• Korean Journal of Materials Research
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• v.8 no.9
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• pp.871-875
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• 1998

High aspect ratio microstructures were fabricated by photolithography. The material for the microstructure was photosensitive glass which has good mechanical and electrical insulation properties. The photosensitive glass was exposed to ultraviolet light at 312nm through a chromium mask in which the structures are drawn. After heat treatment process over $500^{\circ}C$, the photosensitive glass was etched in a 10% hydrofluoric acid solution with ultrasonic conditions. Final dimension of the micro-framework was greatly dependent on the thickness of photosensitive glass, mask pattern, ultraviolet light exposure and etching conditions. The maximum aspect ratio of the micro-framework obtained from this work was over 30.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.289-292
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• 2009

The fabrication method of glass bipolar plates for micro PEM fuel cell application has been established and performance evaluation has been carried out. The advantages of glass bipolar plates for micro PEM fuel cells are light weight, high chemical resistivity, and easy manufacture. The MEMS fabrication process of anisotropic wet etching, thermal & UV bonding along with metal layer deposition has been introduced. From performance evaluation, it was shown that the micro fuel cell with a metal layer deposited on the reactive area yielded higher power density than the one without it. But both power densities of the two cases showed out to be adequate with the current status of micro fuel cell technology.

• Journal of the Korean Ceramic Society
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• v.41 no.11
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• pp.826-833
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• 2004

In this study, photosensitivity dynamics in SiO$_2$ glass with the composition similar to that of silica Planar Lightwave Circuit (PLC) devices was investigated as a fundamental study prior to the device fabrication. Silica bulk glasses with similar composition to the core layer of PLC devices were prepared with variable composition of B$_2$O$_3$. The photosensitivity in boron and germanium co-doped SiO$_2$ glass yields refractive index change $\Delta$n as high as 10$\^$-3/. However such index modulation disappeared after annealing. From the result of annealing experiment and W absorption / Raman spectra, we conclude the compaction model is applicable to our glass system.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.3
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• pp.237-242
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• 2009

MEMS catalytic combustors were fabricated to use in micro-power sources as a heat source. The combustor was fabricated by photolithography and anisotropic wet etching of photosensitive glass wafers. Two different catalyst loading methods were used to complete the fabrication of the combustors. For thin film type, the $Al_2O_3$ was washcoated on the surface of the combustion chamber as a catalyst support, and for packed-bed type, ceramic foam was inserted after Pt was coated. The volume of the combustors was 1.8 $cm^3$ and 16W of heat was generated using the fabricated combustors with hydrogen. The energy density of combustor was about 8.9 W/$cm^3$.

• Laser Solutions
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• v.14 no.1
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• pp.25-29
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• 2011

Micromachining of photosensitive glass by UV exposure, heat treatment, and etching processes is reported. Like photoresist, the photosensitive glass is also classified into positive and negative types by development characteristics. For the positive type, the exposed area is crystallized and etched away during the etching process in HF solution, whereas the unexposed area is crystallized and etched away for the negative type. The crystallized area of the photosensitive glass has an etch rate approximately 30~100 times faster than that of the amorphous area so that it becomes possible to fabricate microstructures in the glass. Based on the unique properties of glass such as high optical transparency, electrical insulation, and chemical/thermal stability, the glass micromachining technique introduced in this work could be widely applied to various devices in the fields of electronics, bio engineering, nanoelectonics and so on.

• Proceedings of the Korean Ceranic Society Conference
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• 2000.10a
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• pp.124.2-124
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• 2000

• Proceedings of the Materials Research Society of Korea Conference
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• 2004.05a
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• pp.66-66
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• 2004

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.30 no.6
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• pp.1-6
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode is formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer from the engine. Combustor size was determined to be 1mn scale. Piston in cylinder moves by fuel injection and reaction. In firing test, adequate engine operation including ignition, flame propagation and piston motion was observed. Present study warrants further application research on MEMS scale internal combustion power units.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.144.2-144
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• 2003

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.12
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• pp.1639-1645
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer form the engine. Combustor size was determined to be 1 mm scale. Movable piston is engraved inside the wafer. Ignition was done by nickel spark plug which was electroplated with thickness of 40 ${\mu}{\textrm}{m}$. The wafers were bonded by epoxy that resists high temperature. In firing test due to the bonding method and design tolerance pressure buildup by reaction was not confirmed. But ignition, flame propagation and actuation of micro structure from the reaction was observed. From the result basement of design and fabrication technology was obtained.