Browse > Article
http://dx.doi.org/10.17702/jai.2016.17.2.62

The Effects of the Dehumidifying Membrane Dryer for the Curing Processes of Waterborne Adhesives  

Yu, Seoyoon (Center for Chemical Industry Development, Korea Research Institute of Chemical Technology)
Lim, Choong-Sun (Center for Chemical Industry Development, Korea Research Institute of Chemical Technology)
Seo, Bongkuk (Center for Chemical Industry Development, Korea Research Institute of Chemical Technology)
Publication Information
Journal of Adhesion and Interface / v.17, no.2, 2016 , pp. 62-66 More about this Journal
Abstract
The curing processes of waterborne adhesives are in general undergone by using hot-air dryer. The hot-air dryer curing the adhesives with heat has a disadvantage of requiring high temperature over $100^{\circ}C$ as well as curing time as long as 20 min. When it comes to the heat control, high temperature open disturbs the adhesion of substrates by extremely lowering the viscosity of the adhesives. Furthermore, the humidity resulting from the drying process makes the curing condition irregularly. In this report, dehumidifying membrane dryer was used in order to keep the curing process same by removing humidity caused by the evaporation of water during the drying process, and to shorten the curing time. Here, we compared the peel strength of attached substrates in the dehumidifying membrane dryer to find out appropriate curing condition and confirm the effects of the dehumidifying membrane.
Keywords
Waterborne adhesive; Curing condition; Membrane dryer; Peel strength;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
1 I. Svab, V. Musil, and M. Leskovac, Acta Chimica Slovenica, 52, 264 (2005).
2 G. Tao, A. Gong, J. Lu, H. J. Sue, and D. E. Bergbreiter, Macromolecules, 34, 7672 (2001).   DOI
3 J. I. Weon and K. Y. Choi, Macromolecular Research, 17, 886 (2009).   DOI
4 M. Barczewski, D. Matykiewicz, and J. Andrzejewski, Macromolecular Research, 23, 850 (2015).   DOI
5 B. Goss, "Practical Guide to Adhesive Bonding of small Engineering Plastic and Rubber Parts", Smithers Rapra Technology, U.K. (2010).
6 J. Balart, V. Fombuena, J. M. Espana, L. Sanchez, and R. Balart, Materials & Design, 33, 1 (2012).   DOI
7 N. Micheal, D. Jost, S. Slike, and L. Uwe, International Journal of Adhesion and Adhesives, 24, 171 (2004).   DOI
8 M. D. Green, F. J. Guild, and R. D. Adams, International Journal of Adhesion and Adhesives, 22, 81 (2002).   DOI
9 E. Tomasetti, D. Daoust, R. Legras, P. Bertrand, and P. G. Rouxhet, Journal of Adhesion Science and Technology, 15, 1589 (2001).   DOI
10 H. Tang and D. C. Martin, Journal of Materials Science, 37, 4783 (2002).   DOI
11 E. Dayss, G. Leps, and J. Meinhardt, Surface and Coatings Technology, 986, 116 (1999).
12 A. Firas, G. Michael, K. Georgina, F. Bronwyn, and J. P. Paul, Progress in Polymer Science, 34, 948 (2009).   DOI
13 G. S. Choi, D. J. Kim, G. Y. Lee, and T. W. Lee, Korea Patent 1390119 (2014).
14 J. H. Chun, J. M. Chun, B. Y. Jung, and J. S. Yoo, Korea Patent 1108539 (2012).
15 I. C. Jin, Korea Patent 2008-0015698 (2008).
16 Y. M. Choi, H. S. Choi, S. W. Jang, J. Y. Jung, and H. T. Kim, Korea Patent 0575043 (2006).
17 H. S. Kim, B. K. Seo, H. M. Yu, Y. J. Choi, and S. J. Jeong, Korea Patent 1388081 (2014).
18 S. J. Paul, M. Leach, F. A. Rueggeberg, and D. H. Pashley, Journal of Dentistry, 27, 209 (1999).   DOI
19 T. Jacobsen and K. J. Soderholm, Dental Materials, 11, 132 (1995).   DOI
20 M. Miyazaki, J. A. Platt, H. Onose, and B. K. Moore, Operative Dentistry, 21, 167 (1996).
21 M. Miyazaki, N. Hirohata, K. Takagaki, H. Onose, and B. K. Moore, Journal of Dentistry, 27, 203 (1999).   DOI
22 J. H. Choi, and M. C. Lee, Journal of Adhesion and Interface, 14(2), 88 (2013).   DOI
23 S. H. Lee, J. M. Cheon, B. Y. Jeong, H. D. Kim, and J. H. Cheon, Journal of Adhesion and Interface, 16(4), 156 (2015).   DOI