• Corrosion Science and Technology
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• v.6 no.6
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• pp.311-315
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• 2007

The anodic polarization behavior of equiatomic TiNi shape memory alloy with pure titanium as a reference material was investigated by means of open circuit potential measurement and potentiodynamic polarization technique. And the structure of passive films on TiNi intermetallic compounds was also conducted using AES and ESCA. While the dissolved Ni(II) ion did not affect the dissolution rate and passivation of TiNi alloy, the dissolved Ti(III) ion was oxidated to Ti(IV) ion on passivated TiNi surface at passivation potential. It has also been found that the Ti(IV) ion increases the steady state potential, and passivates TiNi alloy at a limited concentration of Ti(IV) ion. The analysis by AES showed that passive film of TiNi alloy was composed of titanium oxide and nickel oxide, and the content of titanium was three times higher than that of nickel in outer side of passive film. According to the ESCA analysis, the passive film was composed of $TiO_2$ and NiO. It seems reasonable to suppose that NiO could act as unstabilizer to the oxide film and could be dissolved preferentially. Therefore, nickel oxide contained in the passive film may promote the dissolution of the film, and it could be explained the reason of higher pitting susceptibility of TiNi alloy than pure Ti.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.2
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• pp.133-139
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• 2014

Titanium (Ti) metal and its alloys are desirable materials for ship hulls and other ocean structures because of their high strength, corrosion-resistance and light weight properties. And light weight and corrosion-resistant aluminum (Al) is the ideal metal for shipbuilding. The joining of Ti and Al dissimilar metals is one of the effective methode to reduce weight of the structures. Ti and Al have great differences in materials properties, and intermetallic compounds such as $Ti_3Al$, TiAl, $TiAl_3$ are easily formed at the contacting surface between Ti and Al. Thus, dissimilar welding and joining of Ti and Al are considered to be very difficult. However, it was clarified that ultra-high speed welding could suppress the formation of intermetallic compounds in the previous study. Results of tensile shear strength increases with an increase in the welding speed, and therefore extremely high welding speed (50 m/min) is good to dissimilar weldability for Ti and Al. In this study, therefore, full penetration dissimilar lap welding of Ti (upper) - Al (lower) and Al (upper) - Ti (lower) with single-mode fiber laser was tried at ultra-high welding speed, and the microstructure of the interface zones in the dissimilar Al and Ti weld beads was investigated.

• Journal of the Korean Society for Heat Treatment
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• v.11 no.3
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• pp.177-185
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• 1998

The purpose of this research is to investigate the effects of Co, Co-Ti addition on the sintering characteristic of $(Ti_{1-x}Alx)N$ material synthesized by the direct nitriding method for a application as a cermet material. The observed shrinkage rates of $(Ti_{1-x}Alx)N$ pellets increase with the additive (Co, Co-Ti) content, temperature and time, and also the pellets with the same additive content exhibit the shrinkage behavior that depends on the Ti/Al ratio. However, although the shrinkage rates in this study is the mast higher (36%), the density of the sintered $(Ti_{1-x}Alx)N$ pellet is below 80% density in theory because of the partial segregation and the dense band defect of AlCo compound. Consequentely, it is considered that Co was not effective as a binder material because the wettability of liquid Co metal on $(Ti_{1-x}Alx)N$ materials is poor, In $(Ti_{1-x}Alx)N$ with Ti-Co additive, the stoichiometric TiN is transformed by the under-stoichiometric TiNx(x<1.0) during sintering, leading to the good properties such as hardnees and hot oxidation.

• Journal of Technologic Dentistry
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• v.15 no.1
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• pp.5-25
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• 1993

Effects of hydrogenation on microstructure and mechanical properties of pure Ti and Ti-0.15Pd alloy have been studied by means of optical microscopy, differential scanning calorimeter(DSC), Xray diffraction and micro vicker's hardness test. Grain size of pure Ti and Ti-0.15Pd alloy decresed largely by hydrogenation finer than that of pure Ti and the grain size refinement was evedent in Ti-0.15Pd alloy than that in pure Ti. Ti-.015Pd alloy carried out solution treatment at 950$^{\circ}C$, the transformation of $\alpha$' martensite was occured. The amount of Hydrogen absorption in Ti-.015Pd alloy was higher than that in pure Ti. Decomposition of hydride in pure titanium and Ti-0.15Pd alloy increased largely by hydrogenation, and micro vicker's hardness of Ti-.015Pd alloy was largely than that of pure Ti by 30% after hydrogenation. The micro vicker's hardness of Ti-0.15Pd alloy after solution treatment and dehydrogenation were higher at $\beta$ phase ranger(950$^{\circ}C$) than that phase range(750$^{\circ}C$).

• Korean Journal of Materials Research
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• v.13 no.2
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• pp.88-93
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• 2003

Co/Ti bilayer structure in Co salicide process helps to the improvement of device speed by lowering contact resistance due to the epitaxial growth of $CoSi_2$layers. We investigated the epitaxial growth and interfacial mass transport of $CoSi_2$layers formed from $150 \AA$-Co/Ti structure with two step rapid thermal annealing (RTA). The thicknesses of Ti layers were varied from 20 $\AA$ to 100 $\AA$. After we confirmed the appropriate deposition of Ti film even below $100\AA$-thick, we investigated the cross sectional microstructure, surface roughness, eptiaxial growth, and mass transportation of$ CoSi_2$films formed from various Ti thickness with a cross sectional transmission electron microscopy XTEM), scanning probe microscopy (SPM), X-ray diffractometery (XRD), and Auger electron depth profiling, respectively. We found that all Ti interlayer led to$ CoSi_2$epitaxial growth, while $20 \AA$-thick Ti caused imperfect epitaxy. Ti interlayer also caused Co-Ti-Si compounds on top of $CoSi_2$, which were very hard to remove selectively. Our result implied that we need to employ appropriate Ti thickness to enhance the epitaxial growth as well as to lessen Co-Ti-Si compound formation.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.38-38
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• 2018

TiMoN 코팅층은 우수한 내마모 특성과 낮은 마찰계수를 보여 많은 연구가 진행되고 있다. 본 연구에서는 음극아크 증착으로 질소 가스 유량, 아크 전류, 기판 전압 등 공정 변수를 제어하여 TiMoN 코팅층을 스테인리스와 초경 기판 위에 제조하고 색상, 미세구조, 경도 등 물리적 특성을 평가하였다. TiMo 타겟은 Mo가 약 8 at.% 함유되어 있으며 직경은 80 mm이었다. 색차계를 이용하여 TiMoN 코팅층의 색상을 분석한 결과, 질소 유량이 증가할수록 $a^*$와 $b^*$ 값이 증가하는 경향을 확인하였다. 질소 유량 90 sccm으로 제조한 TiMoN 코팅층은 TiN 코팅층과 유사한 색상을 보였다. TiMoN 코팅층의 조성을 에너지분산형 분광기(energy dispersive spectroscopy)로 분석한 결과, 타겟과 유사한 조성을 보였다. TiMoN 코팅층의 단면을 주사전자현미경으로 관찰한 결과, 주상정 형성이 확인되었으며 코팅층 표면에는 음극 아크 공정 시 발생하는 거대입자가 발견되었다. 질소 유량 50 sccm으로 제조한 TiMoN 코팅층은 약 3000 Hv의 경도 값을 보였다. X-선 분광기로 TiMoN 코팅층의 결정성을 분석한 결과, TiN과 유사한 합금상이 형성된 것을 확인할 수 있었다. TiMoN 코팅층은 TiN과 유사한 색상을 보였으며 경도는 TiN보다 높은 값을 보여 절삭공구, 금속 가공용 부품 등 고경도 코팅층으로 활용이 가능할 것으로 판단된다.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.117-125
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• 1996

The variation of the interfacial and the electrical properties of SiO$_{2}$TiW layers as a function of anneal temperature was extensively investigated. During the deposition of SiO$_{2}$ on TiW chemical bonds such as SiO$_{2}$, TiW, WO$_{3}$, WO$_{2}$ TiO$_{2}$ Ti$_{2}$O$_{5}$ has been created at the SiO$_{2}$/TiW interface. At the anneal temperature of 300$^{\circ}C$, WO$_{3}$ and TiO$_{2}$ bonds started to break due to the reduction phenomena of W and Ti and simultaneously the metallic W and Ti bonds started to create. Above 500$^{\circ}C$, a part of Si-O bonds was broken and consequently Ti/W silicide was formed. Form the current-voltage characteristics of Al/Sico$_{2}$(220$\AA$)/TiW antifuse structure, it was found that the breakdown voltage of antifuse device wzas decreased with increasing annealing temperature for SiO$_{2}$(220$\AA$)/TiW layer. When r, the insulating property of antifuse device of the deterioration of intermetallic SiO$_{2}$ film, caused by the influw of Ti and W.W.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.1
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• pp.7-10
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• 2002

$TiO_2$ thin films were prepared by coating and subsequent pyrolysis processes using Titanium-naphthenate as a raw material. $TiO_2$ thin films were made by spin-coating technique on the glass substrates, and heat treated at 45$0^{\circ}C$, The transmittance, refractive index, crystallinity and surface morphology of the $TiO_2$ thin films were measured by UV/Vis spec trophotometer, x-ray diffractometer and scanning electron microscope. $TiO_2$thin films on the slide glass showed the trans mittance of 70-90% and refractive index of 2.6 at 420 nm. The results of XRD and SEM showed that the $TiO_2$ thin films exhibited the anatase phase and the thread-like surface morphology.

• Journal of the Korean Ceramic Society
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• v.37 no.1
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• pp.96-101
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• 2000

Comparative studies on microstructure, and mechanical and anti-oxidation properties between TiN and Ti-Si-N films were performed. The Ti-Si-N films were deposited on high-speed steel and silicon wafer substrates by plasma-assisted chemcial vapor deposition(PACVD) technique. The Si addition to TiN film caused to change the microstructure such as grain size refinement, randomly multi-oriented microstructure, and nano-sized codeposition of silicon nitride in the TiN matrix. The Ti-Si-N film, contains Si content of ∼7 at.%, showed the micro-hardness value of ∼3400 HK, which was higher than the pure TiN film whose hardness was ∼1500HK. The Ti-Si(7 at.%)-N film also showed much improved anti-oxidation properties compared with those of the pure TiN film. These properties were also related to the microstructure of Ti-Si(7 at.%)-N film was formed and retarded further oxidation of the nitridelayer. These properties were also related to the microstructure of Ti-Si(7 at.%)-N film which was characterized by nano-sized precipitates of silicon nitride phase in the TiN matrix and randomly oriented grains.

• Analytical Science and Technology
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• v.21 no.3
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• pp.229-236
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• 2008

$C/TiO_2$ composites were prepared with surface modified MWCNT sequentially after HCl treatment and TNB as titanium source. There is a single crystal structure which is anatase in all of the samples from the data of XRD. The SEM microphotographs of $C/TiO_2$ composites show that the $TiO_2$ particles were well mixed with the CNT. There are C, O and Al with strong Ti peaks in all samples from EDX results, and it also shows that the sample CT has much more amount of C and Ti content than that of sample HCT. Finally, the photocatalytic activities for the $C/TiO_2$ composites have more effective than that of pristine $TiO_2$.