• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.225-225
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• 2011

The dielectric and optical properties of GaInZnO (GIZO), HfInZnO (HIZO) and InZnO (IZO) thin films on glass by RF magnetron sputtering method were investiged using reflection electron energy loss spectroscopy (REELS). The band gap was estimated from the onset values of REELS spectra. The band gaps of GIZO, HIZO and IZO thin films are 3.1 eV, 3.5 eV and 3.0 eV, respectively, Hf and Ga incorporated into IZO results in an increase in the energy band gap of IZO by 0.5 eV and 0.1 eV. The dielectric functions were determined by comparing the effective cross section determined from experimental REELS with a rigorous model calculation based on the dielectric response theory, using available software package, good agreement between the experimental and fitting results gives confidence in the accuracy of the determined dielectric function. The main peak of Energy Loss Function (ELF) obtained from IZO shows at 18.42 eV, which shifted to 19.43 eV and 18.15 eV for GIZO and HIZO respectively, because indicates the corporation of cation Ga and Hf in the composition. The optical properties represented by the dielectric function e, the refractive index n, the extinction coefficient k, and the transmission coefficient, T of HIZO and IZO thin films were determined from a quantitative analysis of REELS. The transmission coefficient was increased to 93% and decreased to 87% in the visible region with the incorporation of Hf and Ga in the IZO compound.

• Korean Journal of Mineralogy and Petrology
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• v.36 no.3
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• pp.185-197
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• 2023

The Gubong Au-Ag deposit consists of eight lens-shaped quartz veins. These veins have filled fractures along fault zones within Precambrian metasedimentary rock. This has been one of the largest deposits in Korea, and is geologically a mix of orogenic-type and intrusion-related types. Korea Mining Promotion Corporation drilled into a quartz vein (referred to as the No. 6 vein) with a width of 0.9 m and a grade of 27.9 g/t Au at a depth of -728 ML by drilling (No. 90-12) in the southern site of the deposit, To further investigate the potential redevelopment of the No. 6 vein, another drilling (No. 04-1) was carried out in 2004. In 2004, samples (wallrock, wallrock alteration and quartz vein) were collected from the No. 04-1 drilling core site to study the occurrence and chemical composition of Ti-bearing minerals (ilmenite, rutile). Rutile from mineralized zone at a depth of -275 ML occur minerals including K-feldspar, biotite, quartz, calcite, chlorite, pyrite in wallrock alteration zone. Ilmenite and rutile from ore vein (No. 6 vein) at a depth of -779 ML occur minerals including white mica, chlorite, apatite, zircon, quartz, calcite, pyrrhotite, pyrite in wallrock alteration zone and quartz vein. Based on mineral assemblage, rutile was formed by hydrothermal alteration (chloritization) of Ti-rich biotite in the wallrock. Chemical composition of ilmenite has maximum values of 0.09 wt.% (HfO₂), 0.39 wt.% (V₂O₃) and 0.54 wt.% (BaO). Comparing the chemical composition of rutile at a depth -275 ML and -779 ML, Rutile at a depth of -779 ML is higher contents (WO₃, FeO and BaO) than rutile at a depth of -275 ML. The substitutions of rutile at a depth of -275 ML and -779 ML are as followed : rutile at a depth of -275 ML Ba²⁺ + Al³⁺ + Hf⁴⁺ + (Nb⁵⁺, Ta⁵⁺) ↔ 3Ti⁴⁺ + Fe²⁺, 2V⁴⁺ + (W⁵⁺, Ta⁵⁺, Nb⁵⁺) ↔ 2Ti⁴⁺ + Al³⁺ + (Fe²⁺, Ba²⁺), Al³⁺ + V⁴⁺+ (Nb⁵⁺, Ta⁵⁺) ↔ 2Ti⁴⁺ + 2Fe²⁺, rutile at a depth of -779 ML 2 (Fe²⁺, Ba²⁺) + Al³⁺ + (W⁵⁺, Nb⁵⁺, Ta⁵⁺) ↔ 2Ti⁴⁺ + (V⁴⁺, Hf⁴⁺), Fe²⁺ + Al³⁺ + Hf ⁴⁺ + (W⁵⁺, Nb⁵⁺, Ta⁵⁺) ↔ 2Ti⁴⁺ + V⁴⁺ + Ba²⁺, respectively. Based on these data and chemical composition of rutiles from orogenic-type deposits, rutiles from Gubong deposit was formed in a relatively oxidizing environment than the rutile from orogenictype deposits (Unsan deposit, Kori Kollo deposit, Big Bell deposit, Meguma gold-bearing quartz vein).

• Journal of IKEEE
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• v.26 no.4
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• pp.633-638
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• 2022

Rencently, neuromorphic systems of spiking neural networks (SNNs) that imitate the human brain have attracted attention. Neuromorphic technology has the advantage of high speed and low power consumption in cognitive applications and processing. Resistive random-access memory (RRAM) for SNNs are the most efficient structure for parallel calculation and perform the gradual switching operation of spike-timing-dependent plasticity (STDP). RRAM as synaptic device operation has low-power processing and expresses various memory states. However, the integration of RRAM device causes high switching voltage and current, resulting in high power consumption. To reduce the operation voltage of the RRAM, it is important to develop new materials of the switching layer and metal electrode. This study suggested a optimized new structure that is the Metal/Al₂O₃/HfO_x/SWCNTs/N+silicon (MOCS) with single-walled carbon nanotubes (SWCNTs), which have excellent electrical and mechanical properties in order to lower the switching voltage. Therefore, we show an improvement in the gradual switching behavior and low-power I/V curve of SWCNTs-based memristors.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.186-186
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• 2010

소자의 축소화에 따라 floating gate 형의 flash 메모리 소자는 얇은 게이트 절연막 등의 이유로, 이웃 셀 간의 커플링 및 게이트 누설 전류와 같은 문제점을 지니고 있다. 이러한 문제점을 극복하기 위해 charge trap flash 메모리 (CTF) 소자가 연구되고 있지만, CTF 메모리 소자는 쓰기/지우기 속도와 데이터 보존 성능간의 trade-off 관계와 같은 문제점을 지니고 있다. 최근, 이를 극복하기 위한 방안으로, 다른 유전율을 갖는 유전체들을 적층시킨 터널 절연막을 이용한 Tunnel Barrier Engineered (TBE) 기술이 주목 받고 있다. 따라서, 본 논문에서는 TBE 기술을 적용한 MIS-capacitor를 높은 유전율을 가지는 Al2O3와 HfO2를 이용하여 제작하였다. 이를 위해 먼저 Si 기판 위에 Al2O3 /HfO2 /Al2O3 (AHA)를 Atomic Layer Deposition (ALD) 방법으로 약 2/1/3 nm의 두께를 가지도록 증착 하였고, Aluminum을 150 nm 증착 하여 게이트 전극으로 이용하였다. Capacitance-Voltage와 Current-Voltage 특성을 측정, 분석함으로써, AHA 구조를 가지는 터널 절연막의 전기적인 특성을 확인 하였다. 또한, high-k 물질을 이용한 터널 절연막을 급속 열처리 공정 (Rapid Thermal Annealing-RTA) 과 H2/N2분위기에서 후속열처리 공정 (Post-RTA)을 통하여 전기적인 특성을 개선 시켰다. 적층된 터널 절연막은 열처리를 통해 터널링 전류의 민감도의 향상과 함께 누설전류가 감소됨으로서 우수한 전기적인 특성이 나타남을 확인하였으며, 적층된 터널 절연막 구조와 적절한 열처리를 이용하여 빠른 쓰기/지우기 속도와 전기적인 특성이 향상된 비휘발성 메모리 소자를 기대할 수 있다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.279-279
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• 2011

나노 입자를 이용한 비휘발성 메모리 소자의 전기적 특성 향상을 위하여 일함수가 Si 보다 큰 금속, 금속산화물, 금속 실리사이드 나노입자를 이용한 다양한 형태의 메모리 구조가 제안되어져 왔다.[1] 특히 이와 같은 나노 부유 게이트 구조에서 터널 절연막의 구조를 소자의 동작 속도를 결정하는데 이는 터널링 되어 주입되는 전자의 확률에 의존하기 때문이다. 양자 우물에 국한된 전하가 누설되지 않으면서 주입되는 전자의 터널링 확률을 증가시키기 위하여, dielectric constant 와 barrier height를 고려한 다양한 구조의 터널 절연막의 형태가 제안 되었다.[2-3] 특히 낮은 전계에서도 높은 터널링 확률은 메모리 소자의 동작 속도를 향상시킬 수 있다. 본 연구에서는 n형 Si 기판위에 Si3N4 및 HfAlO를 각각 1.5 nm 및 3 nm 로 atomic layer deposition 방법으로 증착하였으며 3~5 nm 지름을 가지는 $TiSi_2$ 및 $WSi_2$ 나노 입자를 형성한 후 컨트롤 절연막인 $SiO_2$를 ultra-high vacuum sputtering을 사용하여 20 nm 두께로 형성 하였다. 마지막으로 $200{\mu}m$ 지름을 가지는 Al 전극을 200 nm 두께로 형성하여 나노 부유 게이트 커패시터를 제작하였다. 제작된 소자는 Agilent E4980A precision LCR meter 및 HP 4156A precision semiconductor parameter analyzer 를 사용하여 전기용량-전압 및 전류-전압 특성분석을 하여 전하저장 특성 및 제작된 소자의 터널링 특성을 확인 하여 본 연구를 통하여 제작된 나노 부유 게이트 커패시터 구조가 메모리 소자응용이 가능함을 확인하였다.

• Journal of the Korean earth science society
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• v.27 no.1
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• pp.49-60
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• 2006

The purpose of this study is to investigate geochemical characteristics for stream sediments in the Naju area. We collected 139 stream sediments samples from primary channels. Samples were dried slowly in the laboratory and chemical analysis was carried out using XRF. ICP-AES and NAA. In order to investigate geochemical characteristics, the geological groups categorized into granitic gneiss area, schist area, granite area, arenaceous rock area, tuff area, andesite area, and rhyolite area. Average contents of major elements for geological groups are $SiO_2\;58.37{\sim}66.06wt.%,\;Al_2O_3\;13.98{\sim}18.41wt.%,\;Fe_2O_3\;4.09{\sim}6.10wt.%,\;CaO\;0.54{\sim}1.33wt.%,\;MgO\;0.86{\sim}1.34wt.%,\;K_2O\;2.38{\sim}4.01wt.%,\;Na_2O\;0.90{\sim}1.32wt.%,\;TiO_2\;0.82{\sim}1.03wt.%,\;MnO\;0.09{\sim}0.15wt.%,\;P_2O_5\;0.11{\sim}0.18wt.%$. According to the comparison of average contents of major elements, $Al_2O_3\;and\;K_2O$ are higher in granitic gneiss area, $Fe_2O_3,\;CaO,\;P_2O_5$ are higher in tuff area, MgO and $TiO_2$ are higher in andesite area, $Na_2O_$ is higher in rhyolite area, $SiO_2$, and MnO are higher in arenaceous rock area. Average contents of minor and rare earth elements for geological groups are $Ba\;1278{\sim}1469ppm,\;Be\;1.1{\sim}1.5ppm,\;Cu\;18{\sim}25ppm,\;Nb\;25{\sim}37ppm,\;Ni\;16{\sim}25ppm,\;Pb\;21{\sim}28ppm,\;Sr\;83{\sim}155ppm,\;V\;64{\sim}98ppm,\;Zr\;83{\sim}146ppm,\;Li\;32{\sim}45ppm,\;Co\;7.2{\sim}12.7ppm,\;Cr\;37{\sim}76ppm,\;Cs\;4.8{\sim}9.1ppm,\;Hf\;7.5{\sim}25ppm,\;Rb\;88{\sim}178ppm,\;Sc\;7.7{\sim}12.6ppm,\;Zn\;83{\sim}143ppm,\;Pa\;11.3{\sim}37ppm,\;Ce\;69{\sim}206ppm,\;Eu\;1.1{\sim}1.5ppm,\;Yb\;1.8{\sim}4.4ppm$. According to the comparison of average contents of minor and rare earth elements for geological groups, Pb, Li, Cs, Hf, Rb, Sb, Pa, Ce, Eu, and Yb are higher in granitic gneiss area; Ba, Co, and Cr in schist area; Nb, Ni, and Zr in arenaceous rock area; Sr in tuff area: and Be, Cu, V, Sc, and Zn are such in andesite area.

• Proceedings of the Korean Vacuum Society Conference
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• 2008.08a
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• pp.162-162
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• 2008

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.7
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• pp.1042-1048
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• 1990

The approximations of charge relationships at normally doped semiconductor interfaces were qualitatively derived basis on electrical neutrality conditions. Effects of ion adsorptions, activation processes, interfacial structures, rectifying phenomena, and effects of surface potential barriers at the p- and n-Si/CsNO3 aqueous electrolytes, and the p-Si/(1HF:3HNO3:6H2O) electrolyte solutions were investigated using a cyclic voltammetric method. The space charge acts the most important role for the pn junction structures, the rectifying phenomena, and the activation processes. The Current-Voltage (I-V) characteristics curves significantly depend on developing of the Helmholtz double layers and charging of the show surface states during the activation processes. A linear Current-Voltage characteristics region was observed at the p-Si/(1HF:3HNO3: 6H2O) electrolyte solution interface.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.410-414
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• 2013

We report the wet etching of titanium nickel (TiNi) films for the production of nano-electro-mechanical (NEM) device. $SiO_2$ and $Si_3N_4$ have been selected as sacrificial layers of TiNi metal and etched with polyethylene glycol and hydrofluoric acid (HF) mixed solution. Volume percentage of HF are varied from 10% to 35% and the etch rate of the $SiO_2$, $Si_3N_4$ and TiNi are reported here. Within the various experiment results, 15% HF mixed polyethylene glycol solution show highest etch ratio between sacrificial layer and TiNi metal. Especially $Si_3N_4$ films shows high etch ratio with TiNi films. Wet etching results are measured with SEM inspection. Therefore, this experiment provides a novel method for TiNi in the nano-electro-mechanical device.

• Korean Journal of Materials Research
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• v.11 no.8
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• pp.629-635
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• 2001

To improve the ductility of $A1_3Hf$ intermetallics, which are the potential high temperature structural materials, the mechanical alloying behavior. the effect of Cu addition on the $Ll_2$ phase formation and the behavior of vacuum hot-pressed consolidation were investigated. During the mechanical alloying by SPEX mill, the $Ll_2 A1_3Hf$ intermetallics with the grain size of 7~8nm was formed after 6 hours of milling in Al-25at.%Hf system. The $Ll_2$ Phase of Al_3Hf$ intermetallics with the addition of 12.5at.%Cu, similar to that of the binary Al-25at.% Hf, was formed, but the milling time necessary for the formationof the $Ll_2$ phase was delayed form 6 hours to 10 hours. The lattice parameter of ternary $Ll_2(Al+Cu)_3Hf$ intermetallics decreased with the increase of Cu content. The onset temperature of $Ll_2$ to $D0_{23}$ phase in $Al_3Hf$ intermetallics was around 38$0^{\circ}C$, the temperature upon completion varied from 48$0^{\circ}C$ to 5$50^{\circ}C$ as the annealing time. The onset temperature of $Ll_2$ to $D0_{23}$ phase transformation in $(Al+ Cu)_3Hf$ intermetallics increased with the amount of Cu and the highest onset temperature of $700^{\circ}C$ was achieved by the Cu addition of 10at.%. The relative density increased from 89% to 90% with the Cu addition of 10at.% in $Al_3Hf$ intermetallics hot-pressed in vacuum under 750MPa at 40$0^{\circ}C$ for 3 hours. The relative density of 92.5% was achieved without the phase transformation and the grain growth as the consolidation temperature increased from 40$0^{\circ}C$ to 50$0^{\circ}C$ in $(Al+Cu)_3Hf$ intermetallics hot-pressed in vacuum under 750MPa for 3 hours.