• Title/Summary/Keyword: 공정 검사

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Design of a New RF Built-In Self-Test Circuit for 5.25GHz SiGe Low Noise Amplifier (5.25GHz 저잡음 증폭기를 위한 새로운 고주파 BIST 회로 설계)

  • 류지열;노석호;박세현;박세훈;이정환
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2004.05b
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    • pp.635-641
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    • 2004
  • This paper presents a new low-cost RF Built-In Self-Test (BIST) circuit for measuring transducer voltage gain, noise figure and input impedance of 5.25GHa low noise amplifier (LNA). The BIST circuit is designed using 0.18${\mu}{\textrm}{m}$ SiGe technology. The test technique utilizes input impedance matching and output transient voltage measurements. The technique is simple and inexpensive. Total chip size has additional area of about 18% for BIST circuit.

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Analysis and Case Study of a K-Stage Inspection System Considering a Re-inspection Policy for Good Items (양품재검사정책 하에서의 K단계 검사시스템의 분석과 사레연구)

  • Yang, Moon-Hee
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.8 no.4
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    • pp.930-937
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    • 2007
  • In this paper, we address a design problem and a case study of a K-stage inspection system, which is composed of K stages, each of which includes an inspection process and a rework process. Assuming the type I and II errors of inspectors and the re-inspection policy for items classified as good, we determine the smallest integer of K which can achieve a given target defective rate. If K does not exist, holding the current values of the type I, II errors, we search reversely a new vector, (the defective rate of an assembly line, the defective rate of a rework process), which can give the target defective rate. Our formulas and methodology based on our K-stage inspection system could be applied and extended to similar situations with slight modifications.

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Signal Processing and Design of a Visual Inspection System for hi~h density PCB's (고밀도 PCB의 비젼 검사 시스템의 설계 및 신호처리 기법에 관한 연구)

  • 김철우;윤한종;문영식
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.675-679
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    • 1996
  • 제품의 소형화, 고성능화, 부품의 제작기술의 급속한 발전으로 SMD실장기술은 소형화, 고밀도화로 진 보를 이루어왔다. 그러나, 기존의 PCB 검사 방법으로는 정확하고, 균일한 검사가 어려워 이를 해결할 수 있는 검사 방법이 요구되어 왔다. Machine Vsion에 의한 검사는 균일하고 정확하며, 불량의 유형도 판별하여 전체 공정의 제어가 가능한 방법이다. 본 연구에서는 영상처리에 적합한 영상을 쉽게 얻을 수 있도록 고휘도 LED를 사용하고, 밝기 조절이 가능한 영상획득부를 설계하였으며, Morphology filter룰 사용하여 빠르고, 안정된 noise 제거 및 edge 검출 알고리즘을 구현하였다.

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A Development of Offshore plant Piping Process Monitoring System Based on 3D CAD Model (3D CAD 모델 기반 해양플랜트 배관 공정 모니터링 시스템 개발)

  • Kim, Hyun-Cheol;Lee, Gyu-Hong
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.2
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    • pp.58-65
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    • 2020
  • 3D Models of offshore plant piping materials designed by 3D CAD systems are provided to the production processes in the form of 2D piping drawings and 2D piping installation drawings. In addition to the standard engineering information, the purchasing, procurement, manufacturing, installation, and inspection of raw materials are managed systematically in an integrated process control system. The existing integrated process management system can help reduce the processing time by managing the flow and progress of resources systematically, but it does not include 3D design model information. Hence, it is difficult to understand complicated pipe structures before installing the pipe. In addition, when design changes or immediate design modifications are required, it is difficult to find related data or exchange information quickly with each other. To solve this problem, an offshore plant-piping process-monitoring system was developed based on a 3D model. The 3D model-based piping monitoring system is based on Visual Studio 2017 C# and UNITY3D so that the piping-process work information can be linked to the 3D CAD model in real time. In addition, the 3D model could check the progress of the pipe installation process, such as block, size, and material, and the progress of functional inspection items, such as cleaning, hydraulic inspection, and pneumatic inspection.

맥주의 Papain Chillproofing이 foaming에 미치는 영향(제 1보) Foaming 정량법 및 맥주생산공정의 spot check

  • 박무영
    • Proceedings of the Korean Society for Applied Microbiology Conference
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    • 1975.07a
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    • pp.111.4-111
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    • 1975
  • 1l들이 mass cylinder에 200ml의 맥주를 넣고 질소가스로써 발포시킨 다음 거품이 사라지는 현상을 시간적으로 측정하는 방법을 이용하며 생산공정의 각 단계에서 채취한 맥주를 검사해 본 결과 chillproofing 공정 이후의 맥주에 foaming이 현저히 손상되고 있다는 것을 알았다.

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Development of Web-based Process Management System for Spatial Data Construction (웹기반의 공간데이터 구축공정 관리시스템 개발)

  • Choi, Byoung-Gil;Kim, Sung-Soo;Cho, Kwang-Hee
    • Journal of Korean Society for Geospatial Information Science
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    • v.14 no.3 s.37
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    • pp.63-70
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    • 2006
  • This study aims to development of web-based process management system for spatial data construction. For developing this system work classification of basic surveying was standardized and quality management method for spatial data was established. Production process and work classification system for basic surveying such as control point surveying using GPS, leveling, aerial photographing, digital mapping, topographic mapping, digital elevation modeling, aerial photographic DB construction and digital orthophotomap was standardized. The status of the output and quality inspection for basic surveying project were analyzed, and the elements of quality inspection and data format for the type of outputs were analyzed. Based on standardized and analyzed contents, web-based process management system was developed after database and process was designed. The process management system consisted of process management, quality control, metadata management, and system management.

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Slit Wafer Etching Process for Fine Pitch Probe Unit

  • Han, Myeong-Su;Park, Il-Mong;Han, Seok-Man;Go, Hang-Ju;Kim, Hyo-Jin;Sin, Jae-Cheol;Kim, Seon-Hun;Yun, Hyeon-U;An, Yun-Tae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.277-277
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    • 2011
  • 디스플레이의 기술발전에 의해 대면적 고해상도의 LCD가 제작되어 왔다. 이에 따라 LCD 점등검사를 위한 Probe Unit의 기술 또한 급속도로 발전하고 있다. 고해상도에 따라 TFT LCD pad가 미세피치화 되어가고 있으며, panel의 검사를 위한 Probe 또한 30 um 이하의 초미세피치를 요구하고 있다. 따라서, 초미세 pitch의 LCD panel의 점등검사를 위한 Probe Unit의 개발이 시급하가. 본 연구에서는 30 um 이하의 미세피치의 Probe block을 위한 Slit wafer의 식각 공정 조건을 연구하였다. Si 공정에서 식각율과 식각깊이에 따른 profile angle의 목표를 설정하고, 식각조건에 따라 이 두 값의 변화를 관측하였다. 식각실험으로 Si DRIE 장비를 이용하여, chamber 압력, cycle time, gas flow, Oxygen의 조건에 따라 각각의 단면 및 표면을 SEM 관측을 통해 최적의 식각 조건을 찾고자 하였다. 식각율은 5um/min 이상, profile angle은 $90{\pm}1^{\circ}$의 값을 목표로 하였다. 이 때 최적의 식각조건은 Etching : SF6 400 sccm, 10.4 sec, passivation : C4F8 400 sccm, 4 sec의 조건이었으며, 식각공정의 Coil power는 2,600 W이었다. 이러한 조건의 공정으로 6 inch Si wafer에 공정한 결과 균일한 식각율 및 profile angle 값을 보였으며, oxygen gas를 미량 유입함으로써 식각율이 균일해짐을 알 수 있었다. 결론적으로 최적의 Slit wafer 식각 조건을 확립함으로써 Probe Unit을 위한 Pin 삽입공정 또한 수율 향상이 기대된다.

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