으로 인해 악취와 질병 등의 문제가 많이 발생되고 있기 때문에 바이오필름을 형성하는 박테리아의 성장을 효율적으로 억제하기 위해 은 나노, 구리 나노입자들이 포함된 다양한 나노스케일의 재료들에 대한 연구가 활발히 진행되어오고 있다. 이들 연구의 주된 목표는 체내에서 독성은 나타내지 않으면서 항균성을 증가시키는 것에 있다. 특히, 구형으로 이루어진 나노입자와 높은 종횡비를 가지는 탄소나노튜브와 같이 차원이 다른 나노물질들의 복합체들은 세포독성을 최소화하면서 특정 박테리아에 대한 항균성을 향상시킬지도 모른다. 이번 연구에서는, 산 처리된 탄소나노튜브에 화학적인 방법을 이용하여 구리 이온을 각각 환원시켜 구리 나노-탄소나노튜브 복합체를 합성하였다. 이들 복합체는 transmission electron microscopy, X-ray diffractometry, energy-dispersive X-ray spectroscopy 를 이용하여 특성이 분석되었고 Methylobacterium spp., Sphingomonas spp. 와 E. coli 에 대하여 항균성이 평가되었다. 추가적으로 구리 나노-탄소나노튜브 복합체는 human fibroblast cells 에 대하여 세포독성이 평가되었고 제작된 마이크로칩 안에 형성된 바이오필름의 성장억제효과가 평가되었다. 결과적으로, 구리 나노-탄소나노튜브 복합체에서 바이오필름을 형성하는 Methylobacterium spp. 에 대하여 특이적으로 항균성을 나타냈으며 바이오필름이 형성된 마이크로칩에서 바이오필름을 제거 하는 것이 확인되었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.167-167
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• 2013

유체 플라즈마 공정(SPP)은 고에너지를 가지는 플라즈마를 유체 내에 발생시키는 공정으로서 나노유체 및 촉매 물질 제조 등 여러 가지 응용분야에 적용할 수 있다. 본 연구에서는 SPP를 이용하여 구리 나노입자를 합성하였고 방전시간과 전원공급장치의 변화에 따른 구리 나노입자의 특성과 구리 나노유체의 열전도도을 분석하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.82.1-82.1
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• 2007

• Journal of the Korea Institute of Building Construction
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• v.23 no.4
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• pp.393-404
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• 2023

This research evaluates the antibacterial and transparency properties of UV-curable paint augmented with 20wt% copper particles. The transparency assessment indicated that the paint maintained a total luminous transmittance of 90% or above, thereby matching or surpassing the performance of standard UV-curing paints. To further test its antibacterial capabilities, wooden flooring boards were coated with the UV-curable paint laced with 20wt% copper particles, which had been surface-modified with a silane coupling agent. Following the fatigue tests of these treated boards, an impressive bacterial reduction rate of 99.9% was noted after a span of 6 hours, demonstrating the paint's exceptional antibacterial performance.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.99.2-99.2
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• 2017

전이금속 산화물은 비교적 높은 용량 (700~1000 mAh/g)을 갖기 때문에 차세대 리튬전지용 음극으로서 많은 연구가 진행되어 왔다. 나노 코어-쉘 구조의 다공성 전이금속/전이금속 산화물 구조는 높은 비 표면적의 산화물과 높은 전기전도성을 가지는 금속 코어로 구성되어 고효율 리튬전지에 적용가능하다. 본 연구에서는 구리 소재 상에 나노코어구조의 구리/코발트 입자를 전기화학적으로 석출시킨 후 구리의 산화가 일어나지 않는 전해질/전위 조건에서 코발트만 선택적으로 산화시켜 코어-쉘 구조의 다공성 전이금속/전이금속 산화물 구조를 얻을 수 있었다. 제조된 나노 코어-쉘 구조의 다공성 전이금속/전이금속 산화물 입자를 리튬전지의 음극으로 사용하여 매우 우수한 충/방전 안정성을 나타냄을 확인할 수 있었다.