• Proceedings of the Optical Society of Korea Conference
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• 2001.08a
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• pp.104-105
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• 2001

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.2
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• pp.11-22
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• 2022

This paper presents the development process for a high-power diode laser for metal surface hardening. To combine the emissions from several laser bars, it is necessary to collimate the emitted light using an optical lens. Thus, to achieve a suitable power density and uniform beam profile, several optical layouts were proposed. To estimate the laser beam for a flat-top distribution, a numerical analysis was performed using the ZEMAX software, and the results were compared with the experimental results. With a focal lens assembled in a serial diode stack source, the design can utilize the advantage of compacting the overall beam size. Experimental results for a robotic system demonstrated the processing ability of this diode laser module in industrial laser hardening.

• Korean Journal of Optics and Photonics
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• v.32 no.5
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• pp.230-234
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• 2021

Relief of thermal stress has received great attention, to improve the beam quality and stability of high-power laser diodes. In this paper, we investigate a microtrench structure engraved around a laser-diode chip-on-submount (CoS) to relieve the thermal stress on a laser-diode bar (LD-bar), using the SolidWorks® software. First, we systematically analyze the thermal stress on the LD-bar CoS with a metal heat-sink holder, and then derive an optimal design for thermal stress relief according to the change in microtrench depth. The thermal stress of the front part of the LD-bar CoS, which is the main cause of the "smile effect", is reduced to about 1/5 of that without the microtrench structure, while maintaining the thermal resistance.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.423-426
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• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.150-153
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• 2004

본 논문에서는 780 nm 고출력 레이저 다이오드의 신뢰성을 향상시키기 위하여 DLTS(deep level transient spectroscopy)을 이용하여 MOCVD(metalorganic chemical vapor deposition) 성장 조건 변화에 따른 $Al_{0.48}Ga_{0.52}As$와 $Al_{0.1}Ga_{0.9}As$ 물질에서의 깊은준위(deep level)의 거동을 조사하였다. DLTS 측정결과, MOCVD로 성장된 막에서만 나타나는 결함(defect)으로 추정되는 trap A(0.3 eV), DX center로 알려진 trap B, 갈륨(Ga) vacancy와 산소(O2) 원자의 복합체(complex)에 의한 결함인 trap D(0.6 eV) 및 EL2 라고 불리우는 trap E(0.9 eV)의 네 가지 깊은준위들이 관측되었고, 성장 조건의 변화에 따라 깊은 준위들의 농도가 감소하는 것을 관측함으로써 최적 성장 조건을 찾을 수 있었다.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.9
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• pp.129-134
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• 2016

This paper studies the high frequency PWM (pulse width modulation) driving technique to increase an optical efficiency and to prevent an optical color quenching of blue laser for head up display on vehicles using digital micro mirror device (DMD) panel and yellow phosphor wheel. The proposed approach adaptively drives the current pulse width modulated signals of high optical power of blue laser to increase the lifetime and to decrease the stem temperature of laser. This method stabilizes the temperature of laser according to the driving environment and the forward current capacity. By the proposed method, the brightness of blue laser is improved by about 37% compared to the continuous waveform current driving method.

• Korean Journal of Optics and Photonics
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• v.30 no.5
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• pp.187-192
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• 2019

In this paper a pump combiner, a key component of a high-power fiber laser, was fabricated, and its output characteristics measured using a high-power performance measuring instrument. The $(18+1){\times}1$ pump combiner consists of an optical-fiber bundle of one signal fiber and 18 pump fibers, an output optical fiber, and housing. The signal and output fibers were fabricated using polarization-maintaining optical fiber. By measuring the loss of signal light along the tapering length of the optical-fiber bundle, the tapering length was optimized to 18 mm. Signal-light insertion loss, pump-light transmittance, and polarization extinction ratio of the fabricated $(18+1){\times}1$ pump combiner were measured as 6.5%, 98.07%, and 18.0 dB respectively. The temperature distribution of the pump combiner, at a high power of 2 kW using 18 pump laser diodes, was measured and analyzed using a thermal-imaging camera.

• Korean Journal of Optics and Photonics
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• v.30 no.5
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• pp.193-196
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• 2019

The design and control of thermal flow is important for the operation of high-power laser diodes (LDs). It is necessary to analyze and improve the thermal bottleneck near the active layer of an LD. As the error in prediction of the thermal resistance of an LD is large, typically due to the hyperbolic increase and saturation to linear increase of the thermal resistance as a function of thickness, it is helpful to use a simple, modified divergence model for the improvement and optimization of thermal resistance. The characteristics of LDs are described quite well, in that the values for simulated thermal resistance curves and the thermal cross section followed are almost the same as the values from the model function. Also, the thermal-cross-section curve obtained by differentiating the thermal resistance is good for identifying thermal bottlenecks intuitively, and is also fitted quite well by the model proposed for both a typical LD structure and an improved LD with thin capping and high thermal conductivity.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.430-433
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• 2005

Laser bonding between similar and dissimilar thermoplastics has been investigated by making use of laser transmission weld technique. Spot welding of two layers of plastic materials has been demonstrated by using of a high-quality diode-laser with 808nm wavelength. Weld areas increases according to power density, exposure time. The results of peel out test show that peel strengths increase with the area of molten plastics. Layers, which have the same chemical properties, have good bonding qualities. A bonding method which dye film is coated on the interface is used for laser bonding between plastics with high transmission for laser wavelength. Laser transmission bonding is worthy of attention because it is not in contact, requires a few tooling devices, allows a flexible energy delivery and produces nearly invisible welds

• Journal of the Korean Society for Precision Engineering
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• v.22 no.9 s.174
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• pp.34-40
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• 2005

Laser welding of thermoplastics is a new jointing technique with a host of advantages. It is not only another extremely useful welding method but also a cost-effective alternative to traditional techniques involving screws or adhesives. Transmission laser-welding of thermoplastics such as polycarbonate(PC), polypropylene(PP), polyvinyl chloride(PVC), low density polyethylene(LDPE) and acrylic using a high power diode laser has been studied experimentally. The optical transmission of each plastic has been measured at laser wavelength of 808nm. The weld process has been characterized by the specific energy and weld time required for each plastic. The characteristics of laser welding between same plastics have also been analyzed.