• Korean Chemical Engineering Research
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• v.46 no.4
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• pp.799-805
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• 2008

In general, anionic and cationic surfactants are incompatible because their mixtures form insoluble complexes and precipitate in the water. There are, however, some equimolar complexes of anionic and cationic surfactant that are soluble and behave like regular surfactants, specifically like nonionic surfactants, thus named pseudo-nonionic surfactant complexes. Pseudo-nonionic complexes are more effective and efficient in surface activities than their ionic surfactant components as shown by their equilibrium and dynamic surface tensions. They pack at the interface more than their ionic components. When a novel cationic surfactant, diglyceryl dodecyl dimethyl ammonium chloride(DGDAC), having the polyhydroxyl group at the hydrophilic head group, was mixed with a conventional anionic surfactant (sodium dodecyl sulfate; SDS) at equimolar ratio, we found that the aqueous equimolar mixture showed strong positive synergism in which molecular interaction parameter ${\beta}^M$ was very low, -17.2. According to the studies of equilibrium phase behavior and microscopy, this mixed system could form homogenous solutions containing vesicles.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.172-173
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• 2000

디지털 시대에 접어들면서 반도체 소자들에 대한 고속화 및 소형화 요구가 더욱 증대되었으며 이를 충족시키기 위해서 고집적, 고성능의 소자 제작기술에 대한 관심이 높아지고 있다. 이에 따라 필연적으로 게이트 유전 박막의 두께가 1 nm 정도까지 얇아질 것으로 예측되고 있다[표 1 참조].$^{(1)}$ 박막의 두께가 얇아지면서 박막과 기판 사이에 존재하는 계면층이 반도체 소자의 결함 원인으로 대두되었고 이러한 결함을 제거하기 위해서는 계면층에 대한 정보를 정확하게 알아내어야 한다. (중략)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.81-82
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• 2006

SOI(Silicon-On-Insulator) MOSFET의 전기적 특성에 미치는 게이트 산화막과 계면준위 밀도의 관계를 조사하였다. 결함이 발생하지 않는 얕은 소스/드레인 접합을 형성하기 위하여 급속열처리를 이용한 고상확산방법으로 제작한 SOI MOSFET 소자는 급속열처리 과정에서 계면준위가 증가하여 소자의 특성이 열화된다. 이를 개선하기 위하여 $H_2/N_2$ 분위기에서 후속 열처리 공정을 함으로써 소자의 특성이 향상됨을 볼 수 있었다. 이와같이 급속열처리 공정과 $H_2/H_2$ 분위기에서의 후속 열처리 공정이 소자 특성에 미치는 영향을 분석하기 위하여 소자 시뮬레이션을 이용하여 게이트 산화막과 채널 사이의 계면준위 밀도를 분석하였다. 그 결과, n-MOSFET의 경우에는 acceptor-type trap, p-MOSFET의 경우에는 donor-type trap density가 소자특성에 큰 영향을 미치는 것을 확인하였다.

• Clean Technology
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• v.18 no.4
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• pp.446-450
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• 2012

Strong alkaline electrolyzed water which is produced in cathode by electrolyzing the solution where electrolytes (NaCl, $K_2CO_3$ etc.) are added in diaphragm electrolytic cell, is eco-friendly and has cleaning effects. So, it is viewed as a substitution of chemical cleaner. In addition, strong alkaline electrolyzed water is being used by some Japanese automobile and precision parts manufacturing industries. When strong alkaline electrolyzed water is produced by using diaphragm electrolytic cell, it is necessarily produced at the anode side. Since strong acidic electrolyzed water produced is discarded when its utilization cannot be found, production efficiency of electrolyzed water is consequently decreased. Also, there is a weakness electrolytic efficiency is decreasing due to the pollution of diaphragm. In order to overcome this, non-diaphragm all-in-one electrolytic cell integrated with electrode reaction chamber and dilution chamber was applied. Strong alkaline electrolyzed water was produced for different composition of electrolytes, and their properties and characteristics were identified. In comparing the properties between strong alkaline electrolyzed water produced in diaphragm electrolytic cell and that produced in all-in-one electrolytic cell, the differences in ORP and chlorine concentration were found. In emulsification test to confirm surface-active capability, similar results were obtained and strong alkaline electrolyzed water produced in non-diaphragm all-in-one electrolytic cell was identified to be useable as a cleaner like strong alkaline electrolyzed water produced in diaphragm electrolytic cell. Strong alkaline electrolyzed water produced in non-diaphragm all-in-one electrolytic cell is thought to have sterilizing power because it has active chlorine which is different from strong alkaline electrolyzed water produced in diaphragm electrolytic cell.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.1-6
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• 2004

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the ECM(Engine Control Module) alumina substrate and the intermetallic compound layer between Sn-37wt%Pb solder and pad joints after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, conductor pad roughness were increased from 304 nm to 330 nm. $Cu_6/Sn_5$ formed during initial reflow process at the interface between TiWN/Cu pad and solder grew by the succeeding reflow process, so the grains became coarse. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about 0.1∼0.6 $\mu\textrm{m}$. And a needle-shaped was also observed at the inside of the solder.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2004.11a
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• pp.89-93
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• 2004

• Proceedings of the Korean Vacuum Society Conference
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• 2009.02a
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• pp.183.1-183.1
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• 2009

• Polymer Science and Technology
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• v.2 no.4
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• pp.284-293
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• 1991

• Proceedings of the Optical Society of Korea Conference
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• 2005.07a
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• pp.82-83
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• 2005

• Proceedings of the Optical Society of Korea Conference
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• 1997.08a
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• pp.15-15
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• 1997