• Title/Summary/Keyword: 게이트 산화층 항복 전압

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Characterization of gate oxide breakdown in junctionless amorphous InGaZnO thin film transistors (무접합 비정질 InGaZnO 박막 트랜지스터의 게이트 산화층 항복 특성)

  • Chang, Yoo Jin;Seo, Jin Hyung;Park, Jong Tae
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.22 no.1
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    • pp.117-124
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    • 2018
  • Junctionless amorphous InGaZnO thin film transistors with different film thickness have been fabricated. Their device performance parameters were extracted and gate oxide breakdown voltages were analyzed with different film thickness. The device performances were enhanced with increase of film thickness but the gate oxide breakdown voltages were decreased. The device performances were enhanced with increase of temperatures but the gate oxide breakdown voltages were decreased due to the increased drain current. The drain current under illumination was increased due to photo-excited electron-hole pair generation but the gate oxide breakdown voltages were decreased. The reason for decreased breakdown voltage with increase of film thickness, operation temperature and light intensity was due to the increased number of channel electrons and more injection into the gate oxide layer. One should decide the gate oxide thickness with considering the film thickness and operating temperature when one decides to replace the junctionless amorphous InGaZnO thin film transistors as BEOL transistors.

A novel TIGBT tructure with improved electrical characteristics (향상된 전기적 특성을 갖는 트렌치 게이트형 절연 게이트 바이폴라 트랜지스터에 관한 연구)

  • Koo, Yong-Seo;Son, Jung-Man
    • Journal of IKEEE
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    • v.11 no.4
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    • pp.158-164
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    • 2007
  • In this study, three types of a novel Trench IGBTs(Insulated Gate Bipolar Transistor) are proposed. The first structure has P-collector which is isolated by $SiO_2$ layer to enhance anode-injection-efficiency and enable the device to have a low on-state voltage drop(Von). And the second structure has convex P-base region between both gates. This structure may be effective to distributes electric-field crowded to gate edge. So this structure can have higher breakdown voltage(BV) than conventional trench-type IGBT(TIGBT). The process and device simulation results show improved on-state, breakdown and switching characteristics in each structure. The first one was presented lower on state voltage drop(2.1V) than that of conventional one(2.4V). Also, second structurehas higher breakdown voltage(1220V) and faster turn off time(9ns) than that of conventional structure. Finally, the last one of the proposed structure has combined the two structure (the first one and second one). This structure has superior electric characteristics than conventional structure about forward voltage drop and blocking capability, turnoff characteristics.

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