• Membrane Journal
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• v.17 no.2
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• pp.124-133
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• 2007

In this study, we treated lake water by 2 kinds of multichannel ceramic micro filtration membranes. We could investigate effects of $N_2-back-flushing$ time (BT) and transmembrane pressure (TMP), and find optimal operating conditions. The BT were changed in $10{\sim}60$ sec, TMP in $0.6{\sim}2.0$ bar at fixed filtration time (FT) 8 min, flow rate 2.0 L/min and back-flushing pressure 2.0 bar. Also, the optimal conditions were discussed in the viewpoints of resistance of membrane fouling $(R_f)$, dimensionless permeate flux $(J/J_o)$, permeate flux (J) and total permeate volume $(V_T)$. As result, optimal back-flushing conditions for HC04 ($0.4{\mu}m$ pore size) and HC10 membrane $(1.0{\mu}m)$ were BT=10 sec and BT=20 sec, respectively. Then, higher TMP should increase the driving force, and could produce more VT. Average rejection rates of pollutants were higher than 95.4% for turbidity, $12.7{\sim}20.1%\;for\;COD_{Mn},\;0.0{\sim}6.4%\;for\;NH_3-N,\;1.9{\sim}4.6%$ for T-N and $34.9{\sim}88.4%$ for T-P.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.4 s.181
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• pp.153-161
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• 2006

Micro-forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). Micro-forming of $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk metallic glass(BMG) as a candidate material for this developing process are feasible at a relatively low stress in the supercooled liquid state without any crystallization during hot deformation. In this study, micro- formability of a representative bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$. was investigated for micro-forging of U-shape pattern. Micro-formability was estimated by comparing $R_f$ values ($=A_f/A_g$), where $A_g$ is cross-sectional area of U groove, and $A_f$ the filled area by material. Micro-forging process was simulated and analyzed by applying finite element method. FEM simulation results showed reasonable agreement with the experimental results when the material properties and simulation conditions such as top die speed, remeshing criteria and boundary conditions were tightly controlled. The micro-formability of $Zr_{62}Cu_{17}Ni_{13}Al_8$ was increased with increasing load and time in the temperature range of the supercooled liquid state. Also, FEM simulation using a commercial software, DEFORM was confirmed to be applicable for the optimization of micro-forming process.

• Progress in Medical Physics
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• v.18 no.1
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• pp.48-54
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• 2007

This study is to develope a phantom for MOSFET (Metal Oxide Semiconductors Field Effect Transistors) dosimetry and compare the dosimetric properties of standard MOSFET and microMOSFET with the phantom. In this study, the developed phantom have two shape: one is the shape of semi-sphere with 10cm diameters and the other one is the flat slab of $30{\times}30cm$with 1 cm thickness. The slab phantom was used for calibration and characterization measurements of reproducibility, linearity and dose rate dependency. The semi-sphere phantom was used for angular and directional dependence on the types of MOSFETs. The measurements were conducted under $10{\times}10cm^2$ fields at 100cm SSD with 6MV photon of Clinac (21EX, Varian, USA). For calibration and reproducibility, five standard MOSFETS and microMOSFETs were repeatedly Irradiated by 200cGy five times. The average calibration factor was a range of $1.09{\pm}0.01{\sim}1.12{\pm}0.02mV/cGy$ for standard MOSFETS and $2.81{\pm}0.03{\sim}2.85{\pm}0.04 mV/cGy$ for microMOSFETs. The response of reproducibility in the two types of MOSFETS was found to be maximum 2% variation. Dose linearity was evaluated In the range of 5 to 600 cGy and showed good linear response with $R^2$ value of 0.997 and 0.999. The dose rate dependence of standard MOSFET and microMOSFET was within 1% for 200 cGy from 100 to 500MU/min. For linearity, reproducibility and calibration factor, two types of MOSFETS showed similar results. On the other hand, the standard MOSFET and microMOSFET were found to be remarkable difference in angular and directional dependence. The measured angular dependence of standard MOSFET and microMOSFET was also found to be the variation of 13%, 10% and standard deviation of ${\pm}4.4%,\;{\pm}2.1%$. The directional dependence was found to be the variation of 5%, 2% and standard deviation of ${\pm}2.1%,\;{\pm}1.5%$. Therefore, dose verification of radiation therapy used multidirectional X-ray beam treatments allows for better the use of microMOSFET which has a reduced angular and directional dependence than that of standard MOSFET.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.6
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• pp.8-13
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• 2015

Recently, Illumination industry of LED module has been focused to industry technology for energy conservation of nation. The LED device is excellent to power efficiency due to semiconductor light source element. And the application to the lighting circuit technology can be designed to the sensitive lighting system for human sensitivity control. In this paper, as a process for analyzing the operating temperature of standardized electronic device including LED device has analyzed about fusing character with in designed micro fuse for electronic device protection from the over current. Using the de-rating technique, which is performed to micro fuse fusing test in the range of $-30^{\circ}C{\sim}120^{\circ}C$ thermostatic chamber. To the output data in each temperature zone, it is performed to first-order linear fitting. Additionally, applying the resistance temperature coefficient and statistical data for the reliable analysis has derived to the metal element resistance of micro fuse with temperature change of the thermostatic chamber. As a research result, The changed temperature effect of thermostatic chamber was confirmed regarding fusing time change.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.589-592
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• 2005

Micro-forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). Micro-forming of $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk metallic glass(BMG) as a candidate material for this developing process are feasible at a relatively low stress in the supercooled liquid state without any crystallization during hot deformation. In this study, micro-formability of a representative bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$, was investigated for micro-forging of U-shape pattern. Micro-formability was estimated by comparing $R_f$ values $(=A_f/A_g)$, where Ag is cross-sectional area of U groove, and $A_f$ the filled area by material. Microforging process was simulated and analyzed by applying finite element method. FEM simulation results should reasonable agreement with the experimental results when the material properties and simulation conditions such as top die speed, remeshing criteria and boundary conditions tightly controlled. The micro-formability of $Zr_{62}Cu_{17}Ni_{13}Al_8$ was increased with increasing load and time in the temperature range of the supercooled liquid state. Also, FEM Simulation using DEFORM was confirmed to be applicable for the micro-forming process simulation.

• Transactions of Materials Processing
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• v.22 no.1
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• pp.23-29
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• 2013

In this study, a micro/nano-random-pattern-structure surface was machined by electric discharge machining (EDM) followed by replicating the EDM surface with a silicone elastomer having low energy and greater hydrophobicity. The variation of hydrophobicity was of prime interest and was examined as a function of the surface roughness of the replicated silicone elastomer. The hydrophobicity was evaluated by the water contact angle (WCA) measured on the relevant surface. For the experiments, the original surfaces were machined by die sinking electric discharge machining (DS-EDM) and wire cutting electric discharge machining (WC-EDM). The ranges of surface roughness were Ra $0.8{\sim}19{\mu}m$ for the DS-EDM and Ra $0.5{\sim}4.7{\mu}m$ for the WC-EDM. In order to fabricate a hydrophobic surface, the EDM surfaces were directly replicated using a liquid-state silicone elastomer, which was thermally cured. The measured WCA on the replicated surfaces for DS-EDM was in the range of $115{\sim}130^{\circ}$ and for WC-EDM the WCA was in the range of $123{\sim}150^{\circ}$. Additionally, the dynamic hydrophobicity was evaluated by measuring an advancing and a receding WCA on the replicated silicone elastomer surfaces.

• Proceedings of the KIEE Conference
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• 2001.04a
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• pp.15-18
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• 2001

SMES consists of superconducting magnet, power converter and cryostat and HTS current lead. The prototype cryostat with HTS current leads and refrigerators was designed and manufactured for micro-SMES. HTS current lead with cryocooler was measured the temperature rise under dc current. The cryostat was evaluated the helium boil-off and mechanical stress during transfer and vibration test. These results will be applied to develope the micro-SMES system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.771-775
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• 2015

In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with $10{\mu}m$ linewidth are fabricated on $180mm{\times}180mm$ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with $10{\sim}20{\mu}m$, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

• Proceedings of the KIEE Conference
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• 2003.11c
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• pp.959-961
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• 2003

In this paper, we describe implemented DMAC (Direct Memory Access Controller) architecture on Altera's $Excalibur^{TM}$ that includes industry-standard $ARM922T^{TM}$ 32-bit RISC processor core operating at 200 MHz. We implemented DMAC based on AMBA (Advanced Micro-controller Bus Architecture) AHB (Advanced Micro-performance Bus) interface. Implemented DMAC has 8-channel and can extend supportable channel count according to user application. We used round-robin method for priority selection. Implemented DMAC supports data transfer between Memory-to-Memory, Memory-to-Peripheral and Peripheral-to-Memory. The max transfer count is 1024 per a time and it can support byte, half-word and word transfer according to AHB protocol (HSIZE signals). We implemented with VHDL and functional verification using $ModelSim^{TM}$. Then, we synthesized using $LeonardoSpectrum^{TM}$ with Altera $Excalibur^{TM}$ library. We did FPGA P&R and targeting using $Quartus^{TM}$. We can use implemented DMAC module at any system that needs high speed and broad bandwidth data transfers.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.51-56
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• 2007

A $CO_2$ laser overlay was conducted by using a Fe-based powder on the AC2B aluminum substrate. Cracks and intermetallic compounds (IMC) were observed inconsistently along the interface between the overlay and post-molten layer. A scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS) detected some Fe-rich IMC ($Fe_3Al$, FeAl) as well as the brittle Al-rich IMC ($Fe_2Al_5,\;FeAl_3$). Micro vickers hardness proved the formation of Al-rich IMC ($FeAl_3$) along the interface by showing HV0.1 $800{\sim}900$. Furthermore, nano indentation was successfully applied to investigate the behavior of IMC more precisely than the micro vickers hardness.