• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.379.2-379.2
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• 2014

열 화학기상증착법은 여러 가지 그래핀의 제작방법 중 대면적으로 양질의 그래핀을 효과적으로 합성할 수 있는 방법으로 널리 이용되고 있다. 이 방법으로 그래핀을 합성할 경우, 주요 변수로 성장 온도와 촉매 금속이 있으며 이를 적절히 조절함으로써 합성되는 그래핀의 결정성과 층수를 조절할 수 있다[1-3]. 본 연구에서는 탄소 용해도가 작은 두꺼운 촉매 금속 기판 위에 선택적인 위치에 탄소 용해도가 큰 얇은 촉매 금속을 증착하여 그래핀의 층수를 적절하게 제어하고자 한다. 그래핀을 합성하기 위해 온도를 증가시키는 과정에서 두 층의 촉매 금속은 표면 에너지를 낮추기 위해 합금을 형성하게 되며, 이 때 탄소 용해도가 변화할 것으로 예상된다. 이 변화하는 탄소 용해도에 맞추어 탄소 공급원인 메탄 가스를 주입하는 시기를 적절히 조절하게 되면, 합성되는 그래핀의 층수 조절이 가능할 것이라 예상한다. 탄소 용해도가 큰 금속으로 니켈을, 탄소 용해도가 작은 금속으로 구리를 선택하였다. 우선 니켈의 확산 거리를 계산하여 메탄 가스를 주입하는 적절한 온도를 결정하였으며, 이 온도를 기준으로 표면에서의 니켈의 함량을 분석하였다. 니켈의 함량과 표면에서의 탄소의 구성비의 관계를 조사한 결과, 본 실험에서 이용한 방법으로 그래핀의 층수를 조절하는 것이 가능하다는 것을 확인하였다.

• Journal of the Korean Applied Science and Technology
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• v.31 no.1
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• pp.66-73
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• 2014

In this work, the current-voltage curves for stainless steel in the ethanolamine solution containing alkyl group were measured using the conventional three electrodes of cyclic voltammetry. Stainless steel as working electrode, Ag/AgCl electrode as reference electrode and Pt wire as counter electrode were used respectively. As a result, the C-V characteristics of stainless steel were to be for an irreversible process due to the oxidation current from cyclic voltammogram, using N-ethylethanolamine and N,N-dimethylethanolamine solutions. Effective diffusivity of corrosion inhibitors was decreased with increasing concentration. It was found from SEM images of the metal that the electrolyte (specific name ?)(0.5 N) as corrosion inhibitor was added into a N, N-diethylethanolamine solution ($1.0{\times}10^{-3}M$) containing copper and nickel, the corrosion inhibiting effect was enhanced.

• Research in Plant Disease
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• v.24 no.1
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• pp.41-51
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• 2018

Since fire blight disease on apple and pear was produced in Korea in 2015, there were no registered chemicals to control against this disease. Instead, several antibacterial chemicals that were registered for other bacterial diseases such as soft rot and bacterial spot have been authorized by Rural Development Administration (RDA). However, these chemicals are not tested efficacy for fire blight disease except damage by those treatments on apple and pear in Korea. Thus, we evaluated efficiency using in vitro and in planta assays of antibacterial chemicals such as antibiotics and copper compounds including kasugamycin, oxytetracycline, oxolinic acid and streptomycin, and copper hydroxide, copper sulfate, oxine copper and tribasic copper sulfate, respectively. We also tested two kinds of biological agents. As expected, significant antibacterial effect was observed in vitro test of both antibiotics and copper-based chemicals. In planta test based on disease severity including ooze and water-soaked formation on immature pears, bacterial populations on blooms, and blight lesion formation in artificially inoculated shoots, kasugamycin, oxytetracycline and streptomycin have been shown the most efficiency among tested antibiotics. Four copper-based chemicals tested in this study, control effects are little bit lower than agricultural antibiotics but they seem to be available to use in terms of winter season. Biocontrol agents were also shown possibility to treat in eco-friendly farms. In addition, there are no antibiotic resistance genes in Korean isolates against antibiotics, which were selected for suppression of fire blight in this study.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Tuberculosis and Respiratory Diseases
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• v.61 no.3
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• pp.218-226
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• 2006

Background: The lung volume and diffusing capacity are influenced by ethnicity. However, there are no equations for predicting the normal lung volume in the adult Korean population, and there is only one equation for diffusing capacity. The aim of this study is to select the most suitable reference equation for the Korean population. Method: 30 men and 33 women at Hanyang University Guri Hospital, and 27 men and 34 women at Asan Medical Center in healthy nonsmoking adults were enrolled in this study. The subject's age, gender, height, weight, lung volume by plethysmography, and diffusing capacity by a single breathing method were obtained. The most suitable equation with the lowest sum of residuals between the observed and predicted values for lung volume and diffusing capacity was selected. Result: At Hanyang University Guri Hospital, the equations with the lowest sum of residuals in the total lung capacity were ECSC's equation in males (sum of residual: 0.04 L) and Crapo/Morris's equation (-1.04) in women. At the Asan Medical Center, the equations with the lowest sum of residuals in the total lung capacity were Goldman/Becklake's equation in males (sum of residual: -2.35) and the ECSC's equation -4.49) in women. The equations with the lowest sum of residuals in the Diffusing capacity were Roca's equation in males (sum of residual: -13.66 ml/min/mmHg) and Park's in women (25.08) in Hanyang University Guri hospital and Park's equation in all cases in the Asan Medical Center (male: -1.65, female: -6.46). Conclusions: Until a reference equstion can be made for healthy Koreans by sampling, ECSC's equation can be used for estimating the lung volume and Park's can be used for estimating the diffusing capacity.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.139-145
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• 2005

In the study, in order to deposit TaN thin film using diffusion barrier and bottom electrode we made the Plasma Assisted ALD equipment and confirmed the electrical characteristic of TaN thin films deposited PAALD method, PAALD equipment depositing TaN thin film using PEMAT(pentakis(ethylmethlyamlno) tantalum) Precursor and $NH_3$ reaction gas is aware that TaN thin film deposited of high density and amorphous phase with XRD measurement The degree of diffusion and react ion taking place in Cu/TaN(deposited using 150 W PAALD)/$SiO_2$/Si systems with increasing annealing temperature was estimated from MOS capacitor property and the $SiO_2(600\;\AA)$/Si system surface analysis by C-V measurement and secondary ion material spectrometer(SIMS) after Cu/TaN/$SiO_2(400\;\AA)$ system etching. TaN thin film deposited PAALD method diffusion barrier have a good diffusion barrier property up to $500^{\circ}C$.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.26.2-26.2
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• 2010

최근에는 차세대 조명용 후보광원인 고출력 백색 LED를 개발하기 위한 경쟁이 치열하며, 이를 위해 업체가 고심하고 있는 가장 큰 문제 중의 하나가 칩에서 발생하는 열을 어떻게 관리하는가 하는 방열의 문제이다. 따라서, LED의 가장 큰 특징인 장수명을 손해보지 않기 위해서는 칩에서 발생되고 있는 열을 외부에 확산시키기 위한 기술 개발이 필수적이다. 다양한 방열소재 중 W-Cu 복합재는 W의 낮은 열팽창계수와 Cu의 높은 열전도도로 인해 방열소재로써 유망한 소재로 주목받고 있으나, 우수한 열적 특성을 발현하기 위해서는 고치밀화를 갖는 W-Cu 복합재 제조가 우선적으로 필요하다. W-Cu 복합체는 일반적으로 액상소결법을 통해 균일한 미세조직을 얻을 수 있으나, 열팽창계수를 낮추기 위해 Cu 함량이 적어지게 되면 치밀화가 어려우며 이를 해결하기 위해 나노입자를 갖는 분말을 이용하고자 하는 연구가 많이 진행되고 있다. 본 연구에서는 W과 Cu 산화물을 이용하는 것이 구성성분끼리의 편석이 발생하지 않으며, 소결성도 우수하여 양산화에 가장 접근한 방법으로 알려져 있다. 그러나, 지금까지의 얻어진 W-Cu 복합체의 경우, 분말상태에서의 얻어진 나노입자가 승온시에 마이크로 크기로 과도한 입자성장이 일어나기 때문에 소결 후에도 나노크기를 유지하기 어려울 뿐만 아니라, 구성상끼리의 응집체가 형성된다. 본 연구에서는 액상소결후에 W 입자가 Cu 기지내에 균일하게 분산되는 동시에 나노크기의 입자를 가지는 고분산 W-Cu 소결체를 얻고자 하였다. 이를 위해 금속산화물 분말의 분쇄를 위해 효과적인 방법으로 알려진 습식상태에서의 고에너지 볼밀링을 통하여 혼합된 텅스텐과 구리 산화물 분말의 수소환원공정을 통해 얻어진 100nm 이하의 입자를 가지는 W-20wt%Cu 나노복합분말을 출발분말로 사용하였다. W-20wt%Cu 나노복합분말의 성형체를 $1050^{\circ}C-1250^{\circ}C$의 온도범위에서 소결거동을 조사하였다. 그 결과, $1100^{\circ}C$ 온도에서 이론밀도에 가까운 소결밀도를 나타내었으며, 이는 기존에 비해 $100^{\circ}C$ 정도 치밀화 온도를 낮추는 결과이다. 소결체의 미세구조 관찰결과, 소결 후 약 200nm의 텅스텐 입자가 Cu내에 균일하게 분산되어 있었다. 제조된 W-Cu 시편에 대해서는 LED 응용성을 조사하기 위해 열전도도와 열팽창계수 등을 평가하였다.