• Journal of the Korean institute of surface engineering
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• v.37 no.3
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• pp.146-151
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• 2004

Indium tin oxide (ITO) is widely used to make a transparent conducting film for various display devices and opto-electric devices. In this study, ITO films on glass substrate were fabricated by inductively coupled plasma (ICP) assisted dc magnetron sputtering. A two-turn rf coil was inserted in the process chamber between the substrate and magnetron for the generation of ICP. The substrates were not heated intentionally. Subsequent post-annealing treatment for as-deposited ITO films was not performed. Low-temperature deposition technique is required for ITO films to be used with heat sensitive plastic substrates, such as the polycarbonate and acrylic substrates used in LCD devices. The surface roughness of the ITO films is also an important feature in the application of OLEDs along with the use of a low temperature deposition technique. In order to obtain optimum ITO thin film properties at low temperature, the depositions were carried out at different condition in changing of Ar and $O_2$ gas mixtures, ICP power. The electrical, optical and structural properties of the deposited films were characterized by four-point probe, UV/VIS spectrophotometer, atomic force microscopy(AFM) and x-ray diffraction (XRD). The electrical resistivity of the films was -l0$^{-4}$ $\Omega$cm and the optical transmittance in the visible range was ＞85%. The surface roughness ( $R_{rms}$) was -20$\AA$.>.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.321-323
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• 2012

유기 발광 다이오우드는(OLEDs) 자체 발광 소자로써 높은 시야각, 높은 효율, 그리고 빠른 응답속도 등의 장점을 가지고 있어 차세대 디스플레이 및 조명 소자로서 많은 연구가 진행되고 있다. 특히 유기 발광 다이오우드는 차세대 반도체 조명 소자로서 조명의 패러다임을 바꿀 수 있는 기술로 인식되고 있다. 하지만, 유기 발광 다이오우드 조명의 상용화를 위해서는 가격 경쟁력을 갖추는 것이 시급하며, 이를 위해 저가 공정 개발이 필요하다. 본 연구에서는 유기발광 다이오우드 조명 제작에 필수적인 전면 전극 및 절연막 증착 공정을 기존의 노광 공정이 아닌 shadow mask 기술을 적용하여 형성하였다. 먼저 유리 기판 상에 150 nm 두께의 ITO 막을 shadow mask를 이용하여 증착하였다. 기존 공정에서는 노광 및 식각 공정을 이용하여 증착하는 것이 일반적이며, 광학적, 전기적 특성 또한 타 공정 방법에 비해 우수하다. 하지만 일련의 복잡한 공정으로 인해 제조 원가를 상승 시키는 단점이 있다. Fig. 1은 shadow mask를 이용하여 ITO를 증착을 수행한 공정의 모식도이다. ITO 박막 증착 후 표면 거칠기 제어 및 면저항 제어를 위해 O2 plasma 처리와 RTA 공정을 추가 수행하였다. Fig. 2(a)는 플라즈마 처리 및 열처리 공정 수행 후에 측정한 표면 AFM 사진이다. 열처리 및 플라즈마 처리 후에 ITO 박막의 표면 거칠기는 10배 이상 향상되었으며, 이는 유기 발광 다이오우드 조명 소자의 전면 투명 전극으로 사용되기에 적합한 값이다. 또한 전기적 특성 중 하나인 면저항 값은 열처리 및 플라즈마 처리 전/후의 값에서 많은 차이를 보인다. 표면 거칠기가 향상됨에 따라 면저항 값 역시 향상되는 결과를 보여주는데, 표면 처리전후의 면저항 값은 각각 28.17, 13.18 ${\Omega}/{\Box}$이다. 일반적으로 유기 발광 다이오우드의 전면 투명 전극으로 사용되기 위해서는 15 ${\Omega}/{\Box}$이하의 면저항 값이 필요한데, 표면 처리 후의 면저항값들은 이로한 조건을 만족한다. Fig. 3은 shadow mask 기술을 이용하여 절연막까지 형성한 유기 발광 다이오우드 소자의 전자 현미경 사진으로, 기존의 공정을 이용한 경우와 큰 차이는 없으며, 다만 shadow tail이 약 $30{\mu}m$ 정도 발생함을 확인할 수 있다. 절연막의 특성 평가 기준인 누설 전류 밀도는 $10-5A/cm^2$으로 기존의 공정을 이용한 경우에 비해 95% 수준으로서 shadow mask를 이용한 공정이 기존의 노광 및 식각 공정을 이용한 경우에 비해 공정 수는 9개가 단축됨에도 불구하고, 각 증착 박막의 특성에는 큰 차이가 없음을 알 수 있다.

• Current Photovoltaic Research
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• v.5 no.1
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• pp.20-24
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• 2017

Recently, three-dimensional (3D) light harvesting structures are highly attracted because of their high light harvesting capacity and charge collection efficiencies. In this study, we have fabricated $Cu_2ZnSn(S_xSe_{1-x})_4$ based 3D thin film solar cells on PR patterned Molybdenum (Mo) substrates using photolithography technique. Specifically, Mo patterns were deposited on PR patterned Mo substrates by sputtering and the thin Cu-Zn-Sn stacked layer was deposited over this Mo patterns by sputtering technique. The stacked Zn-Sn-Cu precursor thin films were sulfo-selenized to form CZTSSe pattern. Finally, CZTSSe absorbers were coated with thin CdS layer using chemical bath deposition and ZnO window layer was deposited over CZTSSe/CdS using DC sputtering technique. Fabricated 3-D solar cells were characterized by X-ray diffraction (XRD), X-ray fluorescence (XRF) analysis, Field-emission scanning electron microscopy (FE-SEM) to study their structural, compositional and morphological properties, respectively. The 3% efficiency is achieved for this kind of solar cell. Further efforts will be carried out to improve the performance of solar cell through various optimizations.

• Korean Journal of Materials Research
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• v.7 no.11
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• pp.986-990
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• 1997

LED와 LD의 수명과 효율은 결정에 존재하는 결함의 밀도에 반비례하며, 이러한 결함의 밀도는 적당한 기판을 사용하거나, 기판의 표면을 적절하게 제어함으로써 줄일 수 있다. GaN성장시 원자 단위의 매끄러운 표면은 완충충 성장이나 질화처리를 함으로써 얻어질 수 있다. 이렇게 얻어진 원자 단위의 매끄러운 표면에 의해 기판과 박막상이의 계면 자유에너지가 감소하기 때문에 2D성장이 촉진된다. 사파이어(AI$_{2}$O$_{3}$(0001))기판을 사용한 GaN 왕충충성장과 진화처리에 대한 최적조건은 AFM(Atomic Force Microscope)측정 결과에 의해 결정되었다. AFM에 의해 얻어진 표면 평활도의 개념은 사파이어 기판을 사용한 GaN박막성장의 최적조건을 결정하는 데 있어서 높은 신뢰도를 가질 수 있다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.193-197
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• 2002

The tribological properties and van der Waals attractive forces and the thermal stability of films are very important characteristics of highly hydrophobic fluorocarbon (FC) films for the long-term reliability of nano system. The effect of thermal annealing on films and van der Waals attractive forces and friction coefficient of films have been investigate d in this study. It was coated Al wafer which was treated O2 and Ar that ocatfluorocyclobutane ($C_4_{8}$) and Ar were supplied to the CVD chamber in the ratio of 2:3 for deposition of FC Films. Static contact angle and dynamic contact angle were used to characterize FC films. Thickness of films was measured by variable angle spectroscopy ellipsometer (VASE). Nanotribological data was got by atomic force microscopy (AFM) to measure roughness, lateral force microscopy (LFM) to measure friction force, and force vs. distance (FD) curve to evaluate adhesion force. FC films were cured in N2 and vacuum. The film showed the slight changes in its properties after 3 hr annealing. FTIR ATR studies showed the decrease of C-F peak intensity in the spectra as the annealing time increased. A significant decrease of film thickness has been observed. The friction force of Al surface was at least thirty times higher than ones with FC films. The adhesive force of bare Al was greater than 100 nN. After deposit FC films adhesive force was decreased to 40 nN. The adhesive force of films was decreased down to 10 nN after 24 hr annealing. During 24 hr annealing in $N_2$and vacuum at $100^{\circ}C$ film properties were not changed so much.

• Korean Journal of Crystallography
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• v.8 no.1
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• pp.33-37
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• 1997

The optical properties of (1210) GaN epitaxy films grown on the (1012) $\alpha-A1_2O_3$ substrates have been studied. The hetero-epitaxy films were grown by the halide vapor phase epitaxy (HVPE) method using $Ga/HC1/NH_3/He$ system at $990^{\circ}C$. XRD, RHEED and SEM are used for the identification of the hetero-epitaxy films structure and surface morphology. The confirmed (1210) GaN epitaxy films were characterized by PL and Raman. By the Raman scattering, the active phonon modes of single-phase GaN films are varied with the arrangement of both polarization and propagation directions of laser beam with reference to the axis in single-phase crystal films. The Y(Z, Y & Z) X geometry allows scattering pat-terns of $A_1(TO)=533\;cm^{-1},\;E_1(TO)=559\;cm^{-1}\;and\;E_2=568 cm^{-1}$ modes, whereas in the Z(Y, Y & Z) X geometry the only $E_2$ mode are observed.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.49-53
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• 2011

High-speed Cu filling into a through-silicon-via (TSV) and simplification of bumping process by electroplating for three dimensional stacking of Si dice were investigated. The TSV was prepared on a Si wafer by deep reactive ion etching, and $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to increase the filling rate of Cu into the via, a periodic-pulse-reverse wave current was applied to the Si chip during electroplating. In the bumping process, Sn-3.5Ag bumping was performed on the Cu plugs without lithography process. After electroplating, the cross sections of the vias and appearance of the bumps were observed by using a field emission scanning electron microscope. As a result, voids in the Cu-plugs were produced by via blocking around via opening and at the middle of the via when the vias were plated for 60 min at -9.66 $mA/cm^2$ and -7.71 $mA/cm^2$, respectively. The Cu plug with a void or a defect led to the production of imperfect Sn-Ag bump which was formed on the Cu-plug.

• Journal of the Korean institute of surface engineering
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• v.41 no.3
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• pp.83-87
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• 2008

This study described the effects of RF power, DC bias voltage, chamber pressure and gas mixing ratio on the etch rates of TiN thin film and selectivity of TiN thin film to $SiO_2$ with $BCl_3$/Ar gas mixture. When the gas mixing ratio was $BCl_3$(20%)/Ar(80%) with other conditions were fixed, the maximum etch rate of TiN thin film was 170.6 nm/min. When the DC bias voltage increased from -50 V to -200 V, the etch rate of TiN thin film increased from 15 nm/min to 452 nm/min. As the RF power increased and chamber pressure decreased, the etch rate of TiN thin film showed an increasing tendency. When the gas mixing ratio was $BCl_3$(20%)/Ar(80%) under others conditions were fixed, the intensity of optical emission spectra from radical or ion such as Ar(750.4 nm), $Cl^+$(481.9 nm) and $Cl^{2+}$(460.8 nm) was highest. The TiN thin film was effectively removed by the chemically assisted physical etching in $BCl_3$/Ar ICP plasma.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.04a
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• pp.78-80
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• 2006

The hybrid thin-film (HTF) passivation layer composed of the Ultra Violet (UV) curable acrylate layer and MS-31 (MgO:$SiO_2$=3:1wt%) layer was adopted in organic light emitting device (OLEO) to protect organic light emitting materials from penetrations of oxygen and water vapors. The results showed that the HTF layer possessed a very low WVTR value of lower than $0.007gm/m^{2+}day$ at $37.8^{\circ}C$ and 100% RH. This value was within the limited range of the sensitivity of WVTR measurements. And the lifetime of the HTF passivated device became almost three times longer than that of the bare device. The HTF on the OLEO was found to be very effective in protect what from the penetrations of oxygen and moisture.