• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.911-914
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• 2003

The non-contact laser measurement system what can be used for the vibration analysis of structures is discussed. There are few systems using laser speckle interferometer for vibration analysis. One of these systems is the Electronic Speckle Pattern Interferometer (ESPI). With ESPI system, one can obtain the vibration mode shape qualitatively and the maximum vibration amplitude quantitatively of the structure at each resonance frequency. In this paper, the phase-shifting ESPI system with stroboscopic illumination for measuring vibration mode shapes is constructed and the operating software is programmed. The results are compared with that of commercial ESPI system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1059-1062
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• 2003

Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18$\mu\textrm{m}$ were obtained, and tensile properties, including elastic modulus, yielding strength and tensile strength, were determined. The tensile properties obtained under three different conditions of testing speed showed a dependency on the speed.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.7 s.196
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• pp.69-74
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• 2007

The paper proposes a new sonic resonance test for a elastic modulus measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI) and Euler-Bernoulli equation. Previous measurement technique of elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The proposed technique is able to give high accurate elastic modulus of materials through a simple experiment set up and analysis.

• Journal of Ocean Engineering and Technology
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• v.16 no.1
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• pp.46-51
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• 2002

Fatigue life estimation by the theoretical stress concentration factors are, in general, considerably different from test results. And in calculating stress concentration factor, it is very difficult to consider actual geometry and material property which are the notch shapes, imperfections or defects of materials such as porosities inclusions and casting defects, etc. Therefore, the paper deals with the experimental method to find out the more exact stress concentration factors by measuring the strain distributions on each specimen by 3D-ESPI(Electronic Speckle Pattern Interferometry) System. Then the fatigue lives are compared between theoretical calculations using stress concentration factors determined by 3D-ESPI system and fatigue test results.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.3
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• pp.52-57
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• 1997

Electronic Speckle Pattern Interferometry(ESPI) using the Model 95 Ar. laser, a video system and an image processor was applied to the in-plane displacement measurements. Unlike traditional strain gauges or Moire method, ESPI method requires no special surface preparation or attachments and can be measured in-plane displacement with no special surface preparation or attachments and can be measured in-plane displacement with no contact and real time. In this experiment specimen was loaded in parallel with a loadcell. The specimen was the cold rolled steel sheet of 2mm thickness, which was attached strain gauges. The study provides an example of how ESPI have been used to measure strain displacement in this specimen. The results measured by ESPI compare with the data which was measured by strain gauge method in tensile testing.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.128-131
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• 2002

Three Dimensional measuring system using optical interference is greatly needed for semiconductor surface or optical surface. The application of this system are : MEMS product, semiconductor surfaces, optical components, precise machined surface, etc. In this paper, Interferometry based measurement system is introduced, which is nondestructive and noncontact inspection system. This system have relatively many advantage, compared with AFM/STM, SEM, Stylus, etc. The developed system can measure the surface topography with high precision and resolution, and with few seconds. And the associated software algorithm is also developed for the ultra precision 3D measuring surface. Various samples that is measured using this system is showed in the latter of this paper.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.179-179
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• 2004

최근 산업계 기술 동향은 첨단화, 고정도화 그리고 초소형화하고 있으며, 초정밀 가공 기술(nano technology)의 발전에 따른 고정밀의 계측기술이 요구되고 있는 실정이며, 기계구조 재료가 다양한 조건 하에서 사용되어지고 있다. 이에 따라 새로운 정밀계측기술 또한 급속히 발전하고 있으며, 특히 비접촉 정밀 계측 분야에서는 레이저(laser)를 이용한 광계측 방법이 선호되고 있다. 레이저를 이용한 비접촉 계측방법은 기계구조물의 미소하중, 미소균열검출, 미소변형계측, 정밀계측 등의 분야에 장점을 가지고 있어 관심이 높아지고 있다.(중략)

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.6B
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• pp.629-637
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• 2002

RLS a1gorithm is a kind of the adaptive a1gorithms in smart antennas and adapts the weight vector using the difference between the output signal of array antennas and the known training sequence. In this paper, we propose a new algorithm based on the RLS algorithm. It calculates the error signal with reference signal derived from blind scheme. Simulation results show that the proposed algorithm yields more user capacity by 67∼74% than other blind adaptive algorithms(LS-DRMTA, LS-DRMTCMA) at the same BER and the beamformer forms null beams toward interference signals and the main beam toward desired signal.

• Electronics and Telecommunications Trends
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• v.27 no.6
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• pp.21-30
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• 2012

디지털 홀로그래픽 프린팅(Digital Holographic Printing: DHP)은 종래의 아날로그 방식이 아닌 디지털 기록 방식으로 이미지 또는 간섭무늬를 홀로그래픽 매질에 기록하여 정지 화상에 대한 홀로그램 상을 재생하는 홀로그래픽 기술이다. 현재 개발 중인 스테레오그램(stereogram) 기반 DHP는 수직/수평 방향의 시차(parallax)를 갖는 초다시점 영상을 매질에 촘촘히 기록하여 마치 아날로그 홀로그램과 같이 자연스럽게 3차원 상을 재현하는 기술이다. 하지만 이러한 기술은 과도기적인 성격의 기술로 향후에는 위상 정보를 포함하고 있는 홀로그램인 프린지 패턴(fringe pattern)을 직접 기록함으로써 보다 더 자연스러운 형태의 홀로그램 상을 재생할 수 있는 기술이 추가적으로 개발될 것으로 예상된다. 그러므로 본고에서는 Zebra Imaging사에서 개발한 스테레오그램 기반의 DHP 기술과 Nihon 대학이 시도한 프린지 기반의 DHP 기술 동향을 다루고자 한다.