• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• Resources Recycling
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• v.24 no.4
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• pp.12-21
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• 2015

Almost all copper slags contain a considerable amount of Cu (0.5 - 3.7%) close to or even higher than copper ores. A number of methods for metal recovery from copper slag were reported These methods can be classified into three categories, flotation, leaching and roasting. Sulfide flotation method for the recovery of copper from Kazahstan copper furnace slag is discussed in this investigation. 50% of copper from the slag was recovered by sulfide flotation at pH 4. meanwhile 67% of copper from the slag was recovered at pH 11. Higher copper recovery result at pH 11 rather than that at pH 4 was caused by the fact that copper sulfides were floated in particle size fraction over $100{\mu}m$ in concentrates at pH 11. When the slag were ground below $74{\mu}m$by ball milling, the recovery of copper by floation in slag improved to 78 - 83% because of copper liberation effect.

• Applied Chemistry for Engineering
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• v.18 no.1
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• pp.41-47
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• 2007

Crude copper phthalocyanine (Cupc) was synthesized by Wyler process, then grounded using various methods such as acid pasting, kneader, attritor and SC-mill. Particle size, shape and crystalline structure were compared and evaluated after particle size reductions. Cupcs prepared by acid pasting and kneader methods that are excellent manufacturing processes in industry were used as our standards. Particle properties of Cupcs prepared either by attritor or by SC-mill were compared with particle size analyzer, scanning electron microscopy (SEM) and X-ray diffraction (XRD). Particle size analyzer and SEM were used to analyze the variation of particle sizes of Cupc with milling time. Particle size was initially decreased up to the 90 min of milling time, thereafter it reversely began to increase in case of SC-mill. Cupc obtained from dry milling with attritor displayed strong cohesion so that particle size was not possible to determine with particle size analyzer. However, the optimum milling time was indirectly approximated from the analysis of XRD peak intensity.

• Applied Chemistry for Engineering
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• v.25 no.3
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• pp.307-311
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• 2014

In this present study, Castanea crenata was found as an excellent biosorbent for the removal capability of copper ions among four different wood wastes (Castanea crenata, Pinus densiflora, Larix kaemoferi and Robinia pseudoacaia). Also, the removal efficiencies of 5, 10, 20, 40 and 50 mg/L copper ions using Castanea crenata from aqueous solution were investigated. The most effective particle size of Castanea crenata for removing 5 mg/L copper ions was found to be $43{\sim}63{\mu}m$. When the concentration of Castanea crenata increased, the removal efficiencies of copper ions were enhanced. In addition, when the 0.8 g/100 mL of Castanea crenata was used for 30 min, the removal efficiencies of 20 and 40 mg/L copper ions were 99% and 85%, respectively. Moreover, the chemical treatment of Castanea crenata with 1 M sodium acetate was required to improve the removal ability for 50 mg/L copper ions. Meanwhile, 1 M hydrochloric acid was selected as the optimal desorption agent with 93% desorption efficiency of copper ions for recycling of modified Castanea crenata. Therefore, these experimental results could be employed as economical and practical engineering data for the development of copper removal processes.

• Polymer(Korea)
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• v.25 no.2
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• pp.302-310
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• 2001

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless Cu plated layer and polyester (PET) film, the effect of pretreatment conditions such as etching method and mixed catalyst composition, and accelerator was investigated. Compared to NaOH etching medium, PET film was more finely etched by HCl solution, resulting in an improvement in adhesion between Cu layer and PET film. However, there were no significant differences in electromagnetic interference shielding effectiveness as a function of etching medium. The surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$ : SnCl$_2$ from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, the adhesion and the shielding effectiveness of Cu plated PET film were increased. Furthermore, HCl was turned out to be a better accelerator than NaOH in order to enhance the activity of the mixed PdCl$_2$/SnCl$_2$ catalyst, which facilitated the formation of more uniform copper deposit on the PET film.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2004.06a
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• pp.223-224
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• 2004

고준위폐기물 혹은 사용후 핵연료의 처분용기 재질은 각 국의 처분개념과 처분공의 주위 환경에 따라 달라질 수 있다. 용기의 후보재질로는 탄소강, 스텐레스 강, 구리, 니켈, 티탄 혹은 이들의 합금이 주로 고려되고 있으나, 국내에서는 아직 선정되지 않았다. 국내 처분환경에서 이들 재질의 부식특성을 조사하고자 모의 화강암 지하수를 가해 만든 겔 상태의 경주 벤토나이트에 탄소강, 스텐레스 강, 구리 시편을 넣고, $70^{\circ}C$, 아르곤 분위기에서 530일 경과한 후 시편의 표면 변화 (그림 1) 및 무게 감소를 측정하였다. 철 부식시편은 검정색의 철 화합물 층으로 덮여 있었으며, 구리표면에는 노란색의 부식층이 형성되었는데, 이를 XRD로 분석한 결과 $Cu_2O$로 판명되었다. 그러나 $700^{\circ}C$에서 각각 0, 24, 96시간동안 예민화시킨 스텐레스 강 시편들은 모두 초기상태 그대로 광택을 유지하고 있었으며, XRD에서 다른 화합물의 형성을 발견할 수 없었다 (그림 2). 시편의 무게 감소가 균일부식에 기인한 것으로 가정하여 환산한 결과, 구리와 스텐레스 강 모두 0.3~0.4 $\mu\textrm{m}/yr$의 부식속도를 나타내었다. 그러나 구리는 부식생성물이 표면에 부착되어 있기 때문에 실제 부식두께는 이 값보다 더 클 것으로 생각된다. 용기가 초기 530일간과 같은 속도로 처분용기의 부식이 진행된다면 한국에서 기준처분 개념으로 삼고 있는 50mm 두께의 내부식성 외벽 금속용기는 적어도 만년이상 견딜 수 있을 것으로 추정된다. 한편, 검정색 부식층을 제거한 무게감소로부터 계산한 철의 부식속도는 구리의 약 30배에 해당하였다. 금속 재질의 정확한 부식 거동을 파악하기 위해서는 보다 장기간의 실험이 요구된다. 시험법 선정에 각계(규제기관, 학계, 발전소 현장 및 산업계 등) 전문가로부터 기술자문회의를 통하여 자문 의견을 받기로 하였다. 특히 현재 폐기물 인수 기술기준치가 설정된 국가의 시험법을 심층 있게 검토하기로 하였다.검토하기로 하였다. 혹은 수성주변 환경이 지배하는 산악이나 구릉지에서 흔히 나타나는 침엽수-낙엽활엽수의 혼합림 식생상태를 잘 대변해 주고 있는 것으로 판단된다. 끝으로, 의림지 호저 퇴적층 중에서 인위적인 교란흔적이 없는 암회색 유기질 니층에 대한 탄소연대측정 결과, 제1호공 12번 시료에서 950$\pm$40 years B.P을 얻었으며, 제3-1호공에서도 아래로 내려가면서 8, 10, 11번 시료에 대하여 500$\pm$30 years B.P, 650$\pm$30 years B.P, 800$\pm$40 years B.P의 연대측정 결과를 획득하였다. 이상과 같은 의림지 호저 퇴적층의 형성환경과 형성시기 연구를 통하여 의림지의 제방축조의 최초시기를 해석해 보면, 의림지의 제방은 적어도 과거 약 827년 전에서 866년 전에는 이미 축조되어 있었음을 알 수 있다. 과거 제천 일대에 살았던 옛사람들이 의림지 하류의 곡지중앙과 고기 충적선상지에 대한 관계용 용수조달의 필요성에 부응하여 상류부 곡지하천의 자연입지 환경을 최대한 이용하여 축조한 것으로 판단된다..준비하였다.전류를 구성하는 주요 입자의 에너지 영역(75~l13keV)에서 가장 높은(0.80) 상관계수를 기록했다. 넷째, 회복기 중에 일어나는 입자들의 유입은 자기폭풍의 지속시간을 연장시키는 경향을 보이며 큰 자기폭풍일수록 현저했다. 주상에서 관측된 이러한 특성은 서브스톰 확장기 활동이 자기폭풍의 발달과 밀접한 관계가 있음을 시사한다.se that were all low

• Journal of the Korean institute of surface engineering
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• v.16 no.4
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• pp.160-172
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• 1983

티오요소류, 폴리에테르류, 염료와 같은 유기화합물이 첨가된 황산동 전기도금욕에서 석출된 구리의 광택, 평활력효과를 무첨가욕과 기존 광택제가 첨가된 도금욕에서와 각각 비교하여 이들 유기첨가제가 구리의 석출상태와 음극분극에 미치는 영향을 Hull cell 실험과 현미경관찰, 전기화학적 측정방법에 의해 고찰하였다. 황산동 전기도금욕에서 thiourea, 2-mercapto-2-imidazoline, 1-acetyl-2-thiourea와 같은 유기 황화합물은 비교적 고전류 밀도 범위에서 결정성장이 억제되고 입자가 미세한 구리석출을 일으켜 양호한 광택효과와 평활력을 가져오나, 특히 저전류밀도에서는 해로운 줄무늬가 발생한다는 점에서 많은 개선의 여지가 필요하다. 그러나 이들 유기 황화합물에 1,3-dioxolane polymer와 소량의 염소 이온을 혼합 첨가할 것 같으며 넓은 전류밀도 범위에서 양호한 광택과 평활력이 있는 동석출을 얻을 수 있었다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.164-164
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• 2013

전기수력학을 이용한 프린팅 기술은 마이크로 나노 크기의 프린팅에 효과적으로 응용되고 있으며, 전도성 입자의 인쇄를 통한 미세 전기 배선의 형성에도 사용되고 있다. 본 연구에서는 금속 고체 입자를 사용하지 않고, 금속 이온 기반의 용액을 제조하여 마이크로 크기의 패턴을 형성하였다.

• Journal of the Korean Wood Science and Technology
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• v.40 no.3
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• pp.212-227
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• 2012

Current research trends in wood preservatives for enhancing durability was reviewed. Due to leaching of recent Copper-Based Preservatives commonly used as chemicals for pressure treatment; they have been a growing concern, especially in improving the fixation of the copper as alkyl ammonium quat. and azol in wood and preventing the leaching of active ingredients. With the appearance of emulsion type chemicals using micronized and nano-sized wood preservatives, researchs on characteristics of Copper-Based Preservatives regarding penetration and fixation in wood are debatable. Moreover, unlike the case of CCA, the recent alkyl ammonium quat. and azol bear a serious threat in the decrease of antimicrobial effectiveness against wood destroying fungi with copper tolerance. Therefore, development and research of co-biocide is needed.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.837-842
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• 1998

As the size of the integrated circuit is scaled down the importance of Si cleaning has been emphasized. One of the major concerns is abut the removal of metallic impurities such as Cu and Fe on Si surface. In this study, we intentionally contaminated Cu and Fe on the Si wafers and cleaned the wafer by cleaning splits of the chemical mixture of $\textrm{H}_2\textrm{O}_2$ and HF and the combination of HF treatment with UV/$\textrm{O}_3$ treatment. The contamination level was monitored by TXRF. Surface microroughness of the Si wafers was measured by AFM. The Si wafer surface was examined by SEM. AES analysis was carried out to analyze the chemical composition of Cu impurities. The amount of Cu impurities after intentional contamination was abut the level of $\textrm{10}^{14}$ atoms/$\textrm{cm}^2$. The amount of Cu was decreased down to the level of $\textrm{10}^{10}$ atoms/$\textrm{cm}^2$ by cleaning splits. The repeated treatment exhibited better Cu removal efficiency. The surface roughness caused by contamination and removal of Cu was improved by repeated treatment of the cleaning splits. Cu were adsorbed on Si surface not in a thin film type but in a particle type and its diameter was abut 100-400${\AA}$ and its height was 30-100${\AA}$. Cu was contaminated on Si surface by chemical adsorption. In the case of Fe the contamination level was $\textrm{10}^{13}$ atoms/$\textrm{cm}^2$ and showed similar results of above Cu cleaning. Fe was contaminated on Si surface by physical adsorption and as a particle type.