• Korean Journal of Materials Research
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• v.3 no.2
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• pp.145-150
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• 1993

Abstract In order to improve the brittleness of diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA) system, the reactive additive, succinonitrile(SN) was added to DGEBA/MDA system. In this case, thermal properties, glass transition temperature(Tg), thermal decomposition temperature(Td) and 5% weight loss temperature($T_{-5%}$)were investigated according to the different SN contents and cure temperatures. Tg, Td and $T_{-5%}$ decreased as the SN content was increased, but increased as the cure temperature was increased.

• Journal of Adhesion and Interface
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• v.7 no.1
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• pp.16-22
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• 2006

In this work, the effect of cure temperature and time on the thermal stability and the exothermic cure reaction peak of a waterborne resol-type phenol-formaldehyde resin, which may be used for preparing phenolic sheet molding compounds (SMC), has been investigated using a thermogravimetric analyzer and a differential scanning calorimeter. The weight loss of waterborne phenol-formaldehyde resin was mainly occurred at three temperature stages: near $200^{\circ}C,\;400^{\circ}C$, and $500^{\circ}C$. The carbon yield at $750^{\circ}C$ for the cured resin was about 62%~65%. Their thermal stability increased with increasing cure temperature and time. Upon cure, the exothermic reaction was taken placed in the range of $120^{\circ}C{\sim}190^{\circ}C$ and the maximum peak was found in between $165^{\circ}C$ and $170^{\circ}C$. The shape and the maximum of the exothermic curves depended on the given cure temperature and time. To remove $H_2O$ and volatile components, the uncured resin needed a heat-treatment at $100^{\circ}C$ for 60 min at least prior to cure or molding. Curing at $130^{\circ}C$ for 120 min made the exothermic peak of waterborne phenol-formaldehyde resin completely disappeared. And, post-curing at $180^{\circ}C$ for 60 min further improved the thermal stability of the cured resin.

• Applied Chemistry for Engineering
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• v.9 no.1
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• pp.58-65
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• 1998

Substituted dicyandiamide(Sub-DICY), Accelerated dicyandiamide(Acc-DICY), Trimellitic anhydride(TMA), Pyromellitic dianhydride(PMDA) and Phenolic curing agent(Ph.C.A.) are mainly used for epoxy powder coating curing agent. Various characteristics of epoxy films fully cured by optimum condition such as mechanical properties like $T_g$, tensile strength, elongation at break hardness, abrasion resistance and chemical properties like water absorption, acid resistance, alkali resistance and electrical properties, corrosion resistance are determined by various measuring devices and analyses devices. In conclusion, phenolic curing agent was shown excellent thoughness but severe color change as temperature increased. Acid anhydride has excellent insulation properties and color stability at elevated temperature but lower thoughness and adhesion to substrate. DICY curing agent was shown high water absorption and severe color chance as temperature increased.

• Elastomers and Composites
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• v.43 no.3
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• pp.147-156
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• 2008

In this work, epoxy/carboxyl-terminated butadiene acrylonitirile (EP/CTBN) composites were prepared by employing a reinforcing filler, silica treated with silane coupling agent in different ratio by dry and wet method. Their curing characteristics, surface free energy, interface morphologies and mechanical properties such as tensile strength and impact resistance were carefully investigated. Differential scanning calorimetry(DSC) results showed that curing temperature was lowered with the increase of silane coupling agent because of the increase of relative curing agent cotent by filling the pores of silica. Wet method was proved to be more effective for lowering curing temperature of EP/CTBN composite. In general, surface free energy and impact resistance were increased with the increase of silane coupling agent in this work. Tensile strength, however, was observed to be decreased at 4 wt% of silane coupling agent. It was found that the dry method was proved to be preferable for pretreatment of silica with coupling agent.

• International Journal of Highway Engineering
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• v.8 no.1 s.27
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• pp.45-54
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• 2006

The Construction policy of government ever since 1970s have brought the economical growth, but has been causing environmental problems. Most roads were paved either asphalt concrete or portland cement concrete. These types of pavements has caused to rise temperature by making local heat islands in urban during summer time. Recently the wet-mixing solidified soil pavement, a kind of soil-cement, has developed and has been applied to the environment-oriented pavement. The solidified soil wet-mixed is placed on the subgrade along with asphalt concrete and portland cement concrete. Thermistors are laid in these field test pavements. The temperature gradients of these pavements are automatically measured with time. As the results of this test, the equation estimating surface temperature of pavement is proposed by analyzing measured temperature data. It is shown that the temperature change within the surface layer due to the change of air temperature is the greatest in the asphalt mixture and the least in the solidified soil mixture. Since it is proven that this wet-mixing solidified soil pavement emit less radiant heat than other existed pavements. Therefore this type of pavement can be successfully applied to the roads, such as walks, parkways, and bikeways, which are required to be human-friendly and environment-oriented.

• Journal of the Korean Vacuum Society
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• v.7 no.3
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• pp.229-236
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• 1998

In this paper, thin films of Polyimide (PI) were fabricated by vapor deposition polymerization method (VDPM) of dry processes. The film's properties with curing temperature and electrical properties were studies. The synthesis of hexafluoroisopropyliden-2,2-bis[phthalic anhydride](6FDA) and 4, 4'-diamino diphenyl ether (DDE) was carried out by vapor deposition polymerization(VDP) with the same deposition rate. The evaporation temperature of 6FDA and DDE were $214^{\circ}C$ and $137^{\circ}C$, respectively, so as to preserve balance of stoichiometry. The polymic acid (PAA) made by VDPM were changed to PI by thermal curing. The uniformity and density of PI thin films were increased according to increasing curing temperature. The relative permittivity and dissipation loss factor were 3.7 and 0.008 at the frequency of 100Hz~200KHz, respectively, for the fabricated in the curing temperature of $300^{\circ}C$. Also, the resistivity was about 1.05$\times$$ 10^{15}$$\Omega$cm at $30^{\circ}C$.

• Composites Research
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• v.14 no.2
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• pp.33-42
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• 2001

The cure kinetic equation fur 52-glass/polyester prepreg composites was established through DSC (differential scanning calorimetry). Using the established kinetic equation, the temperature distribution of the thick composite was calculated considering the change of heat transfer resistance due to resin impregnation of bleeder plies used. In order to reduce the overheat during cure of thick glass fiber composites, the cure cycle was modified by introducing the cooling and reheating steps. Then the thick glass composites were cured both by the conventional cycle without any cooling or reheating step and the modified cure cycle. The mechanical properties of the thick composites cured by the both cycles were tested by the short beam shear test and the Barcol hardness test, and then their results were compared.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.30 no.6
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• pp.39-45
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• 2002

In this paper, a finite element formulation was introduced for the three-dimensional cure simulation of composite structures. Based on the formulation, a three-dimensional finite element code was developed. Numerical examples found in the literatures were solved for code verification. Results from the present analyses agreed well with the measured cure-induced temperatures. Unlike in one or two dimensional analysis, temperature and degree of cure were able to be calculated at any point within composite structures in the present analysis. The finite element program can be used for the cure simulation of composite structures with arbitrary geometry under non-uniform autoclave temperature distribution.

• Journal of Adhesion and Interface
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• v.17 no.2
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• pp.62-66
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• 2016

The curing processes of waterborne adhesives are in general undergone by using hot-air dryer. The hot-air dryer curing the adhesives with heat has a disadvantage of requiring high temperature over $100^{\circ}C$ as well as curing time as long as 20 min. When it comes to the heat control, high temperature open disturbs the adhesion of substrates by extremely lowering the viscosity of the adhesives. Furthermore, the humidity resulting from the drying process makes the curing condition irregularly. In this report, dehumidifying membrane dryer was used in order to keep the curing process same by removing humidity caused by the evaporation of water during the drying process, and to shorten the curing time. Here, we compared the peel strength of attached substrates in the dehumidifying membrane dryer to find out appropriate curing condition and confirm the effects of the dehumidifying membrane.

• Korean Chemical Engineering Research
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• v.40 no.6
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• pp.681-686
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• 2002

In the industrial field, the theory of drying process is different from the practical application, and it is effective to reduce energy by recirculation of the heat of exhausting gas. But the study of this field may not be performed still. The cure properties of the urea resin moulding compounds was investigated according to drying temperature, drying time, recycle rate of exhausting gas and moulding temperature in the process of drying and moulding. We obtained the following results; water content of material decreases with increasing drying time and drying temperature, and the rate of drying also decreases with increasing recycle rate of exhausting gas. Specially, The cure fluidity of the urea resin moulding compounds decreases, with increasing drying temperature, recycle rate of exhausting gas and moulding temperature. And the correlation equations on water content and cure fluidity of the urea resin moulding material were obtained through a regression analysis of experimental data.