• Journal of the Korea Concrete Institute
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• v.14 no.5
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• pp.668-676
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• 2002

Especially, when orthotropic material such as uni-dierectionally woven Carbon Fiber Sheet, resisting only the unidirectional tension, is used to strengthening bridge deck, the direction and width of the strengthening material should be considered very carefully. Thus, analysis of the failure characteristics and the premature failure mechanism of the strengthened decks based on the test results are required. In this study, the premature failure due to the interface debonding of strengthening material of the strengthened deck slab are inquired into failure mechanism through both experiments results and analyses with prototype strengthened deck specimens using carbon fiber sheet. From the test results, interface debonding of strengthening material is occured at the crack face

• Magazine of the Korea Concrete Institute
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• v.11 no.2
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• pp.177-186
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• 1999

The purpose of this study is to analyze the interface debonding of RC beams strengthened by carbon fiber sheet(CFS). The behavior of damaged RC beams strengthened with CFS is analytically investigated next using linear elastic fracture mechanics(LEFM) approach and the finite element method. The study includes an investigation of the separation mode by interface fracture of the strengthening materials due to the interfacial shear and normal stresses. The numerical method is presented to obtain the value of interfacial fracture parameter such as the strain energy release rate. Based on the results of this study, it is found that the critical case occurs when the interfacial cracks occur within a short region of the flexural crack. The CFS strengthening has not an adequate factor of safety against interfacial debonding of CFS. Furthermore, for the thicknesses of the adhesive studied[1mm~3mm], it is no noticeable effect on the strain energy release rate.

• Proceedings of the Korean Fiber Society Conference
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• 2002.04a
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• pp.489-492
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• 2002

고분자/금속 복합재료는 현대 전자산업에 중요한 역할을 하고 있다. 그러나 이들간의 계면은 고분자의 수축 또는 계면 안정성의 저하로 인하여 박리가 일어나게 된다. 즉, 계면의 접합이 떨어지게 되면 전기 화학적인 반응이 계면에서 발생하여 드러난 금속부위는 산화되고 산소가 환원될 때 발생하는 OH기와 같은 라디칼들에 의해 금속과 고분자 사이의 결합이 파괴되어 금속표면으로부터의 고분자의 박리가 발생한다. (중략)

• Journal of Adhesion and Interface
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• v.10 no.4
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• pp.182-190
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• 2009

In this work, effect of antistrip additives to reduce moisture damage of asphalt mixture were studied. Asphalt antistripping agents were prepared by condensation of formaldehyde with tetraethylene pentamine (TEPA), triethylenetetramine (TETA) and bis(hexamethylene)-triamine (BHMT), respectively. And also the metal type antistripping agent was prepatred by neutralization of stearic acid or palmitic acid with metal hydroxide. Mechanical characteristics of the asphalt mixture added antistripping agent were evaluated with Marshall stability, submerging residuals and coating rate. It was found that antistripping agent prepared in this study reduced moisture damages of asphalt mixtures. In particular, asphalt mixtures added BHMT and C/S (Calcium stearate hydroxide) antistripping agent showed highest submerging and coating rate. Because BHMT and C/S type antistripping agent was to improve bonding between asphalt and aggregate owing to increase of amine concentration and role of metal surfactant.

• Korean Journal of Materials Research
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• v.8 no.1
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• pp.45-51
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• 1998

Ti-45at%AI-1.6at%Mn 조성을 갖는 금속간화합물의 장시간 및 반복산화 거동을조사하기 위하여 반응소결법 및 플라즈마 아크 용해법으로 제조한 시편에 대하여 80$0^{\circ}C$에서는 반응소결재와 용제재 모두 등온 및 반복산화에 대하여 우수한 저항성을 나타내었다. 90$0^{\circ}C$에서는 반응소결재의 경우에는 등온 및 반복산화에 대하여 우수한 저항성을 보였으며, 중량변화와 산화피막의 박리는 극히 적었다. 이에 비해 용제재의 경우에는 등온 및 반복산화에 의해 중향이 크게 변하였으며 피막의 박리도 극심하였다. 90$0^{\circ}C$에 있어서 두 재료간의 이러한 산화거동 차이는 기지/산화물 계면 부근에 형성된 산화층의 차이에 기인하는 것으로 간주하였다. 반응소결재의 경우에는 계면 부근에 연속적인 AO$_{3}$O$_{3}$층이 형성되며, 이러한 층이 산화에 대한 보호막으로 작용하는데 비하여 용제재에 있어서는 계면 부근에 AO$_{3}$O$_{3}$와 TiO$_{2}$의 혼합층이 형성되었다. 용제재의 반복산화시에 보여진 피막의 박리는 냉각시에 TiO$_{2}$와 기지간의 열팽창계수 차이에 기인하여 발생하는 열응력을 TiO$_{2}$가 견디지 못하고 박리를 초래한 것으로 해석하였다.

• Journal of Conservation Science
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• v.25 no.2
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• pp.171-178
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• 2009

When we considered the superior ability of the semi-water soluble urethane 1st transcription and final epoxy products, the stability for moving historic sites depend on physical properties and the peel off state of separation media. In this paper, we synthesised three type of water-borne epoxy solution without using a surfactant, and investigated the peel off state, physical properties, and the state between urethane surface and epoxy surface after exfoliation. The life time of water-borne separation media is over the 60 days. When it is used the 30% solution of water-borne separation media, it made good separation of urethane pre-products surface and epoxy final product surface and no color change. The separation tension pressure is about 15~50 kg/$cm^2$ and there is no surface whitewash phenomenon. We suggest that this water-borne epoxy will be best material as separation media of low viscosity type.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.4
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• pp.413-420
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• 2012

An aluminum foil-laminated sheet is a laminated steel sheet on which aluminum foil is adhesively bonded. It is usually used on the outer panel of home appliances to provide an aluminum feeling and appearance on the surface of the product. The delamination of aluminum foil is one of the main problems during the stretch forming process. The purpose of this study is was to determine the delamination limit of an aluminum foil-laminated sheet in the stretch forming process. The delamination was dependent on the bonding strength between aluminum foil and steel sheet. The fracture behavior of the interface between the aluminum foil and the steel sheet was described by a cohesive zone model. A finite element was conducted with the cohesive zone model to analyze the relationship between the delamination limit and the bonding strength of the interface. The interface bonding strength was evaluated by lap shear and T-peel test. The delamination limit of the aluminum foil-laminated sheet was determined by using the bonding strength of the steel sheet. The delamination limit was also verified by the Erichsen test.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.43-48
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• 2022

Effect of temperature/humidity (T/H) treatment conditions on the peel strength of screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90° peel test. Initial peel strength was 25.99±1.47 gf/mm, and then decreased to 6.05±0.54 gf/mm after 500 h at 85℃/85% relative humidity T/H condition. And, the peeled locus was changed from Ag/PI interface to shallow cohesive inside PI near interface. X-ray photoelectron spectroscopy analysis on the peeled surfaces showed that the long-term moisture penetration into the Ag/PI interface during T/H treatment led to hydrolytic degradation of PI to form weak boundary layer inside PI near Ag/PI interface, which are responsible for large decrease in peel strength.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.37-42
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• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.34 no.4
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• pp.317-323
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• 2008

Some surfactants known as biosurfactants, are produced biologically by yeast and bacteria from various substances. They are more effective and environmentally friendly than many other synthetic surfactants. Antimicrobial activities of sophorolipids produced by Candida bombiocola were investigated against various microorganisms. Minimal Inhibitory concentration (MIC) of sophorolipid against S. mutans, C. xerosis, and P. acnes were 0.005, 0.05, and 0.005%, respectively. The antimicrobiological activities were more effective than those of SLS and APG. Skin exfoliating and moisturizing effects of vehicles with the sophorolipids were tested. The skin turnover time of aqueous solution with 0.25% sophorolipids was similar to that of aqueous solution with 5.0% lactic acid. Higher moisturizing effects on skin showed as the concentration of sophorolipids increased. We suggest that the sophorolipids can be used for cosmetics as an antimicrobiological agent and an active materials of skin moisturizing and exfoliating.