• Korean Chemical Engineering Research
• /
• v.46 no.1
• /
• pp.200-204
• /
• 2008

The curing kinetics of diglycidyl ether of bisphenol F (DGEBF) with an asymmetric cycloaliphatic amine curing agent were examined by thermal analysis in both isothermal and dynamic curing conditions. From the residual curing of the samples partially cured in isothermal condition and from the dynamic curing with various heating rates, it was found that there exist two kinds of reactions such as at low temperature and at high temperature regions. It was thus also found that the cure parameters obtained from the isothermal curing kinetic model hardly estimate experimental results for a degree of cure larger than 0.6. The activation energies and frequency factors of these two kinds of reactions were obtained from the dynamic curing experiments with various heating rates. From the curing analysis, it was verified that the total cure kinetics for low degrees of cure is dominated by the cure reaction in the low temperature region.

• Proceedings of the Korean Nuclear Society Conference
• /
• 1996.05c
• /
• pp.253-258
• /
• 1996

본 연구는 Zr-2.5wt%Nb합금의 고온변형특성중 특이한 유동응력의 변화거동인 어닐경화와 유동연화의 기구에 대해 고찰하였다. 연구결과에서 이러한 고온변형특성은 온도와 다단변형도중의 어닐링 시간에 영향을 받는 것으로 나타났으나 분위기 영향은 없는 것으로 나타났다. 즉, 변형 온도와 동일온도인 85$0^{\circ}C$에서 단시간인 5분동안 어닐링을 했을때 경화현상이 일어났다. 미세조직을 관찰한 결과 다단열간압연된 후의 미세조직과 집합조직은 다단열간압연된 미세조직과 집합조직과 직접적인 상관관계를 가진 것으로 나타났다. 어닐경화현상은 다단고온변형이 궁극적으로 변형시효와 유사한 효과 즉, 중간어닐링 동안에 Zr-2.5wt%Nb내의 불순물 원자와 열간압연시에 형성된 전위구조와의 강력한 인력형 상호작용하여 substructure가 안정화되기 때문이며 유동연화는 재결정으로 인한 유동응력의 감소인 것으로 사료된다.

• Polymer(Korea)
• /
• v.38 no.2
• /
• pp.171-179
• /
• 2014

Low temperature cure prepregs are being developed for use in the preparation of large-structured fiber-reinforced polymer (FRP) composites with good performance. Cure behavior and chemorheology of low temperature cure epoxy resin system, based on epoxy resin, curing agent, and accelerators, were investigated to provide a matrix resin suitable for the prepreg preparation. Characteristics of cure reaction were studied in both dynamic and isothermal conditions by means of differential scanning calorimetry and rheometry. The low temperature cure epoxy resin system suggested in this study as a matrix resin was curable at $80^{\circ}C$ for 3 h, and showed the gel times of 120 and 20 min at 80 and $90^{\circ}C$, respectively. Thermal and mechanical properties of the cured sample were almost the same as high temperature cure counterparts.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.10 no.4
• /
• pp.433-441
• /
• 1986

본 연구에서는 인장시험과 인장시 변형율속도 변화와 온도변화를 주는 시험을 통하여 316스테인리스강에 있어서의 비탄성거동을 규명하여 가공경화에 대한 용질강화 효과를 시험하고, Voce형의 발전방정식(evolutionary equation)을 포함하는 Arrhenius 형의 구성식에 용질강화효과를 첨가하여 정확한 비탄성 해석을 기하고자 한다.

• Korean Journal of Materials Research
• /
• v.6 no.1
• /
• pp.67-78
• /
• 1996

제 3원소가 첨가된 금속간 화합물 TiAI 금속간 화합물 분말을 PREP법(플라즈마 회전전극법)으로 제조하여, 통.방전 강압소결법에 의해 치밀한 소결체를 만들었다. 이에 대해 첨가 원소의 종류와 열처리에 따른 고온 및 상온 압축 특성의 변화를 조사하였다. 소결체의 미세조직은 ${\gamma}$/$\alpha$2 lamella로 이루어진 완전 변태구조였고, 결정립의 크기는 140-150$\mu\textrm{m}$였으며 계단형 결정립계를 나타내었다. 소결체를 ($\alpha$+${\gamma}$)구역인 130$0^{\circ}C$에서 2시간 동안 열처리한 결과, 모든 조성의 시편이 등축점 ${\gamma}$와 lamella로 이루어진 전형적인 duplexrn조로 변태하였다. 상온 압축 시험에서 시편은 파괴될 때까지 가공경화 현상이 나타났으며, Cr을 첨가한 시편이 가장 큰 파괴응력과 변형률을 나타내었다. 한편, 고온 압축 시험의 경우 온도상승 때문에 가공경화의 속도가 감소되었고, 80$0^{\circ}C$에서는 가공경화와 회복이 균형을 이루는 소위 정상 상태의 변형을 보였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.1
• /
• pp.69-74
• /
• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.20 no.4
• /
• pp.503-509
• /
• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• Journal of Welding and Joining
• /
• v.12 no.1
• /
• pp.38-43
• /
• 1994

고강도 알루미늄합금은 중량이 가벼우면서 인장강도와 항복강도가 높고 가공성, 성형성이 좋아 항공기, 자동차, 선박 등 수송용 재료로 각광을 받고 있으며, 이 중 Al-Zn-Mg계(7000계) 알루미늄 합금은 용접 구조물용 경량소재로 활용범위가 높다. Al-Zn-Mg계 알루미늄 합금은 고온에서 용체화 처리후 저온으로 급냉시킨 재료를 자연시효 또는 인공시효처리를 하여 이 때 석출되는 시효 석출물에 의해 강도를 증가시킨 석출 경화형 합금이다. 그런데, 7000계열 알루미늄합금은 적절한 열처리 작업을 통해 최적의 기계적 성질이 얻어지도록 합금설계가 되어있기 때문에 구조물 제작시 용접에 의한 ARC 열을 받게 되면 열이력(thermal cycle)에 의해 모재의 미세조직이 변화하고 용접 결함이 발생하며 강도의 약화와 함께 내식성 등이 저하한다. 따라서 고강도 알루미늄합금의 용접성을 향상시키기 위해서는 용접부의 미세조직거동과 용접부에 발생하는 용접결함의 현상을 조사하여 용접용 고강도 합금에 필수적으로 요구되는 용접성에 대한 검토가 충분히 이루어져야 한다. 따라서 본 고에서는 알루미늄합금, 특히 7000계열 알루미늄합금에 주목하여, 용접방법, 각종 결함과 대책, 용접부의 시효경화와 응력부식균열 및 기계적 성질 등을 지금까지 보고된 각종 자료를 기초로 하여 3회에 걸쳐 기술하고자 한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.07a
• /
• pp.173-176
• /
• 2000

In this paper, we investigated the surface degradation of HTV silicone rubber used for a polymeric insulator by UV irradiation. To study the surface ageing properties by W irradiation, we used the corona discharge charging and contact angle. Therefore, we observed the change of surface charge retention and decrease of surface hydrophobicity. Also, we discussed the chemical change in the surface range using the analytic equipment such as SEM, ATR-FTIR, ESCA. Therefore, it is found that the scissor of characteristic bonding and the reattachment of oxidant bonding was developed by UV rays radiation. As discussing the corona ischarge charging and the change of contact angle, it is found the effect of UV irradiation and the mechanism of chemical reaction

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.5
• /
• pp.411-419
• /
• 2000

In this paper we have investigated the surface degradation by ultraviolet-irradiation in high-temperature vulcanized silicone rubber. Through the measurement of surface potential decay by corona-charging and of contact angle it is found that the change of surface electrostatic properties and the decrease of contact angle under UV-radiation. For the changes in micro-morphological and chemical structure of the UV-treated silicone rubber we utilized several analytical techniques such as SEM, ATR-FTIR,XPS. From this study it is shown that the chemical reactions(scissoring of side chain(S-$CH_3$) cross-linking and branching) occur on the surface of silicone rubber during the UV-irradiation. Also we obtained the results of the loss of low molecular weight chain by cross-linking and oxidation reaction.