• Journal of the Korean Magnetics Society
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• v.12 no.1
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• pp.20-23
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• 2002

The local coercivity distribution of CoCrPt alloy films prepared by dc magnetron sputtering has been investigated by means of a magneto-optical microscope magnetometer (MOMM) capable of simultaneously measuring the local properties on 400 nm spatial resolutions. Serial samples of CoCrPt alloy films were prepared with the Pt composition of a range from 6 to 28 at. %. We find that the local coercivity distribution crosses over from Gaussian to non-Gaussian distribution in CoCrPt alloy films with increasing Pt composition, with increasing trends in the width of the distribution as well as the average local coercivity. Transmission electron microscopy (TEM) studies reveal that our findings are closely correlated with the dependences of the grain size distribution and its average size on Pt concentration.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2009.06a
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• pp.285-286
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• 2009

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.129-131
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• 2005

• Journal of the Korean Magnetics Society
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• v.7 no.4
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• pp.205-211
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• 1997

The magnetic properties change which was induced by addition of small amount of Ni into Cr underlayer in CoCrTa/ CrNi thin film deposited by electron beam evaporator was investigated. The additional Ni element was found to be beneficial for incease in the coercivity of the thin film deposited at the room temperature. The origin of coercivity increase was elucidated by crystal orientation and microstructure investigation using XRD and AFM respectively. It was found that the grain size were increased by Ni addition. The coercivity of the film with CrNi underlayer is lower than that of film with Cr underlayer when prepared with higher substrate temperature. This result may be originated with the increase in grain size. When film was deposited at 280 $^{\circ}C$ substrate temperature, Cr segregation in grain boundary is found to be the other factor for determining coercivity value.

• Journal of the Korean Electrochemical Society
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• v.14 no.3
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• pp.163-170
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• 2011

Nanocrystalline Ni thin films were electodeposited from chloride baths to investigate the influences of additive concentration, current density and solution pH on residual (or internal) stress, surface morphology, and microstructure of the films. It was observed that residual stress in Ni thin film was changed from tensile stress mode (about 150 MPa) to compressive stress mode (about -100 MPa) with increasing saccharin concentration as an additive. Microstructure of Ni thin films was changed with/without saccharin in baths. Ni thin films electrodeposited from saccharinfree bath mainly consisted of both FCC(111) and FCC(200) phases. However, Ni thin film electrodeposited from the baths containing saccharin exhibited FCC(111), FCC(200) and FCC (311) phases [sometimes, FCC (220)]. Current density influenced residual stress of Ni thin films. It was measured to be the lowest compressive stress value (about-100 MPa) in range of current density of $2.5\sim10mA{\cdot}cm^{-2}$. Solution pH also influenced residual stress of Ni thin film. Addition of saccharin in baths affected grain size of Ni thin films. Grain sizes of Ni thin films were measured to be about 60 nm without saccharin and 24~38 nm with more than 0.0005M saccharin concentration. Surface of Ni thin films was changed from nodular to smooth surface morphology with addition of saccharin.

• Proceedings of the Korean Nuclear Society Conference
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• 1996.11b
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• pp.539-544
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• 1996

핵연료 피복관용 신합금으로 개발되고 있는 여러 가지 Zr합금에서 생성되는 석출물의 특성을 규명하기 위하여 EDX가 부착된 TEM을 이용하여 석출물에 관한 연구를 수행하였다. Zrl.4Sn0.2Fe0.1Cr 합금에서는 두 종류의 석출물이 생성되는데 하나는 석출물의 대부분을 차지하는 HCP 구조의 Zr(Cr,Fe)$_2$ 석출물로서 이는 둥근 형태를 유지하며 결정립내나 결정립계에 관계없이 널리 분산되어 분포된다. 다른 하나의 석출물은 극히 일부에서만 관찰되는 Zr$_2$(Fe,Si)성분의 석출물로서 이는 tetragonal 구조를 갖는다. Zr0.5Nb0.6Fe0.3V 합금에서는 tetragonal (Zr,Nb)$_2$(Fe,V)석출물이 형성되며, Nb이 1.0 wt.% 첨가된 Zr1.0Nb0.6Fe0.3V 합금에서는 HCP 구조의 (Zr,Nb)(Fe,V)$_2$ 석출물과 BCC 구조인 $\beta$-Zr이 생성된다. Zr1.0Nb0.6Fe0.3V 합금을 제외하고는 대부분의 합금에서 석출물은 약 1.0 $\mu$m의 크기를 나타냈다. 합금 조성이 다를 경우에 석출물 크기와 35$0^{\circ}C$ 부식 특성과는 연관성이 없는 것으로 나타났다.

• Korean Journal of Materials Research
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• v.7 no.9
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• pp.723-727
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• 1997

Nd치환이 Ag의 용융점 이하인 94$0^{\circ}C$에서 소결한 $Bi_{1-x}$$Nd_{x}$N$bO_{4}$세라믹스의 소결거동과 마이크로파 유전특성에 미치는 영향을 연구하였다. Nd치환량(x)이 증가함에 따라 사방점에서 삼사정으로 변하는 양이 증가하였고 결정립의 크기, 겉보기밀도, 유전상수는 감소하였다. Q$xf_{0}$값은 Nd 치환량이 0.025mole 이하의 경우 큰 변화가 없으나, 그 이상에서는 증가하여 0.1mol일 때 최고값을 보이고 다시 급격히 감소하였다. TCF값은 Nd치환량이 증가할수록(+)방향으로 증가하였다. 가장 우수한 마이크로파 유전특성은 Nd 치환량이 0.025mole일 때 얻어졌으며, 이때 유전상수는 43.7, Qxf/ sub 0/값은 11,046GHz, TCF값은 -1.82ppm/$^{\circ}C$이었다.

• Journal of Welding and Joining
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• v.24 no.1
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• pp.77-87
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• 2006

Considering ferrite grain size in the base metal, the prediction model for $A_{c3}$ temperature and prior austenite grain size at just above $A_{c3}$ temperature was proposed. In order to predict $A_{c3}$ temperature, the Avrami equation was modified with the variation of ferrite grain size, and its kinetic parameters were measured from non-isothermal data during continuous heating. From calculation using a proposed model, $A_{c3}$ temperatures increased with increasing ferrite grain size and heating rate. Meanwhile, by converting the phase transformation kinetic model that predicts the ferrite grain size from austenite grain size during cooling, a prediction model for prior austenite grain size at just above the $A_{c3}$ temperature during heating was developed.

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.8
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• pp.1068-1073
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• 2010

A welding neck flange is widely used for an interconnection between pipes. It is produced by a hot forging process, and required high yield strength under the high pressure condition, like a deep-sea. Generally, to increase yield strength, a increasing of carbon content is used, however a carbon content of welding neck flange is limited to 0.47. So, in this study, a strengthening by grain refinement without changing carbon content is used to increase yield strength. Taguchi method and FEM are used for the optimization of forging process and the experiment for the yield strength of the prototype with the optimal forging process is performed for validity.

• Applied Microscopy
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• v.29 no.3
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• pp.265-274
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• 1999

The microstructure of Cu thin films in various deposition conditions was characterized. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide films by DC magnetron sputtering. The Ar pressure during Cu deposition was controlled to 5, 50 and 100 mtorr. The microstructure was characterized using conventional and high resolution SEM and TEM. As sputtering pressure increases, open boundaries are observed more frequently. The Cu film deposited at 5 mtorr has a dense and uniform structure, while low-density regions or open boundaries between columns exist in the film deposited at higher pressure. As the film grows thicker, open boundaries are wider and the density of open boundaries are higher. The comparison between SEM and TEM show that the small features shown in high resolution SEM are grains. High resolution SEM is very effective to characterize the microstructure of the thin films. One column in the films deposited at 50 and 100 mtorr consists of several grains, which are smaller than those deposited at 5 mtorr.