• Polymer(Korea)
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• v.25 no.4
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• pp.512-520
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• 2001

One of the most important factors which affect the mechanical properties of fiber-reinforced composite materials is the interfacial shear strength (IFSS). The IFSS of glass fiber and polycarbonate (PC)/styrene-co-acrylonitrile (SAN) blend system has been measured by the single fiber fragmentation test (SFFT). SAN contents were varied up to 30 wt% and the IFSS increased with the SAN contents. Styrene-co-maleic anhydride (SMA) was used as the compatibilizer and the glass fiber was surface treated with organosilane coupling agents. Addition of small amount of SMA in PC/SAN blend improved the IFSS by chemical bonding between maleic anhydride and silanol. The optimum MA content was 0.4 wt% of total matrix contents. Also, IFSS was greatly affected by the miscibility condition of SAN/SMA blends, which depended on the copolymer composition of SAN and SMA. It was found out that, higher IFSS could be obtained when the SAN/SMA blend was in miscible pairs. In case of SAN/SMA miscible pairs, the IFSS depended on the MA content in total matrix, not on the MA content in SMA.

• Composites Research
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• v.31 no.6
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• pp.299-303
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• 2018

In order to improve the interfacial bonding force and reaction polymerization degree of the carbon fiber reinforced nylon 6 composite material, the surface of the existing epoxy-sizing carbon fiber was desized to remove the epoxy and treated with urethane, nylon and phenoxy sizing agent, was observed. The interfacial bond strength of the resized carbon fiber was confirmed by IFSS (Interfacial Shear Strength) and the fracture surface was observed by scanning electron microscope. The results showed that the interfacial bonding strength of the carbon fiber treated with nylon and phenoxy sizing agents was higher than that of urethane - based sizing. It has been found that the urethane - type resizing carbon fiber has lower interfacial bonding strength than the conventional epoxy - sizing carbon fiber. This result shows that the interfacial bonding between carbon fiber and nylon 6 is improved by removing low activity and smoothness of existing carbon fiber.

• Proceedings of the KAIS Fall Conference
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• 2012.05a
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• pp.448-451
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• 2012

본 연구에서 matrix간의 계면 결합력을 불리하게 작용하는 Wax성분이나 Lignin, Hemi-Cellulose등의 제거를 위해 화학적 개질방법중인 NaOH, Acetic acid, Silane으로 처리하여 기질 고분자의 계면의 영향을 알아보고 SEM을 이용하여 형태학적 변화와 열적특성 변화를 관찰하였다. 형태학적 변화에서는 NaOH, Acetic acid 처리보다 Silane처리가 계면결합력이 증가하여 기계적 물성이 증가되었다는 것을 볼수 있었고, 열분석에서는 NaOH, Acetic acid, Silanec 처리가 유사하게 나타났지만, 복합재를 전처리하지 않은것보다 기질고분자와 천연섬유간의 계면 결합은 전처리하는 것이 결합에 있어서 좋다는 결과를 확인하였다.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.215-217
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• 2007

철계 피삭재 가공 시 적용되는 cBN(cubic Boron-Nitride)의 경우 열적/구조적 안정성으로 인해 융착 시 계면에서 화학적 결합이 어려워, 지립이 단일층으로 형성되어야 하는 융착 공구의 경우 적용되질 못하고 있다. 이러한 문제를 해결하기 위해 세라믹과의 젖음성이 우수한 Ti 성분이 포함된 67Ag+28Cu+5Ti(wt.%) 조성의 합금분말을 이용하여 cBN을 접합을 하였으며, 이때 융착조건은 진공 분위기($6{\times}10^{-6}$Torr), $900^{\circ}C$ 온도에서 5분간 유지하여 융착을 실시하였다. 본 연구의 주목적은 Ti 합금화 된 Ag계 합금분말 및 cBN의 융착 계면에서의 융착 계면거동해석을 통한 건전한 접합공정을 찾는데 있다. 이에 온도 $900^{\circ}C$, 유지시간 5분에서 건전한 융착층을 형성함을 알 수 있었다. 또한 결합력 측정기를 이용하여 결합력을 측정한 결과 diamond와 융착하였을 때가 123N, cBN을 융착하였을 때 107N으로써, cBN 융착이 diamond 융착의 87%정도의 결합력을 보임을 알 수 있었다. 한편 cBN과 Ag-Cu-Ti계 브레이징 필러의 계면에서의 미세조직 및 화학반응의 메커니즘은 SEM, EDS를 이용하여 분석하였다.

• Journal of the Korean Vacuum Society
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• v.2 no.3
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• pp.374-383
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• 1993

필라멘트와 Si 기판 사이의 기전력을 20, 80, 140, 200V로 증가시키면서 EACVD에 의하여 성장된 다이아몬드 박막에 대하여 다이아몬드/Si 계면분석 및 계면강도를 측정하였다. 주사형전자현미경(SEM), 고분해능투과형전자현미경(HRTEM), 오제이전자분석기(AES)에 의해 계면상태를 분석한 결과, 기전력 증가에 따라 활성탄화수소 이온(CmHn-)에너지가 증가되어져 CmHn-이 Siso로 침투(Impringement)가 증가되고 침투된 높은 에너지의 CmHn-이 Si과 화학결합하여 생성되는 SiC층 깊이 및 농도 분포도 증가된다. 풀 시험(Pull test)에 의한 계면강도 측정 결과, SiC층 깊이 및 농도분포가 증가할수록 계면강도가 증가하였다. 관찰된 파면과 파면의 X-선 메핑 결과 및 HRTEM과 AES에 의한 분석 결과, 기전력 증가에 따라 공극율이 적고 치밀한 다이아몬드 박막이 성장된다. 그리고 생성되는 SiC층 농도 및 깊이 분포가 증가함에 따라 다이아몬드/Si 계면이 강화되고, 상대적으로 파괴는 다이아몬드/Si 계면이 아닌 SiC층이나 Si 내부에서 발생된다. 결국, 기전력을 증가하여 활성탄화수소이온의 에너지를 증가함으로써 계면강도가 우수하며 공극율이 매우 적고 치밀한 다이아몬드 박막을 성장할 수 있다.

• Proceedings of the Korean Fiber Society Conference
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• 1992.06b
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• pp.34-34
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• 1992

• Journal of Adhesion and Interface
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• v.13 no.3
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• pp.137-144
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• 2012

Chemical functionalization of carbon nanomaterials (CNMs) is generally carried out for increasing interfacial adhesion between filler and polymer matrix for CNM-polymer nanocomposites. The chemically functionalized CNTs can produce strong interfacial bonds with many polymers, allowing CNT based nanocomposites to possess high mechanical and functional properties. Hence, increased surface adhesion can be measured indirectly by observing increased mechanical properties. However, there is a more direct way to observe interfacial bonds between polymer and CNM by measuring piezoresistivity behavior so that we can imagine the behavior of CNM particles in polymer matrix under deflection. Fuctionalization of MWCNT and rGO was carried out by oxidization reaction of MWCNT and rGO with $H_2SO_4/HNO_3$ solution. Electrical resistivities of MWCNT-PMMA and rGO-PMMA composites were decreased after functionalization because of the destructive fuctionalization process. Meanwhile, piezoresistivities of functionalized CNM-PMMA composites showed more sensitive behavior under the same deflection as compared to pristine CNM-PMMA composites. Therefore, mobility of CNM in polymer matrix was found to be improved with chemical functionalization.

• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.479-486
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• 2007

Four point bending is used to study the dependences of bond strength of benzocyclobutene(BCB) bonded wafers and BCB thickness, the use of an adhesion promoter, and the materials being bonded. The bond strength depends linearly on BCB thickness, due to the thickness-dependent contribution of the plastic dissipation energy of the BCB and thickness independence of BCB yield strength. The bond strength increases by about a factor of two with an adhesion promoter for both $2.6{\mu}m$ and $0.4{\mu}m$ thick BCB, because of the formation of covalent bonds between adhesion promoter and the surface of the bonded materials. The bond strength at the interface between a silicon wafer with deposited oxide and BCB is about a factor of three higher than that at the interface between a glass wafer and BCB. This difference in bond strength is attributed to the difference in Si-O bond density at the interfaces. At the interfaces between plasma enhanced chemical vapor deposited (PECVD) oxide coated silicon wafers and BCB, and between thermally grown oxide on silicon wafers and BCB, 12~13 and $15{\sim}16bonds/nm^2$ need to be broken. This corresponds to the observed bond energies, $G_0s$, of 18 and $22J/m^2$, respectively. Maximum 7~8 Si-O $bonds/nm^2$ are needed to explain the $5J/m^2$ at the interfaces between glass wafers and BCB.

• Polymer(Korea)
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• v.24 no.4
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• pp.556-563
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• 2000

In general, the development of thermoplastic composites has been confronted with difficult problems such as the weak bonding strength between fibers and matrix. However, now, such problems are being surmounted by the development of resins, the improvement of processes, and introduction of interphase. Especially, the introduction of interphase between fiber and matrix can help a dissipation of the impact energy and provide a good adhesion between fibers and matrix. In this study, polymeric interphase was introduced by electrodeposition, modified polypropylene was added to improve the weak bonding strength between interphase and polypropylene matrix. By evaluation of interlaminar shear strength and impact strength of the composites, it was found that composites with introduced composites showed higher mechanical properties than those of composites without interphase. Reactive polymers which have either anhydride or free acid functional group were used as interphase materials, and these polymers also behave as charge carrier in aqueous solution during the electrodeposition process. Weight gain on the carbon fibers was evaluated by changing process parameters such as concentration of solution, current density, and electrodeposition time.

• Composites Research
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• v.33 no.5
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• pp.282-287
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• 2020

In the present study, a high-strength polyethylene terephthalate (PET) sheet was fabricated through a densification process of low melting PET fiber (LMF) combined PET sheet. During the thermal heat treatment process of the combined LMF, individual PET fiber was connected, which in turn leads to the improvement of the interfacial bonding force between the fibers. Also, the densification of the PET sheet leads to reduce macrospore density and in return could enhance the binding force between the overlapped PET networks. Consequently, the asprepared LMF-PET sheet showed about 410% improved tensile strength and the same elongation compared to before compression. Besides, the enhanced bonding force can prevent the shrinkage of the PET fiber network and exhibited excellent dimensional stability.