• Title/Summary/Keyword: 계면전파균열

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Interface Fracture and Crack Propagation in Concrete : Fracture Criteria and Numerical Simulation (콘크리트의 계면 파괴와 균열 전파 : 파괴규준과 수치모의)

  • 이광명
    • Magazine of the Korea Concrete Institute
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    • v.8 no.6
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    • pp.235-243
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    • 1996
  • The mechanical behavior ot concrete is strongly influenced by various scenarios of crack initiation and crack propagation. Recently. the study of the interface fracture and cracking in interfacial regions is emerged as an important field, in the context of the developement of high performance concrete composites. The crack path criterion for elastically homogeneous materials is not valid when the crack advances at an interface because. in this case, the consideration of the relative magnitudes of the fracture toughnesses between the constituent materials and the interface are involved. In this paper, a numerical method is presented to obtain the values of two interfacial fracture parameters such as the energy release rate and the phase angle at the tip of an existing interface crack. Criteria based on energy release rate concepts are suggested for the prediction of crack growth at the interfaces and an hybrid experimental-numerical study is presented on the two-phase beam composite models containing interface cracks to investigate the cracking scenarios in interfacial regions. In general, good agreement between the experimental results and the prediction from the criteria is obtained.

Cracks in Tape Cast Oxide Laminar Composites (테이프 캐스팅 산화물 층상 복합체에서의 균열)

  • Kim, Ji-Hyun;Yang, Tae-Young;Lee, Yoon-Bok;Yoon, Seog-Young;Park, Hong-Chae
    • Journal of the Korean Ceramic Society
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    • v.39 no.5
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    • pp.484-489
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    • 2002
  • Hot-pressure sintered laminar composites with alumina/zirconia or mullite/zirconia as an outer layer and alumina/zircon (resulting in reaction-bonded mullite/zirconia during sintering) as an inner layer were fabricated by tape casting and lamination. Various forms of crack were observed in sintered laminar composites, these cracks included channel cracks in the outer layer, transverse cracks in the inner layer and interface cracks debonding interlayer. Based on detailed microscopic observations, the cracks were attributed to thermal expansion mismatch between the oxides consisting of the each layer. In particular, the interlayer and transverse cracks were confirmed in the laminates consisted of the mullite/zirconia system as the outer layers, however, those cracks were not observed in the alumina/zirconia system used. In addition, the crack propagation did not exhibit same behavior in the two kinds of outer layer when the indentation load was applied.

Boundary Element Analysis for Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착계면의 모서리 균열에 대한 경계요소 해석)

  • 이상순
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.3
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    • pp.25-30
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    • 2001
  • The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

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Effect of Interface Hole Shape on Dynamic Interface Crack Propagation (계면에 존재하는 구멍의 모양이 동적 계면균열전파에 미치는 영향)

  • Yin, Hai-Long;Lee, Ouk-Sub
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.7
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    • pp.1217-1222
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    • 2002
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the hole (existed along the path of the crack propagation) shape on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

Effect of the Stiffness of Ingerface Defect on Dynamic Interface Crack propagation (계면에 존재하는 결함의 강성도가 동적 계면균열전파에 미치는 영향)

  • 이억섭;윤해룡;황시원
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.671-674
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    • 2001
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the stiffness of interface defect(exist along the path of the crack propagation) on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

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Effect of Interface Hole Shape on Dynamic Interface Crack propagation (계면에 존재하는 결함의 모양이 동적 계면균열전파에 미치는 영향)

  • 이억섭;윤해룡;조운기;황시원
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.429-432
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of the interface crack. This paper investigates the effects of the hole (existed along the path of the crack propagation) shape on the dynamic interface crack propagation behavior by comparing the experimental isochromatic fringes to the theoretical stress fields.

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Characteristics for a Mode III Crack Propagating along Interface between Isotropic and Functionally Gradient Material with Linear Property Gradation along X Direction (등방성과 X방향 선형함수구배 재료의 접합계면을 따라 전파하는 모드 III 균열의 특성)

  • Lee Kwang Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.10
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    • pp.1500-1508
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    • 2004
  • Stress and displacement fields for a crack propagating along interface between isotropic material and functionally gradient one with linear property gradation along X direction are developed. The stress and displacement fields are obtained from the complex function of steady plane motion for isotropic and functionally gradient material (FGM). The stresses and displacement in isotropic material of bimaterial are not influenced by nonhomogeneity, however, the fields in FCM are influenced by nonhomogeneity in the terms of higher order, n$\geq$3. When the nonhomogeneous parameter in FGM is zero, or in area close to crack tip, the fields are identical to those of isotropic-isotropic bimaterial. Using these stress components, the effects of nonhomogeneity on stresses are discussed.

Propagation Behavior of the Interface Crack Through a Hole (구멍을 통과하는 계면균열의 전파거동)

  • Lee, Eok-Seop;Yun, Hae-Ryong;Hwang, Si-Won
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.11
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    • pp.2823-2827
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of an interface crack. This paper investigates determined the effects of the hole (exited on the path of the crack propagation) on the crack propagation behavior by comparing the experiment isochromatic fringes to the theoretical stress fields.

Propagation behavior of the interface crack through a hole (구멍을 통과하는 계면균열의 전파거동)

  • Lee, O.S.;Yin, H.L.;Hwang, S.W.;Byun, K.H.
    • Proceedings of the KSME Conference
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    • 2000.04a
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    • pp.127-131
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    • 2000
  • The dynamic photoelasticity with the aid of Cranz-Shardin type high speed camera system is utilized to record the dynamically propagating behavior of an interface crack. This paper investigates determined the effects of the hole (existed on the path of the crack propagation) on the crack propagation behavior by comparing the experiment isochromatic fringes to the theoretical stress fields.

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Dynamic Mode III Crack Propagated with Constant Velocity at Interface Between Isotropic and Orthotropic Material (등방성체와 직교이방성체의 접합계면네 내재된 동적모드 III 균열의 등속전파)

  • Lee, Gwang-Ho;Hwang, Jae-Seok;Yu, Jae-Yong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.12
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    • pp.3828-3837
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    • 1996
  • The dynamic problems of interface crack propagated with constant velocity along the interface of bimateraial composed of isotropic and orthotropicmaterial under antiplane loading condition are studied in this paper. The general dynamic stress fields and displacement fields of mode III are derived when interface crack between isotropic and orthotropic material is propagating with constant velocity. The general dynamic stress fields and displacement fields in isotropic material. Finally, the characteristics of interface crack propagation are studied with various properties of isotropic and orthotropic material and crack propagarion velocities.