• Title/Summary/Keyword: 가공변질층

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Characteristic evaluation of microscopic precision in high speed machining (고속가공에서 미시적 정밀도의 특성 평가)

  • 김철희;김전하;강명창;김정석
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2001.04a
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    • pp.352-357
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    • 2001
  • In this study, residual stress was investigated to evaluate damaged layer in high speed machining through simulation. In machining steel(STDll), residual stress remaining in machined surface was mainly appeared as compressive stress. The scale of this damaged layer more depends on feed per tooth and radial depth than spindle speed. Damaged layer was measured by optical microscope and hardness method. The micro-structure of damaged layer was a martensite because of cutting force and cutting temperature. Thickness of damaged layer is increased with incresing of feed per tooth and radial depth.

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A Research on the Change of Cutting Characteristics in Hardened A17075-T6 Depending on Turning Conditions (선반 가공조건에 따른 경화처리된 A17075-T6 소재의 가공특성 변화에 관한 연구)

  • Lee, Hee-Deok;Kim, Jeong-Suk;Jeong, Ji-Hoon;Im, Hak-Jin
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.1
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    • pp.144-149
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    • 2012
  • The cutting characteristics of hardened aluminum alloy A17075-T6 were investigated during turning processing. Under variation conditions of cutting speed, depth of cut, and feed rate, the characteristics of cutting force, surface roughness, and machined texture were investigated. Surface roughness became worse in proportion to the increase of the feed rate. The thickness of material alteration layer which is derived from the effect of cutting force was the biggest when feed rate 0.148mm/rev. This research confirmed that the deformed layer is dominantly dependent on the variation of feed rate.

The Trend of wafer Grinding Technology and Improvement of Machining Accuracy (웨이퍼 연삭 가공 기술의 동향 및 가공 정밀도 향상에 관한 연구)

  • 안대균;황징연;이재석;이용한;하상백;이상직
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.20-23
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    • 2002
  • In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

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A Study on the Machining Characteristics of Electropolishing for Stainless Steel (스테인레스 강의 전해연마 가공특성에 관한 연구)

  • 박정우
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.10a
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    • pp.186-191
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    • 1998
  • Electropolishing is the anodic dissolution process in the transpassive state. It removes non-metallic inclusions and improves mechanical and corrosion resistance of stainless steel. If there is a Bailby layer, it will be recovered again. Electropolishing is normally used to remove a very thin layer of material on the surface of a metal component. The aim of this study is to determine the tendencies of electropolishing STS316L tubes in terms of current density, machining time, temperature, electrode gap and surface roughness.

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A Study on the Transmutation Layer of CNC Wire-EDM'd Surface in Carbon Tool Steel (CNC WIRE-CUT 방전가공시 탄소공구강의 가공변질층에 관한연구)

  • Kim, Key-Sun;Kim, Chong-Yoob
    • Journal of the Korean Society for Precision Engineering
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    • v.5 no.4
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    • pp.59-65
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    • 1988
  • This paper describes the transmutation layer of CNC Wire electrical discharte machined surface. In order to analayze and invesigate transmutation layer of the carbon tool steel, workpieces was heat-treated by quenching, tempering, normaling. The obtained results are summarized as follows. 1. The result showed that wire electrical discharge machined surface region was transmuted into the recdast layer in the range of about 10${\mu}$m deep by resolidification and next zone was transmuted into the heat affected zone in the range of about 15${\mu}$m deep by high temperature. 2. The hardness of the recast layer and heat affected zone was decreased on its machined surface. 3. The more wire feedrate was increased, the more electrical discharge machine gap was decreased.

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A study on the plastic polishing process of cylindrical rods (봉재의 표면소성 연마가공에 관한 연구)

  • 최재찬;김병민
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.11 no.3
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    • pp.488-500
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    • 1987
  • The improvement of surface roughness of machined cylindrical rods through the plastic polishing process was studied in this paper. The criterion and limits for the plastic polishing process due to the wave motion of the ridge were established with respect to process variables: ridge shape and size, semi-cone die angle as well as friction factor, by the application of the upper-bound approach. The surface roughness of the plastic polished products was measured, and compared with that of the original specimen. Also the depth of the surface deformation layer was tested, and compared those of the theoretical values. Qualitative agreement exists between the experimental plastic polishing loads and theoretical loads. The wave motion of the ridge was mostly occurred within the established limits. The surface roughness of specimens was sufficiently improved through the present process. Also the predicted depth of the surface deformation layer was in good agreement with experimental results.

Relationship between Rolling Motion and Microstructural Change in Rolling Element (구름계의 미소조직 변화와 구름운동의 상호관계)

  • 차금환;김대은
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 1996.10a
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    • pp.163-167
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    • 1996
  • The life of rolling elements depends on various factors such as operating conditions and material properties. In this work, the effect of microstructure on the rolling behavior is investigated. Specially, the deformations in the substrate regions before and after rolling are compared. It is found that rolling action causes severe flow of material in the direction opposite to the rolling direction in the case of dry rolling direction. With lubrication, the deformation is more severe at the subsurface region rather than at the surface.

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Residual sterss and damaged layer in an intermittent hard turning (단속하드터닝에서 잔류응력과 가공변질층의 고찰)

  • 전준용
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.270-276
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    • 2000
  • Hard turning has the potential to replace grinding process and to achieve significant reduction in production time and cost. The main applications for hard turning is finishing process, namely grinding process. Therefore, it must be able to satisfy high surface integrity of the workpiece. This paper discusses surface quality in terms of residual stress and damaged layer with respect to cutting parameters in an intermittent hard turning. Damaged layer experiment is carried out orthogonal array. From that is based on the orthogonal array. From the response table, cutting parameters are analyzed from the view point of the damaged layer and residual stress. From this experimental results, even though in the intermittent hard turning, surface integrity turns out be good enough for replacing grinding process.

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Study on the Masking Effect of the Nanoscratched Si (100) Surface and Its Application to the Maskless Nano Pattern fabrication (마스크리스 나노 패턴제작을 위한 나노스크래치 된 Si(100) 표면의 식각 마스크 효과에 관한 연구)

  • 윤성원;강충길
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.5
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    • pp.24-31
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    • 2004
  • Masking effect of the nanoscratched silicon (100) surface was studied and applied to a maskless nanofabrication technique. First, the surface of the silicon (100) was machined by ductile-regime nanomachining process using the scratch option of the Nanoindenter${ \circledR}$ XP. To clarify the possibility of the nanoscratched silicon surfaces for the application to wet etching mask, the etching characteristic with a KOH solution was evaluated at room temperature. After the etching process, the convex nanostructures were made due to the masking effect of the mechanically affected layer. Moreover, the height and the width of convex structures were controlled with varying normal loads during nanoscratch.

A Study on the Cooling Effects of Mist in the Grinding (연삭 가공시 Mist의 냉각효과에 관한 연구)

  • 이석우;최헌종;김대중
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.918-921
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    • 2001
  • In grinding process, the heat of $1200^{\circ}$~$1500^{\circ}$ on the grinding area between grinding wheel and workpiece is generated. It decreases the surface integrity of workpiece and causes the thermal damages such as the deformed layer, residual stress and grinding burn. Generally coolant is widely used for preventing the heat generation on the grinding area, but it deteriorates the working condition by polluting the atmosphere of workplace and in the end pollutes the environment. The grinding methods using the compressed cold air and mist are the cooling methods to substitute conventional coolant. They can decrease the environmental pollution through not using coolant any more or minimizing it. In this study, the cooling effects of grinding methods using the compressed cold air and mist have been investigated. The grinding system equipped with the water bathe and mist spray nozzle was developed. The energy partition to workpiece through measuring the temperature on the workpiece surface was calculated. The surface integrity of workpiece and thermal damage like the deformed layer were analyzed.

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