• Korean Journal of Soil Science and Fertilizer
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• v.47 no.6
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• pp.457-463
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• 2014

This study was carried out to find out major factors to mitigate carbon emission using Life Cycle Assessment (LCA). System boundary of LCA was confined from sowing to packaging during vegetable production. Input amount of agri-materials was calculated on 2007 Income reference of white radish, chinese cabbage and chive produced at open field and film house published by Rural Development Administration. Domestic data and Ecoinvent data were used for emission factors of each agri-material based on the 1996 IPCC guideline. Carbon footprint of white radish was 0.19 kg $CO_2kg^{-1}$ at open fields, 0.133 kg $CO_2kg^{-1}$ at film house, that of chinese cabbage was 0.22 kg $CO_2kg^{-1}$ at open fields, 0.19 kg $CO_2kg^{-1}$ at film house, and that of chive was 0.66 kg $CO_2kg^{-1}$ at open fields and 1.04 kg $CO_2kg^{-1}$ at film house. The high carbon footprint of chive was related to lower vegetable production and higher fuel usage as compared to white radish and Chinese cabbage. The mean proportion of carbon emission was 35.7% during the manufacturing byproduct fertilizer; white radish at open fields was 50.6%, white radish at film house 13.1%, Chinese cabbage at outdoor 38.4%, Chinese cabbage at film house 34.0%, chive at outdoor 50.6%, and chive at film house 36.0%. Carbon emission, on average, for the step of manufacturing and combustion accounted for 16.1% of the total emission; white radish at open fields was 4.3%, white radish at film house 15.6%, Chinese cabbage at open fields 6.9%, Chinese cabbage at film house 19.0%, chive at open fields 12.5%, and chive at film house 29.1%. On the while, mean proportion of carbon footprint for the step of $N_2O$ emission was 29.2%; white radish at open fields was 39.2%, white radish at film house 41.9%, Chinese cabbage at open fields 34.4%, Chinese cabbage at film house 23.1%, chive at open fields 28.8%, and chive at film house 17.1%. Fertilizer was the primary factor and fuel was the secondary factor for carbon emission among the vegetables of this study. It was suggested to use Heug-To-Ram web-service system, http://soil.rda.go.kr, for the scientific fertilization based on soil testing, and for increase of energy efficiency to produce low carbon vegetable.

• Korean Journal of Food Science and Technology
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• v.32 no.3
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• pp.659-667
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• 2000

Quality attributes of fresh-cut green onion(Allium fistulosum L.) as affected by rinsing and packaging were investigated in terms of flesh weight, color, viable cell counts, sensory properties during storage at $10^{\circ}C$. Fresh green onions were trimmed, cut, and rinsed with cold water(approximately $5^{\circ}C$) as well as chlorine solution(100 mg/L) and then packaged in low density polyethylene film pouches of $63\;{\mu}m$ thickness. Rinsing treatments with cold water or chlorine solution did not significantly influence changes in microbial populations but sensory characteristics, resulting in cut green onions of better visual quality as compared to the control without rinsing. Fresh-cut green onions were also rinsed with cold water and packaged in sealed bags of low density polyethylene films with different thickness(22, 36, $63\;{\mu}m$), and stored at $10^{\circ}C$ for 18 days. Thickness of polyethylene film was a significant factor for microorganisms populations and sensory attributes. Mesophilic aerobic bacterial count after 13 days for the control, packed in punched film bags, was $3.07{\times}10^6}$ CFU/g, while those for samples in hermetically sealed bags ranged only $1.74{\sim}2.02{\times}10^5}$ CFU/g. Gas composition within the sealed packages changed from normal air to about $1.3{\sim}5.4%\;O_2$ and $4.0{\sim}8.0%\;CO_2$ after 13 days of storage. Particularly, the visual sensory quality of cut green onion samples was retained better in polyethylene film bags of $63\;{\mu}m$ thickness(gas transmission rate: 600 $O_2\;mL/day{\cdot}m^2{\cdot}atm;\;2,500\;CO_2\;mL/day{\cdot}m^2{\cdot}atm$) than in the others.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.21-26
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• 2015

Mesoporous ceramic materials were applied in various fields such as adsorbent and gas sensor because of low thermal conductivity and high specific surface area properties. This structure could be divided into open-pore structure and closed-pore structure. Although closed-pore structure mesoporous ceramic materials have higher mechanical property than open-pore structure, it has a restriction on the application because the increase of specific surface area is limited. So, in this work, specific surface area of closed-pore structure $TiO_2$ was increased by anneal time. As increased annealing time, crystallization and grain growth of $TiO_2$ skeleton structured material in mesoporous structure induced a collapse and agglomeration of pores. Through this pore structural change, pore connectivity and specific surface area could be enhanced. After anneal for 24 hrs, porosity was decreased from 36.3% to 34.1%, but specific surface area was increased from $48m^2/g$ to $156m^2/g$. CO gas sensitivity was also increased by about 7.4 times due to an increase of specific surface area.

• Clean Technology
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• v.24 no.4
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• pp.269-274
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• 2018

In this study, Life Cycle Assessment (LCA) of wet tissue manufacturing process was performed. The wet tissue manufacturing process consists of preparation of wetting agent (chemical liquid), impregnation of nonwoven fabric into wetting agent and primary and secondary packaging. Data and information were collected on the input and output of the actual process from a certain company and the database of the Korea Ministry of Environment and some foreign countries (when Korean unavailable) were employed to connect the upper and the lower process flow. Based on the above and the potential environmental impacts of the wet tissue manufacturing process were calculated. As a result of the characterization, Ozone Layer Depletion (OD) is 3.46.E-06 kg $CFC_{11}$, Acidification (AD) is 5.11.E-01 kg $SO_2$, Abiotic Resource Depletion (ARD) is $3.52.E+00\;1yr^{-1}$, Global Warming (GW) is 1.04.E+02 kg $CO_2$, Eutrophication (EUT) is 2.31.E-02 kg ${PO_4}^{3-}$, Photochemical Oxide Creation (POC) was 2.22.E-02 kg $C_2H_4$, Human Toxicity (HT) was 1.55.E+00 kg 1,4 DCB and Terrestrial Ecotoxicity (ET) was 5.82.E-04 kg 1,4 DCB. In order to reduce the environmental impact of the manufacturing process, it is necessary to improve the overall process as other general cases and change the raw materials including packaging materials with less environmental impact. Conclusively, the energy consumed in the manufacturing process has emerged as a major issue, and this needs to be reconsidered other options such as alternative energy. Therefore, it is recommended that a process system should be redesigned to improve energy efficiency and to change to an energy source with lower environmental impact. Due to the nature of LCA, the final results of this study can be varied to some extent depending on the type of LCI DB employed and may not represent of all wet tissue manufacturing processes in the current industry.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Horticultural Science & Technology
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• v.33 no.3
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• pp.375-382
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• 2015

A controlled atmosphere (CA) regimen was optimized during 3 consecutive harvest seasons as the basis of practical modified atmosphere packaging (MAP) storage for quality maintenance and extension of storage potential of fresh Ligularia fischeri leaves. Leaves were harvested in April or May and forced-air cooled to $4^{\circ}C$ before punch-hole MAP (control, where gas concentrations were same as air) and CA treatments. CA regimens adjusted stepwise during 3 experimental years were: 1 and 3% $O_2$, respectively combined with 5 and 10% $CO_2$ in the first year, 3% $O_2$ fixed in combination with 0, 2.5, and 5% $CO_2$ in the second year, and 3% $O_2$ fixed in combination with 2.5 and 5% $CO_2$ in the third year. In the first year, higher incidence of black discoloration was observed with the reduction of respiration under 10% $CO_2$ CA conditions regardless of $O_2$ levels at 1 or 3%. In the second and third year, the incidence of the disorder seemed not to be clearly relevant to CA conditions showing slightly higher incidence only after 4- or 5-week storage + 5-day shelf life. Although texture and appearance quality were maintained better under the 3% $O_2$ + 2.5% $CO_2$condition after 4-week storage + 5-day shelf life, effects of CA on the extension of storage period was slight. Overall results indicated that Ligularia fischeri leaves are very susceptible to $CO_2$ injury. $CO_2$ concentration should be adjusted below 2.5% for safe and effective CA or MAP storage to maintain quality even during short-term storage.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.29-33
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• 2011

Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

• Food Science and Preservation
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• v.7 no.1
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• pp.12-18
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• 2000

As am economical and effective way of antimicrobial film fabrication , antimicrobial agents were coated on the LDPE film with a binder mediu. the fabricated films were then applied tomodified atmosphere packaging of fresh strawberries. A binder of polyamide was selected for the coating medium, based on the stability in water. 1% grapefruit seed extract-coated film showed the antimicrobial activity on the plate media against EScherichia coli, Staphylococcus aureus, bacillus subtilis , Bacillus cereus, Leuconostoc mesenteroides, Micrococcus flavus, Saccharomyces cerevisiae, while one with 10% Coptis chinesis extract inhibited only M. 림편 and one coated with 10% rheum palmatum extract did not inhibit any of 10 strains tested. The packages of fresh strawberries by using antimicrobial agents-coated films created the gas compositions of O2 1.4-5.5% and CO2 5.7-7.9%, and contributed to reduced growth of total aerobic bacteria and yeast/molds on the produced. However, their lower microbial count was not correlated directly with the reduced decay of the fruits.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.1
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• pp.23-30
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• 2022

This study investigated the characteristics for rice husk pulverization and surface modification of biomass byproducts composed of rice husk, corn extract gourd, wheat bran, and soybean curd. The size of particles of rice husk was at 6.44 ㎛ and represented the most affordable material for preparing the bio-degradable film among the tested byproducts. The silane treatment and adding 2% of ESO (Epoxidized soybean oil) and 3-aminopropyl triethoxysilane solution mixed in a 1:1 ratio were best to the surface modification and SEM-based particle shape. Above the results, adding 2% of mixed solution after silane treatment of rice husks processed through an air classifying mill (ACM) allows for its use as a raw material of bio-degradable plastic film.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.81-88
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• 2021

In this paper, by applying LTCC substrate, the library of the passive elements is implemented. And it can be used in 24 GHz circuits. Depending on how to use it to the circuit, it is required large value by designing the basic structures such as electrode capacitor and spiral inductor. However they are not available in high-frequency domain, because their SRF(Self-Resonant Frequency) is lower than the frequency of 24-GHz. By solving the limit, this paper devised passive elements classified for the DC and the high-frequency domain. The basic structure is suitable for low frequency under 1~2 GHz like DC. The microstrip λ/8 length stub structure is proposed to use for high-frequency like 24-GHz. The open and short stub structure operate as a capacitor and inductor respectively, also they have their impedances. Through their impedances, we can extract the value with the impedance-related equation. In this paper, the proposed passive elements are produced with the permittivity 7.5 LTCC substrate, the basic structure which are available in the DC constituted a library of capacitance of 2.35 to 30.44 pF and inductance of 0.75 to 5.45 nH, measured respectively. The stub structure available in the high-frequency domain were built libraries of capacitance of 0.44 to 2.89 pF and inductance of 0.71 to 1.56 nH, calculated respectively. The measurements have proven how to diversify value, so libraries can be built more variously. It will be an alternative to the passive elements that it is possible to integrate with the operation circuit of radar module for the frequency 24-GHz.