• Transactions on Electrical and Electronic Materials
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• v.18 no.5
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• pp.261-264
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• 2017

$Ni_{0.79}Co_{0.15-x}Cu_xMn_{2.06}O_4$ ($0{\leq}x{\leq}0.09$) thick films were fabricated using the conventional solid-state reaction method and screen-printing method. Structural and electrical properties of specimens based on the amount of Cu were observed in order to investigate their applicability in the infrared detector. All specimens showed a single spinel phase with a homogeneous cubic structure. As the amount of Cu increased, the average grain size increased and was found to be approximately $5.01{\mu}m$ for the $Ni_{0.79}Co_{0.06}Cu_{0.09}Mn_{2.06}O_4$ specimen. The thickness of all specimens was approximately $55{\sim}56{\mu}m$. As Cu content increased, the resistivity and TCR properties at room temperature decreased, and these values for the $Ni_{0.79}Co_{0.06}Cu_{0.09}Mn_{2.06}O_4$ specimen were $502{\Omega}-cm$ and $-3.32%/^{\circ}C$, respectively. The responsivity and noise properties decreased with an increase in Cu content, with the specimen with a Cu content of x=0.09 showing 0.0183 V/W and $5.21{\times}10^{-5}V$, respectively.

• Transactions on Electrical and Electronic Materials
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• v.18 no.6
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• pp.330-333
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• 2017

$Co_xMn_{3-x}O_4$ ($1.48{\leq}x{\leq}1.63$) ceramics were fabricated using the solid-state reaction method. Structural and electrical properties of specimens based on the composition ratio of Co were observed in order to investigate their applicability in NTC thermistors. All specimens showed a single spinel phase with a homogeneous tetragonal structure. The $Co_{1.57}Mn_{1.43}O_4$ specimen showed a maximum average grain size of approximately $6.47{\mu}m$. In all specimens, TCR properties displayed excellent characteristics of over $-4.2%/^{\circ}C$. The resistivity at 298 K and B-value of the $Co_{1.57}Mn_{1.43}O_4$ specimen were approximately $418{\Omega}-cm$ and 4300, respectively.