• Title/Summary/Keyword: 가공액 비저항

Search Result 5, Processing Time 0.026 seconds

The surface profile of Wire-cut EDMed Surface by Lapping Process (래핑가공에 의한 와이어 방전가공면의 표면형상)

  • 이재명;김원일;왕덕현;이윤경
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2001.04a
    • /
    • pp.956-959
    • /
    • 2001
  • In die and mould industry, major material such as cemented carbide is broadly used for increasing the life time and decreasing the cost. It is also required the development for the skills of wire-cut electrical discharge machining(WEDM), but the WEDMed surface was found to be worst due to the attached components of wire. Precision machining method like lapping is necessary for obtaining high quality surface. The lapping compound such as Al2O3 and SiC and cast iron lap can be used for lapping process. The components of Cu and Zn were found WEDMed surface of the specimen. As the result, the low quality of precision was obtained and the heat damage layer of the specimen was occurred. The value of surface hardness was deteriorated, and therefore finish process was required.

  • PDF

Machining Characteristics According to the Thickness Change When Wire-cut Electrical Discharge Machining of Tungsten Carbide (초경합금재 와이어컷 방전가공시 두께변화에 따른 가공 특성)

  • 이재명;김원일;이윤경;왕덕현
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2000.05a
    • /
    • pp.820-823
    • /
    • 2000
  • The characteristics of wire deflection, surface roughness and roundness were observed on changing discharge time for electrical discharge machining(EDM) of tungsten carbide in various conditions of thickness. The wire deflection was decreased as increasing discharge time and wire tension, the gap of deflection was decreased after thickness 60mm and discharge time of 6$\mu\textrm{s}$ due to the changing from fundamental mode to vibration mode. The deflection is the smallest at the water specific resistivity of 7.5 kΩ ㆍcm. The deflection is found to be decreased as increasing dwell time, and the result is due to the vibration of the pressure and the amount of the dielectric. The component of copper(Cu) and zinc(Zn), which is the main material of wire electrode, was observed for rough wire-cutting EDM of STD-11. This phenomena is found to be decreased as the number of EDM is increased. But it will be improved by changing the material and the shape of wire. The roundness of middle is found to be worse than that of upper and it is increased as the thickness of material is increased.

  • PDF

Wet Etch Process for the Fabrication of Al Electrodes and Al Microstructures in Surface Micromachining (표면 미세가공에서 Al 전극 및 Al 미세 구조물 제작을 위한 습식 식각 공정)

  • Kim, Sung-Un;Paik, Seung-Joon;Lee, Seung-Ki;Cho, Dong-Il
    • Journal of Sensor Science and Technology
    • /
    • v.9 no.3
    • /
    • pp.224-232
    • /
    • 2000
  • Aluminum metal process in surface micromachining enables to fabricate Al electrodes or Al structures, which improve electrical characteristics by reducing contact- and line-resistance or makes the whole process to be simple by using oxide as sacrificial layer. However, it is not possible to use conventional sacrificial layer etching process, because HF solution attacks aluminum as well as sacrificial oxide. The mixed solution of BHF and glycerine as an alternative shows the adequate properties to meet with this end. The exact etching properties, however, are sensitively depends on the geometry of the released structure, because the most etching process of sacrificial layer proceeds to the lateral direction in narrow space. Also, the surface roughness of aluminum affects to the etching characteristics. This paper reports experimental results on the effect of microstructure and surface roughness of aluminum to the etching properties. Considering these effects, we propose the optimized etching condition, which can be used practically for the fabrication of aluminum electrodes and microstructures by using standard surface micromachining process without modification or additional process.

  • PDF

Evaluation of silicon powder waste quality by electromagnetic induction melting and resistance test (단결정 잉곳의 표면 그라인딩에서 발생하는 고순도 실리콘 분말 폐기물의 용해 및 품질 평가)

  • Moon, Byung Moon;Kim, Gangjune;Koo, Hyun Jin;Shin, Je Sik
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 2011.05a
    • /
    • pp.187.2-187.2
    • /
    • 2011
  • 태양광산업의 value chain중 up-stream쪽인 고순도 실리콘산업은 셀, 모듈, 시스템 쪽에 비하여 영업 이익률이나 부가가치 측면에서 매우 높은 성장성을 현재 보여주고 있으며 최근 원자력산업의 안전성 문제가 대두됨으로 인하여 태양광수요가 전 세계적으로 증대되는 경향을 나타내어 태양광용 실리콘의 수요가 확대됨과 아울러 spot시장에서의 가격 또한 상승하고 있다. 이런 관점에서 잉곳 및 웨이퍼 가공 중에 발생하는 고순도 실리콘 폐기물의 재활용 이 다시 주목받고 있다. 태양전지 웨이퍼(wafer)용 소재는 6N급 이상의 결정질 실리콘 잉곳(ingot)이 주를 이루며, 고효율의 셀을 제조하기 위해서 단결정 실리콘 잉곳이 많이 사용된다. 실리콘 단결정을 육성하는 방법에는 Floating zone 법, Czochralski 법, Bridgeman 법, CVD 등 매우 다양하다. 이 중 Czochralski 법은 전체 생산량의 대부분을 차지하고 있는 방법으로, 용융액에서 결정을 인상하여 ingot을 제작하는 방법이다. 그러나 대량의 전기에너지를 소비하여 제작되는 고순도의 실리콘 단결정 잉곳은 후 가공공정에서 그 절반 이상이 분말(powder) 및 슬러지(sludge)로 폐기되므로, 자원의 재활용 및 환경오염 측면에서 주요과제가 되고 있다. Czochralski 법으로 제작된 ingot의 경우 그 표면이 매끄럽지 못하여, 웨이퍼 단위의 가공 시 형태가 진원이 될 수 있도록 표면을 미리 연마(grinding)하는데, 이때에도 미세 분말이 다량 발생하게 된다. 본 연구에서는 이러한 고순도 단결정 실리콘 ingot의 연마 가공공정에서 발생한 미세 분말을 용해하여 보았다. 진공 챔버(chamber) 내부에 유도가열 코일과 냉도가니로 구성된 장비를 통해 전자기유도가열을 이용하여 실리콘 분말 폐기물을 용해하고, 그 시편을 ICP-MS 및 비저항 측정을 통해 분말 의 특성을 조사하여 재활용 가능성을 검토해 보았다.

  • PDF

Antimicrobial Effects of a Bacteriocin Mixture from Lactic Acid Bacteria against Foodborne Pathogens (복합 박테리오신의 항균활성 및 축산식품 저장성 증진 효과)

  • 한경식;오세종;문용일
    • Food Science of Animal Resources
    • /
    • v.22 no.2
    • /
    • pp.164-171
    • /
    • 2002
  • The purpose of this study was to evaluate inhibitory activity of a bacteriocin mixture from lactic acid bacteria(LAB) against foodborne pathogens. Each bacteriocin solutions were prepared by growing nine strains of bacteriocin producers in MRS broth for 18~24 h followed by centrifugation(8000$\times$g, 20 min, 4$^{\circ}C$). Bacteriocins were purified from ammonium sulfate precipitation and were resuspended in 50 mM phosphate buffer(pH 7.0). Nine bacteriocins were mixed together and then allowed to freeze at -2$0^{\circ}C$. The mixture of nine bacteriocins showed enhanced inhibitory activity compared to each of bacteriocins and inhibited the Gram negative pathogens including Escherichia coli 0157:H7, Klebsiella pneumoniae, Pseudomonas chlororaphis and Shigella sonnei. The mixture of bacteriocin solutions was significantly lower than controls when a freeze-dried bacteriocin mixture was added to frank sausage, Mozzarella cheese and pork loin. With addition of bacteriocin mixture, total mesophilic bacteria in pork loin were constant over storage period, whereas total mesophilic bacteria in Mozzarella cheese and frank sausang slightly increased. Total viable cells of control group increased during storage without bacteriocin treatment. Volatile base nitrogen content of pork loin during storage also increased significantly without bacteriocin treatment. The bacteriocin mixture was capable of inhibiting pathogenic and spoilage microorganisms and extending the shelf-life of cheese and meat products during storage.