• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.4
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• pp.2602-2608
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• 2015

The aim of this research was microbiological hazard analysis which is required to application of HACCP(Hazard Analysis Critical Control Point) system to chili powder. A processing had been conducted in Yong-Geum Agricultural Production located in Dongnyang-myeon, Chungju-si between January 10, 2014 to June 13, 2014. A manufacturing process chart was prepared by entire level of processing. A changes of microorganism was tested by changing sterilization time in ultraviolet ray sterilization processing which can control microbiological Hazard. As a result, critical Limits is decided as ultraviolet rays lamp $20W{\times}12EA$, sterilization $63{\pm}3$ min of each. The result of the microorganism test after ultraviolet ray sterilization was safe. On the other hand, a microorganism test of manufacturing environment and workers suggested that the microbiological hazard should be reduced through systematic cleaning and disinfection accompanied by personal hygiene based on hygiene education on workers.

• Industry Promotion Research
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• v.2 no.2
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• pp.23-29
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• 2017

This study aims to suggest a new method to escape crisis of manufacturing industry. We focused on the field - oriented management innovation promotion performance divided into qualitative performance and quantitative performance. The site-centered management innovation is an organization that helps managers to quickly solve the problems faced by field management personnel by switching from manager-centered management method to on-site management personnel-oriented management. Find out the waste factors of the work and improve the process and set the process standards according to the customer's needs. Before working on the site, an employee should know exactly the process standard of what I will do, and frequently inspect the raw materials to make sure they meet the specifications. After the self-inspection is carried out, the standard is reviewed. If there is no abnormality, the cross-validation is carried out by the method which is carried over to the next step. The results of this study can be used to enhance the competitiveness of manufacturing companies. New management innovation techniques are required to adapt to the rapidly changing international business environment, and this study has implications for this research.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.4
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• pp.35-46
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• 2000

Semiconductor technology includes from semiconductor materials, design, fabrication, handling of process equipments, reliability test to packaged semiconductor devices. Our departmental curriculum is organized with 2-years/6-quarters system of Ulsan College: the understanding for the fundamental of semiconductor is carried out in the first academic year and the training for the design skill on semiconductor devices will be focused in the second academic year. The main focus is reflected on the worldwide trend on the design engineering of semiconductor devices and considered for the market establishment on design engineers trained by the lab-oriented practice as well as the fundamental of semiconductor technology.

• Proceedings of the Korean Society for Food Science of Animal Resources Conference
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• 2004.05a
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• pp.160-162
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• 2004

본 연구는 도계장의 HACCP 적용에 따른 자료 확보를 위하여 도계공정 단계별 및 닭고기의 저장중의 미생물 증감 추이를 조사하였다. 도계장 규모별로 대규모 2곳과 소규모 2곳을 선정하여 여름, 가을, 겨울, 봄에 걸쳐 각 도계장마다 2회씩 시료를 채취하여 미생물검사를 도계공정 단계별로 실시한 결과 도계공정 초기인 내장적출 전, 후 단계에서 채취한 시료에서는 $10^5{\sim}10^6CFU/m{\ell}$이었다가 세척, 냉각 단계를 거쳐 냉장 단계에서는 $10^3{\sim}10^4\;CFU/m{\ell}$ 수준으로 균수가 감소하는 것으로 나타났다. 낙하세균수 조사결과는 계절에 관계없이 탕적실과 내장 적출실의 공기오염도는 높은 편이었고, 세척실과 냉각실은 양호하였으며 냉장실에서는 colony가 거의 검출되지 않았다. 닭고기를 $4^{\circ}C$에서 저장하였을 때 미생물 균 수의 변화를 조사한 결과 일반세균수는 저장 초기에 미세한 증가를 보이다가 저장후기(6${\sim}$12일) 급격한 증가를 보여 주었고, 조사한 미생물 중 내냉성균수가 가장 높은 균 수의 증가를 나타내었다. 대장균, 대장균군은 저장 초기 $10^1\;CFU/m{\ell}$ 수준이다가 저장 6일 이후로는 검출되지 않았다. 효모와 곰팡이 균은 $4^{\circ}C$ 저장기간 중 균수가 꾸준히 증가하는 경향을 보여 주었다.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2010.04a
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• pp.628-631
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• 2010

환경문제에 대한 관심으로 자동차에 대한 경량화가 요구되는 동시에 안전규제가 강화 되고 있어, 높은 인장강도를 가지는 고강도 강의 차체 적용 비율이 점차 증가하고 있다. 또한, 자동차 1대를 조립하기 위한 저항 점용접 횟수를 줄이고, 용접부에 충격안정성을 확보하기 위한 관심이 고조되고 있다. 따라서, 국내 자동차 산업에서 용접부의 신뢰성을 보장하기 다양한 비파괴 검사를 적용하고 있으며, 생산 공정에 적용하고 있다. 그중에서 용접 전극 사이에서 동저항(Dynamic resistance, 용접 공정중모재의 저항값의 변화)을 계측하여 용접성을 평가하는 방법이 제시되고, 차체 조립공정 중에 적용하려는 시도가 이루어지고 있다. 본 연구에서는 자동차 차체용 냉간 압연강판(590MPa dual-phase steel)을 인버터 DC 저항 점 용접하여, 용접전극 사이에서 동저항을 측정 하였다. 용접성은 인장전단 강도로 평가하였고, 용접 공정 변수는 용접 전류, 용접 시간, 가압력을 선정하였다. 동저항 그래프의 ${\alpha}$-peak와 ${\beta}$-peak값을 인장전단 강도에 따라 회귀 분석하여, 동저항에 따른 인장전단 강도를 예측하였다. 추가적으로, 용접부의 외관 형상 중에 압흔 깊이와 압흔자국 지름에 대한 회귀분석을 실시하였으며, 용접부 형상에 대한 신뢰성을 부여하였다.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.28 no.3D
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• pp.347-353
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• 2008

Generally speaking, it is important to know the activities itself exactly and to control the activities correctly so as to assure timely progress and the quality of any project. In order to progress smoothly in accordance with construction schedule, it is important to systematize the preliminary arrangements necessary for each process and then manage them. In this study, in order to progress smoothly the quality and schedule management of the construction, we can be made systematically pre-works in accordance with construction schedule by the civil construction items of the apartment house construction. we suggested pre-construction control item by the workers through experiential method of construction engineers in accordance with network schedule.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.2
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• pp.184-190
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• 2008

Various ECT techniques have been applied basically to assess the integrity of steam generator tithing in nuclear power plant. Among these techniques, the bobbin probe technique is applied generally to examine the volumetric flaws such as a crack-like defect and wear which is generally occurred on steam generator tubing, and additionally MRPC probe is used to examine closely tile top of tubesheet and bending regions due to the high possibility of cracking. Dent and bulge also may be formed on tube during installation process and operation of steam generator, but the dent and bulge indications greater than specific size criteria are recorded on examination report because these indications are not considered as flaw. These indications can be easily detected with bobbin probe and approximately sized with profile bobbin probe, but the size and shape can not be accurately verified. Accordingly, in this study, the $8{\times}1$ multi-array EC probe was designed to increase the measurement accuracy of the sectional profiling EC testing of tube. As a result, we would like to propose the application of $8{\times}1$ multi-array EC probe for the measurement of size and shape of profile change on steam generator tube in OPR-1000 nuclear power plant.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.708-714
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• 2016

In today's semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.

• Journal of Intelligence and Information Systems
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• v.9 no.1
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• pp.157-177
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• 2003

This paper presents a comprehensive and successful application of data mining methodologies to improve and predict wafer yield in a semiconductor wafer fabrication system. As the wafer fabrication process is getting more complex and the volume of technological data gathered continues to be vast, it is difficult to analyze the cause of yield deterioration effectively by means of statistical or heuristic approaches. To begin with this paper applies a clustering method to automatically identify AUF (Area Uniform Failure) phenomenon from data instead of naked eye that bad chips occurs in a specific area of wafer. Next, sequential pattern analysis and classification methods are applied to and out machines and parameters that are cause of low yield, respectively. Furthermore, radial bases function method is used to predict yield of wafers that are in process. Finally, this paper demonstrates an information system, Y2R-PLUS (Yield Rapid Ramp-up, Prediction, analysis & Up Support), that is developed in order to analyze and predict wafer yield in a korea semiconductor manufacturer.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.6
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• pp.640-645
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• 2020

To produce an input device stably using the transparent electromagnetic pattern of an electromagnetic induction method, pattern inspection is required in advance in the production process. Various methods of inspecting the capacitive pattern for hand-touch have been proposed, but it is difficult to find the related technical data for the pattern inspection method of the transparent electromagnetic induction method. In this study, to develop an inspection system for a fused electromagnetic resonance pen sensor with a copper-etched metal mesh pattern, an inspection algorithm and method for measuring the antenna impedance inside the sensor was proposed by measuring only the exposed FPCB connector. The proposed method was configured as a control board consisting of a microprocessor that forms a loop between specific channels according to the command of a computer, a computer-controlled by the Windows program, an LCR meter measuring the impedance between specific channels, and transmitting the measurement results back to the computer. An evaluation of the proposed system and measurements of nine specimens showed that it could detect the defects of the sensor used in the actual product.