• Journal of Energy Engineering
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• v.8 no.2
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• pp.272-278
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• 1999

In the present study, measurements of thermal contact resistance (TCR) were conducted for joints of brass and aluminium cylinders of 30 mm in diameter, 45 mm in length, when their interfaces were; ⅰ) under vacuum, ⅱ) charged with a pure silicone grease and ⅲ) charged with a mixture of silicone grease and powder of aluminium (#325). Also the data were compared with analytical calculations using Fouche's model. The data of TCR for joints under vacuum state varied in the range of (2∼100)${\times}$10$\^$-5/(㎡$^{\circ}C$/W) depending on their surface roughness. When the contact surfaces were carefully ground, a reduction of 30∼50% in TCR was obtained. But the surface treatment with silicone grease gave rise to a reduction of about 5∼10 times more than that of vacuum state. The analytical prediction by Fouche's model showed a good agreement within 10~30%, for the case of contact surface charged with silicone grease.

• Journal of the Korean Vacuum Society
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• v.10 no.3
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• pp.368-373
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• 2001

Pd/Si/Ti/Pt ohmic contact to n-type InGaAs was investigated. As-deposited contact showed non-ohmic behavior, and high specific contact resistivity of $5\times10^{-3}\Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $375^{\circ}C$ for 10 seconds. However, the specific contact resistivity decreased remarkably to $1.7\times10^{-6}\Omega\textrm{cm}^2$ and $2\times10^{-6}\Omega\textrm{cm}^2$ at $375^{\circ}C$/60sec and $425^{\circ}C$/10sec, respectively. Superior ohmic contact and non-spiking planar interface between ohmic materials and InGaAs were maintained even at $450^{\circ}C$, therefore, this thermally stable ohmic contact system is a promising candidate for compound semiconductor devices.

• Journal of Adhesion and Interface
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• v.21 no.3
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• pp.86-92
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• 2020

We confirmed the effects on the device performances and the charge injection characteristics of organic field-effect transistor (OFET) by selectively differently controlling the surface energies on the contact region of the substrate where the source/drain electrodes are located and the channel region between the two electrodes. When the surface energies of the channel and contact regions were kept low and increased, respectively, the field-effect mobility of the OFET devices was 0.063 ㎠/V·s, the contact resistance was 132.2 kΩ·cm, and the subthreshold swing was 0.6 V/dec. They are the results of twice and 30 times improvements compared to the pristine FET device, respectively. As the results of analyzing the interfacial trap density according to the channel length, a major reason of the improved device performances could be anticipated that the pi-pi overlapping direction of polymer semiconductor molecules and the charge injection pathway from electrode is coincided by selective surface treatment in the contact region, which finally induces the decreases of the charge trap density in the polymer semiconducting film. The selective surface treatment method for the contact region between the electrode and the polymer semiconductor used in this study has the potential to maximize the electrical performances of organic electronics by being utilized with various existing processes to lower the interface resistance.

• Journal of the Korean Vacuum Society
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• v.10 no.2
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• pp.219-224
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• 2001

Pd/Ge/Ti/Pt ohmic contact to n-type InCaAs was investigated. Minimum specific contact resistivity of $3.7\times10^{-6}\; \Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $400^{\circ}C$ for 10 seconds. This was related to the formation of Pd-Ge compounds and the in-diffusion of Ge atoms to InGaAs surface. However, the specific contact resistivity increased slightly to $low-10^5\; \Omega\textrm{cm}^2$ in the case of longer annealing time. Superior ohmic contact and non-spiking planar interface between ohmic materials and InGaAs were maintained after annealing at high temperature. Therefore, this thermally stable ohmic contact system is a promising candidate for compound semiconductor devices.

• Composites Research
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• v.25 no.3
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• pp.76-81
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• 2012

Atmospheric pressure plasma treatment on carbon nanotube (CNT) surfaces was performed to modify reinforcement effect and interfacial adhesion of carbon fiber reinforced CNT-phenolic composites. The surface changes occurring on CNT treated with plasma were analyzed by using Fourier transform infrared spectroscope (FT-IR). The significant improvement of wettability on CNT was confirmed by static contact angle test after plasma treatment. Such plasma treatment resulted in a decrease in the advancing contact angle from $118^{\circ}$ to $60^{\circ}$. The interfacial adhesion between carbon fiber and CNT-phenolic composites increased by plasma treatment based on apparent modulus test results during quasi-static tensile strength. Furthermore, the proposed database offers valuable knowledge for evaluating interfacial shear strength (IFSS).

• Composites Research
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• v.23 no.2
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• pp.24-30
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• 2010

Interfacial evaluation and hydrophobicity of Ni-nanopowder/epoxy composites were investigated for self-sensing and actuation. Contact resistance and resistivity were measured using gradient micro-specimens. The actuation of the composites in the electromagnetic field was studied with three wave functions, i.e., sine, triangle and square functions. Due tothe presence of hydrophobic domains on the heterogeneous surface, the static contact angle of Ni-nanopowder/epoxy nanocomposite wasabout $100^{\circ}$, which was rather lower than that for super-hydrophobicity. The dynamic contact angle showed the similar trend of static contact angle. Ni-nanopowder/epoxy composite was responded wellfor both self-sensing and actuation in electromagnetic field due to the intrinsic metal property of Ni-nanopowder. Displacement of the actuator of Ni-nanopowder/epoxy composite was evaluated to obtain the maximum and the optimum performance using laser displacement sensor as functions of the wave type, frequency, and voltage. Actuation of Ni-nanopowder/epoxy composites also increased as functions of applied frequency and voltage. Actuated strain increased more rapidly at sine wave with increasing voltage compared to those of triangle or rectangular waves.

• Journal of the Korean Vacuum Society
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• v.11 no.1
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• pp.43-49
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• 2002

Pd/Ge/Pd/Ti/Au ohmic contact to n-type InGaAs was investigated with rapid thermal annealing conditions. Minimum specific contact resistivity of $1.1\times10^{-6}\Omega\textrm{cm}^2$ was achieved after annealing at $400^{\circ}C$/10sec, and a ohmic performance was degraded at higher annealing temperature due to the chemical reaction between the ohmic contact materials and the InGaAs substrate. However, non-spiking planar interface and relatively good ohmic contact($high-10^{-6};{\Omega}\textrm{cm}^2$) were maintained. This ohmic contact system is expected to be a promising candidate for compound semiconductor devices.

• Journal of Adhesion and Interface
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• v.11 no.4
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• pp.149-154
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• 2010

Interfacial evaluation was investigated for single-carbon fiber/phenolic and carbon nanotube (CNT)-phenolic composites by micromechanical technique and electrical resistance measurement combined with wettability test. Compressive strength of pure phenol and CNT-phenolic composites were compared using Broutman specimen. The contact resistance of CNT-phenolic composites was obtained using a gradient specimen by two and four-point methods. Surface energies and wettability by dynamic contact angle measurement were measured using Wilhelmy plate technique. Since hydrophobic domains are formed as heterogeneous microstructure of CNT in the surface, the dynamic contact angle exhibited more than $90^{\circ}$. CNT-phenolic composites exhibited a higher apparent modulus than neat phenolic case due to better stress transferring effect. Work of adhesion, $W_a$ between single-carbon fiber and CNT-phenolic composites exhibited higher than neat phenolic resin due to the enhanced viscosity by CNT addition. It was consistent with micro-failure patterns in microdroplet test.

• Journal of the Korean Vacuum Society
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• v.12 no.4
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• pp.218-227
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• 2003

Pd/Si/Ti/Pt and Pd/Si/Pd/Ti/Au ohmic contacts to n-type InCaAs were investigated for applications to AlGaAs/GaAs HBT emitter ohmic contacts. In the Pd/Si/Ti/Pt ohmic contact, as-deposited contact showed non-ohmic behavior, and high specific contact resistivity of $5\times10^{-3}\Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $375^{\circ}C$/10 sec. However, the specific contact resistivity decreased remarkably to $2\times10^{-6}\Omega\textrm{cm}^2$ by annealing at $425^{\circ}C$/10sec. In the Pd/Si/Pd/Ti/Au ohmic contact, minimum specific contact resistivity of $3.9\times10^{-7}\Omega\textrm{cm}^2$ was achieved by annealing at $400^{\circ}C$/20sec. In both ohmic contacts, low contact resistivity and non-spiking planar interface between ohmic materials and InGaAs were maintained. Therefore, these thermally stable ohmic contact systems are promising candidates for compound semiconductor devices. RF performance of the AlGaAs/GaAs HBT was also examined by employing the Pd/Si/Ti/Pt and Pd/Si/Pd/Ti/Au systems as emitter ohmic contacts. Cutoff frequencies were 63.9 ㎓ and 74.4 ㎓, respectively, and maximum oscillation frequencies were 50.1 ㎓ and 52.5 ㎓, respectively. It shows very successful high frequency operations.

• Composites Research
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• v.31 no.6
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• pp.412-420
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• 2018

In this work, phenolic resins containing conductive carbon fillers, such as, petroleum coke, carbon black, and graphite, were used to improve the surface heating elements by impregnating a pitch-based carbon paper. The influence of conductive carbon fillers on physicochemical properties of the carbon paper was investigated through electrical resistance measurement and thermal analysis. As a result, the surface resistance and interfacial contact resistivity of the carbon paper were decreased linearly by impregnating the carbon fillers with phenol resins. The increase of carbon filler contents led to the improvement of electrical and thermal conductivity of the carbon paper. Also, the heating characteristics of the surface heating element were examined through the applied voltage of 1~5 V. With the applied voltage, it was confirmed that the surface heating element exhibited a maximum heating characteristic of about $125.01^{\circ}C$(5 V). These results were attributed to the formation of electrical networks by filled micropore between the carbon fibers, which led to the improvement of electrical and thermal properties of the carbon paper.