• 한국재료학회지
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• 제2권1호
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• pp.76-82
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• 1992

$TEOS-O_3$ 산화막은 깔개층 물질에 따라 증착속도가 변하는 특성을 나타낸다. 본 논문에서는 $TEOS-O_3$ 산화막의 깔개층 물질 의존성 이외에도 배선 밀도, 배선 간격에 따라 증착속도가 달라지는 패턴 의존성에 대하여 조사하였다. 또한 $TEOS-O_3$ 산화막의 깔개층 물질 의존성 및 패턴 의존성을 줄이기 위해 다층 배선에서 1차 배선후에 깔개층, 즉 TEOS-base 프라즈마 산화막 및 $SiH_4-base$ 프라즈마 산화막을 증착했을 때 $TEOS-O_3$ 산화막의 증착 특성을 조사하였다. 그리고 그 깔개층 물질에 $N_2$ 프라즈마 처리를 했을 때 $TEOS-O_3$ 산화막의 증착 특성에 대해 조사하였다. 그 결과 $TEOS-O_3$ 산화막에서 기판 위에 배선 밀도와 배선 간격에 따른 의존성은 깔개층물질이 $SiH_4-base$ 일때보다 TEOS-base 프라즈마 산화막인 경우 $N_2$ 프라즈마 처리를 하면 깔개층 물질 표면이 O-Si-N화 되므로써 의존성이 사라지게 된다.

• 한국표면공학회지
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• 제51권2호
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• pp.110-115
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• 2018

The Na low temperature gettering in $SiO_2/PSG/SiO_2/Al-1%Si$ and $SiO_2/TEOS/SiO_2/Al-1%Si$ multilevel thin films was investigated using dynamic SIMS(secondary ion mass spectrometry) analysis. DC magnetron sputter, APCVD and PECVD techniques were utilized for the deposition of Al-1%Si thin films, $SiO_2/PSG/SiO_2$ and $SiO_2/TEOS/SiO_2$ passivations, respectively. Heat treatment was carried out at $300^{\circ}C$ for 5 h in air. SIMS depth profiling was used to determine the distribution of Na, Al, Si and other elements throughout the $SiO_2/PSG/SiO_2/Al-1%Si$ and $SiO_2/TEOS/SiO_2/Al-1%Si$ multilevel thin films. XPS was used to analyze chemical states of Si and O elements in $SiO_2$ passivation layers. Na peaks were observed throughout the $PSG/SiO_2$ and $TEOS/SiO_2$ passivation layers on the Al-1%Si thin films and especially at the interfaces. Na low temperature gettering in $SiO_2/PSG/SiO_2/Al-1%Si$ and $SiO_2/TEOS/SiO_2/Al-1%Si$ multilevel thin films is considered to be caused by a segregation type of gettering.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.295-296
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• 2005

Poly-Silicon Thin Film Transistor 응용을 위한 $SiO_2$ 박막 성장에 관한 연구로서 기존의 ICP-CVD를 이용한 실험에서 $SiH_4$ 가스대신 유기 사일렌 반응물질인 TEOS(TetraethylOrthosilicate) Source를 이용하여 APCVD 법으로 성장시켰다. $SiO_2$ 박막은 반도체 및 디스플레이 분야에서 필드산화막, 보호막, 게이트 절연막 등으로 사용되며, 이러한 산화막 증착을 TEOS를 이용하였고, 빠른 증착과 더 좋은 특성을 갖는 박막 형성을 위하여 $O_2$ 반응가스를 이용하였고, Ellipsometor, XPS 등을 이용하여 계면 특성 분석을 하였다.

• 한국재료학회지
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• 제9권2호
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• pp.144-148
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• 1999

We have studied the deposition characteristics of thick silicon dioxide film on Si substrate by $O_3$/TEOS APCVD(Atmospheric Pressure Chemical Vapor Deposition). The effect of deposition parameters such as the distance between showerhead and substrate, deposition temperature, TEOS flow rate and $O_3$/TEOS ratio on deposition rate, surface morphology, and properties of films as investigated. As deposition temperature increased, deposition rate decreased but the surface morphology and adhesion of film to substrate improved. As the distance between showerhead and substrate decreased, the deposition rate increased. Etching rate using the BOE increased as TEOS flow rate increased, but was independent of$ O_3$/TEOS ratio. Deposition rate of $5\mu\textrm{m}$/hour was obtained under the condition that the distance between showerhead and substrate was 5mm and the deposition temperature was $370^{\circ}C$.

• 한국세라믹학회지
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• 제31권2호
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• pp.206-212
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• 1994

Effects of the film deposition process parameters on the properties such as deposition rate, etch rate, refractive index, stress and step coverage of plasma enhanced chemical vapor deposited (PECVD) tetraethylorthosilicate glass (TEOS) SiO2 film were investigated and analysed using SEM, FTIR and SIMS techniques. Increasing TEOS flow or decreasing O2 flow increased the deposition rate and the compressive stress of the oxide film but produced a less denser film. The deposition rate decreased owing to the decrease in the sticking coefficient of the TEOS and the O2 molecules onto the substrate Si with increasing the substrate temperature. Increasing the substrate temperature produced a denser film with a lower etch rate and the higher refractive index by lowering SiOH and moisture contents. Increasing the rf power increases the ion bombardment energy. This increase in energy, in turn, increases the deposition rate and tends to make the film denser. No appreciable changes were found in the deposition rate but the refractive index and the stress of the film decreased with increasing the deposition pressure. The carbon content in the plasma TEOS CVD oxide film prepared under our standard deposition conditions were very low according to the SIMS analysis results.

• Korean Membrane Journal
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• 제3권1호
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• pp.69-74
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• 2001

Films of TiO$_2$/SiO$_2$ were deposited on the inner surface of the porous glass support tubes by decomposition of tetraisopropyl titanate (TIPT) and tetraethyl orthosilicate (TEOS) at atmospheric pressure. Dense and hydrogen -permselective membranes were formed at 400-600$\^{C}$. The permeation rates of H$_2$ through the membrane at 600$\^{C}$ were 0.2-0.4 ㎤(STP)/min-㎠ atm and H$_2$:N$_2$permeation ratios were above 1000. The permeation properties of the membranes were investigated at various deposition temperatures and TIPT/TEOS concentrations. Decomposition of TIPT alone at temperatures above 400$\^{C}$ produced porous crystalline TiO$_2$ films and they were not H7-selective. Decomposition of TEOS produced H$_2$-permeable SiO$_2$ films at 400-600$\^{C}$ but film deposition rate was very low. Addition of TIFT to the TEOS stream significantly accelerated the deposition rate and produced highly H$_2$-selective films. Increasing the TIPT/TEOS concentration ratio increased the deposition rate. The TiO$_2$/SiO$_2$ membranes formed at 600 $\^{C}$ have the permeation properties comparable to those of SiO$_2$ membranes produced from TEOS.

• 공업화학
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• 제8권2호
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• pp.301-307
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• 1997

응집이 없는 단분산의 $SiO_2/TiO_2$ 복합 미립자를 얻기 위하여 $TiO_2$seed가 분산되어 있는 에탄올 수용액과 TEOS (Tetraethyl Orthosilicate)를 에탄올에 녹인 용액을 혼합하여 $TiO_2$ 주위에서 TEOS가 가수분해 및 축합 반응이 일어나도록 유도하여 복합 미분말을 제조하였다. 촉매로 암모니아를 사용하였고, 반응온도는 실온이었다. 반응변수는 TEOS의 농도, 암모니아의 농도, $TiO_2$ seed의 크기 및 양이었다. 응집이 없는 복합 미립자를 얻기 위한 최적조건은 [TEOS]=0.3M, [$NH_4OH$]=0.7M, $TiO_2$ seed의 크기가 200~300 nm이었고, 이때 $0.8{\sim}0.9{\mu}m$의 입자크기를 갖는 복합입자를 얻을 수 있었다.

• 산업기술연구
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• 제21권B호
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• pp.149-153
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• 2001

A study on the particle growth in $TEOS/O_2$ plasma was performed, and particle size and its distribution was measured by the electrical aerosol analyzer (EAA), light scattering particle size analyzer and the particle size was also determined by SEM. The effects of process variables such as total gas flow rate, reactor pressure, supplied power and initial reactant concentration on the particle growth were investigated. From the EAA results, the particle size distribution is divided into three groups of the cluster size and the small and large size particles. The particle size distribution measured by the light scattering particle size analyzer becomes bimodal, because the cluster size particles smaller than 20 nm in diameter cannot be detected by the light scattering particle size analyzer. The size of particles measured by the light scattering particle size analyzer is in good agreements with those by the SEM. Also we could understand that the particle formation is very sensitive to the changes of reactor pressure and reactant concentration. As the total gas flow rate increases, the particle size decreases because of the shorter residence time. As the reactor pressure, or the reactant concentration increases, the particle concentration increases and the particles grow more quickly by the faster coagulation between particles.

• 산업기술연구
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• 제23권A호
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• pp.175-179
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• 2003

A study on the particle growth in $TEOS/O_2$ plasma was performed by observing the particle size and its morphology by TEM. The qualitative chemical analysis of particles was also determined by the EDS (Energy Dispersive X-Ray Spectrometer). The effects of process variables such as the plasma on-time and bubbler temperature on the particle growth were investigated. The particle size becomes larger as the plasma on-time because of the longer coagulation, and also as the bubbler temperature increases because of the faster coagulation between particles.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집B
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• pp.174-179
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• 2000

Ultrafine particles have been used widely in many high technology industrial areas. The spherical nonagglomerated and uniform nanometer-size $SiO_2$ particles are synthesized by the direct injection of TEOS(Tetraethyorthosilicate) using electro-hydrodynamic spray ins method. Electro-hydrodynamic spray can generate in the range of submicron-size TEOS particles with high electric charge by applying a high electric field between the liquid injection nozzle and the reaction tube. This TEOS particles are thermally decomposed or oxidized to produce nanometresized $SiO_2$ particles in the reaction tube. Spherical, nonagglomerated and ultrafine particle generated and examined at furnaced temperature, $800^{\circ}C$ and TEOS flowrate of 0.49 or $1.00cm^3/hr$ using SEM and SMPS. As the total gas flowrate changes from 1.51pm to 5.01pm, the mean diameter of $SiO_2$ particle decreases from 120 nm to 68nm.