• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Laser Solutions
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• v.15 no.4
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• pp.16-19
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• 2012

Due to the fact that the dimensions of circuit lines of IC substrates have been forecast to reduce rapidly, engraving the circuit line patterns with laser has emerged as a promising alternative. To engrave circuit line patterns in an IC substrate, we used a projection ablation technique in which a metal (INVAR) mask and a DPSS UV laser instead of an excimer laser are used. Results showed that the circuit line patterns engraved in the IC substrate have a width of about 15um and a depth of $13{\mu}m$. This indicates that the projection ablation with a metal mask and a DPSS UV laser could feasibly replace the semi-additive process (SAP).

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1037-1038
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• 2006

CFL(Compact Fluorescent Lamp)는 기존에 사용되던 백열 램프를 바로 대치할 수 있고, 백열 전구에 비하여 광 효율이 우수하다는 장점으로 인해서 사용처가 점점 증가되고 있는 추세이다. 하지만 등기구가 가지는 공간적인 제약으로 인해서 EMI 필터와 PFC 회로를 내장할 수 없으며, 램프에서 발생한 열이 직접적으로 안정기 회로에 영향을 주어 안정기 내부 온도가 매우 높게 상승한다는 점으로 인해서 다양한 기능을 갖는 전용 ballast control IC를 사용할 수 없었다. 이러한 이유로 인해서 toroidal core를 이용한 자려식(self-excited) 동작 방법이 주로 이용되어왔다. 이러한 자려식 발진 방법은 설계하기가 까다롭기 때문에 램프 점등 전에 램프 필라멘트를 예열한 이후에 점등을 하는 rapid start 방법을 구현하기 어려웠다. 본 논문은 fairchild 반도체에서 만든 CFL 전용 ballast IC가 가지는 특성에 대해서 다루었다. IC 내부에 안정기 동작을 제어하기 위한 제어 부분과 두 개의 MOSFET를 내장하고 있어 안정기 구성에 필요한 공간을 최소화할 수 있고, 부하 상태를 검출하여 항상 Active ZVS 동작을 하도록 하는 기능을 내장하고 있어서 스위칭 손실을 최소화할 수 있다는 장점을 가지고 있다.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.93-93
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• 2009

본 연구에서는 EGW, FCAW 공정 적용에 따른 고강도 극후판 EH36-TMCP강 용접부의 역학적 거동 및 파괴인성 $K_{IC}$ 을 규명하기 위해, 먼저 열분포, 열탄소성 수치해석을 통하여 용접부의 역학적 거동(용접잔류응력, 소성변형율 등의 크기, 분포, 발생기구)을 고찰하였다. 그리고 이때 얻어진 잔류응력을 초기응력으로 하여, 잔류응력과 외력의 복합하중에 대한 파괴인성 $K_{Ic}$ 특성을 해석하였다. 용접공정별 균열이 존재하는 용접부의 파괴기준을 살펴보면, EGW용접부의 경우가 FCAW용접부의 경우에 비해 균열의 성장이 다소 용이하여 $K_{IC}$ 값이 다소 낮게 나타났다. EGW용접부의 파괴인성 $K_{IC}$ 경우 중첩된 경우(복합하중)가 순수 외력만 작용하는 경우보다 파괴 인성치가 다소 감소하는 경향을 보이고, a/W가 작을 경우 중첩의 경우가 순수 외력만의 경우보다 파괴인성치 차이가 크나, a/W가 증가함에 따라 그 차이가 점차 없어지는 것으로 나타났다. 반면, FCAW용접부의 경우 균열길이가 작은 범위에서는 중첩된 경우가 순수 외력만 작용 할 경우보다 파괴 인성치가 다소 증가함을 보이지만, a/W가 증가함에 따라 순수 외력만의 작용의 경우와 중첩의 경우의 파괴인성 차이가 없는 것으로 나타났다.

• Journal of the Korean Wood Science and Technology
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• v.20 no.2
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• pp.61-72
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• 1992

This study was carried out to investigate the fracture behavior and the fracture criterion of yellow lauan(Shorea spp.), when has used for furniture and wood structures, and to offer a reliability for wood structure and basic data for wood fracture criterion in experiments which are fracture tested under mode I, mode II and mixed mode loading condition. The results were summarized as follows; 1. Fractures in specimens which have inclined grain in yellow lauan procedeed from crack tip in the radial direction along the grain. 2. In yellow lauan, $K_{IC}RL$ was 42.1kg/$cm^{3/2}$ and $K_{IIC}RL$ was 15.8kg/$cm^{3/2}$. 3. The fracture criteria of lauan were; ($K_I/K_{IC}$)+($K_{II}/K_{IIC}$)=1 in RL system with inclined grain at $45^{\circ}$, ($K_I/K_{IC}$)+$(K_{II}/K_{IIC})^2$=1 with inclined grain at $15^{\circ}$ and $(K_I/K_{IC})^2$+$(K_{II}/K_{IIC})^2$=1 with inclined grain at $30^{\circ}$, $60^{\circ}$, $75^{\circ}$ and $90^{\circ}$, respectively. 4. The fracture criterion of wood could vary with the species, and the load applying condition. In order to measure the fracture criterion strictly, along with standardization of specimen geometry a large amount of experimental data is needed. 5. $K_{IC}$(critical stress intensity factor) can be predicted by grain angle. As the grain inclined angle increased, $K_{IC}$ and $K_{IIC}$ are increased.

• Journal of the Korean Society for Nondestructive Testing
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• v.12 no.4
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• pp.18-25
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• 1993

This paper is to aim the microdefect evaluation of If package into a quantitative from NDI's image processing of ultrasonic wave. (1) Automatically repeated discrimination analysis method can be devided in the category of all kind of defects on IC package, and also can be possible to have a sampling of partial delamination. (2) It is possible that the information of edge section in silicon chip surrounding can be extractor by the partial image processing of IC package. Also, the crack detection is possible between the resin part and lead frame.

• Korean Journal of Pharmacognosy
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• v.44 no.4
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• pp.372-378
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• 2013

In this study, the inhibitory effect on advanced glycation end products (AGEs) formation of 43 Korean herbal medicines has been evaluated. Among them, 16 Korean herbal medicines were showed to have significant effect ($IC_{50}$; <50 ${\mu}g/ml$) compared to positive reference, aminoguandine ($IC_{50}$: $76.47{\pm}4.81{\mu}g/ml$). Especially, five herbal medicines, Rubus coreanus (leaves, $IC_{50}$: $4.49{\pm}0.03{\mu}g/ml$), Rubus coreanus (twigs, $IC_{50}$: $3.80{\pm}0.34{\mu}g/ml$), Ampleopsis brevipedunculata (stems, $IC_{50}$: $7.43{\pm}0.09{\mu}g/ml$), Lindera erythrocarpa (leave, $IC_{50}$: $8.14{\pm}0.20{\mu}g/ml$), and Lindera erythrocarpa (stems, $IC_{50}$: $3.69{\pm}0.14{\mu}g/ml$) showed more potent inhibitory activity (approximately 9-20 fold) than the positive control aminoguanidine.

• Journal of IKEEE
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• v.8 no.1 s.14
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• pp.152-159
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• 2004

In this study, we design the one-chip PWM IC with high voltage power switch (300V class LDMOSFET) for SMPS (Switching Mode Power Supply) application. Reference circuits generate constant voltage(5V) in the various of power supply and temperature condition. Error amp. is designed with large DC gain $({\simeq}65dB)$, unity frequency $({\simeq}190kHz)$ and large $PM(75^{\circ})$. comparator is designed with 2 stage. Saw tooth generators operate with 20kHz oscillation frequency. Also, we optimize drift concentration & drift length of n-LDMOSFET for design of high voltage switching device. It is shown that simulation results have the breakdown voltage of 350V. (using ISE-TCAD Simulation tool). PWM IC with power switching device is designed with 2um design rule and Bi-DMOS technology.

• Natural Product Sciences
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• v.3 no.1
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• pp.29-37
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• 1997

Protein Kinase C (PKC) is generally believed to play a central role in signal transduction, cellular growth control, gene expression, and tumor promotion. And it has been suggested that inhibitors of PKC might play important roles for the prevention and treatment of cancer. In order to investigate the possible inhibitors of PKC from natural products, PKC receptor binding assay was performed using bovine brain particulate as a source of PKC and the amount of $[^3H]Phorbol$ 12,13-dibutyrate (PDBu) bound to PKC was measured in the presence of test materials. Total methanol extracts from 100 kinds of natural products were partitioned into 3 fractions (n-hexane, ethyl acetate and aqueous layer) and their binding ability to the regulatory domain of PKC was evaluated. The ethyl acetate fractions of Morus alba $(roots,\;IC_{50}:\;156.6\;{\mu}g/ml)$, Rehmannia glutinosa $(roots,\;IC_{50}:\;134.3\;{\mu}g/ml)$, Lysimachia foenum-graecum $(roots,\;IC_{50}:\;167.8\;{\mu}g/ml)$, Polygonum cuspidata $(roots,\;IC_{50}:\;157.3\;{\mu}g/ml)$, Cnidium officinale $(aerial\;parts,\;IC_{50}:\;145.2\;{\mu}g/ml)$, and the hexane $(IC_{50}:\;179.3\;{\mu}g/ml)$ and the EtOAc fraction of Symplocarpus nipponicus $(roots,\;IC_{50}:\;155.9\;{\mu}g/ml)$ showed inhibitory activity of $[^3H]PDBu$ binding to PKC.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.10
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• pp.7-14
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• 2008

In this paper, we designed the HVIC(High Voltage Gate Driver IC) which has improved noise immunity characteristics and high driving capability. Operating frequency and input voltage range of the designed HVIC is up to 500kHz and 650V, respectively. Noise protection and schmitt trigger circuit is included in the high-side level shifter of designed IC which has very high dv/dt noise immunity characteristic(up to 50V/ns). And also, rower dissipation of high-side level shifter with designed short-pulse generation circuit decreased more that 40% compare with conventional circuit. In addition, designed HVIC includes protection and UVLO circuit to prevent cross-conduction of power switch and sense power supply voltage of driving section, respectively. Protection and UVLO circuit can improve the stability of the designed HVIC. Spectre and Pspice circuit simulator were used to verify the operating characteristics of the designed HVIC.