• Journal of the Korean Vacuum Society
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• v.4 no.1
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• pp.12-17
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• 1995

Diamondlike carbon(DLC)films having good characteristics in mechanical and optical properties, were synthesized by rf-plasma enhanced chemical vapor deposition method. Methane, methane-hydrogen, or methane-argon were used as source gases. The infrared transparency and composition of the films were investigate. Especially, the anti-reflection effect of KLC film in infrared region was confirmed by depositing it on Ge/Si sample. When DLC films were deposited on the plastic substrates and thermal distortion, which were originated before and during deposition, respectively, played a role as a crack source of the films.

• Journal of the Korean institute of surface engineering
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• v.50 no.4
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• pp.272-276
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• 2017

The response of AISI 310 type austenitic stainless steel to the novel low temperature plasma carburizing process has been investigated in this work. This grade of stainless steel shows better corrosion resistance and high temperature oxidation resistance due to its high chromium and nickel content. In this experiment, plasma carburizing was performed on AISI 310 stainless steel in a D.C. pulsed plasma ion nitriding system at different temperatures in $H_2-Ar-CH_4$ gas mixtures. The working pressure was 4 Torr (533Pa approx.) and the applied voltage was 600 V during the plasma carburizing treatment. The hardness of the samples was measured by using a Vickers micro hardness tester with the load of 100 g. The phase of carburized layer formed on the surface was confirmed by X-ray diffraction. The resultant carburized layer was found to be precipitation free and resulted in significantly improved hardness and corrosion resistance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.75-79
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• 2003

We studied InP etch results in high density planar inductively coupled $BCl_3$ and $BCl_3$/Ar plasmas. The investigated process parameters were ICP source power, RIE chuck power, chamber pressure and $BCl_3$/Ar gas composition. It was found that increase of ICP source power and RIE chuck power raised etch rate of InP, while that of chamber pressure decreased etch rate. Etched InP surface was clean and smooth (RMS roughness < 2 nm) with a moderate etch rate ($300\;{\sim}\;500\;{\AA}/min$) after the planar $BCl_3/Ar$ ICP etching. It may make it possible to open a new regime of InP etching with $CH_4/H_2$ - free plasma chemistry. Some amount of Ar addition (< 50%) also improved etch rates of InP, while too much Ar addition reduced etch rates of InP.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.133-133
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• 1999

비정질 탄소막 제조에 있어서 수소가 포함된 반응성 가스를 사용할 경우 제작된 탄소막 내부에는 수소가 포함되게 되며, 이러한 수소원자들은 막의 특성에 중요한 영향을 주는 것으로 알려져 있다. 따라서, 본 연구에서는 비정질 탄소막(a-C:H) 내부에 존재하는 수소가 탄소막의 특성에 미치는 영향을 알아보고, 막 내부에 포함된 수소의 함량과 공정조건 사이의 함수계를 조사함으로써 수소의 함량을 인위적으로 통제할 수 있는 가능성을 제시하고자 한다. 수소가 포함된 비정질 탄소막은 2.45 GHz의 전자기파를 사용하는 electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) 방법과 DC magnetron sputtering 법을 사용하여 제작하였다. 기판으로는 Si(001) wafer를 사용하였으며, 아세톤과 에탄올을 사용하여 표면의 유기성분을 제거하고, 진공챔버속에서 Ar 플라즈마를 발생시켜 sputter etching 방법으로 표면을 세척하였다. ECR-PECVD 방법에서는 반응가스로 메탄(CH4)과 수소(H2)의 혼합가스를 사용하였으며, 혼합가스의 비는 5~50% 범위내에서 변화를 주었다. 수소가스의 유량은 100SCCM으로 고정하였으며, 마이크로웨이브의 power는 360~900W였고, 기판에 가해준 negative DC bias 전압은 0~-500V이었다. DC magnetron sputtering 방법에서는 반응가스로 아세틸린(C2H2) 가스를 사용하였으며, 플라즈마 발생을 용이하게 하기 위해서 Ar 가스와 혼합하여 사용하였다. Ar 가스의 유량은 10SCCM으로 고정하였으며, 아세틸렌 가스의 유량은 5~20SCCM 범위내에서 주입하였다. 이때, 기판에 가해준 negative DC bias 전압은 0~-100V이었다. 제작된 탄소막의 수소 함량을 조사하기 위하여 Fourier Transform Infrared (FTIR) 분광법과 Elastic Recoil Detection Analysis (EFDA) 법을 사용하였으며, 증착율은 SEM 단면촬영과 a-step을 이용하여 측정하였고, 막의 경도는 Micro-Hardness Testing 법을 사용하여 측정하였다.

• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.276-278
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• 1997

The reliable etching process is one of the essential steps in fabricating GaN based-device. High etch rate is needed to obtain a deeply etched structure and perfect anisotropic etched facet is needed to obtain lasing profile. In the research, therefore, we had proposed a planar inductively coupled plasma etcher (Planar ICP Etcher) as a high density plasma source, and studied the etching mechanism using the $CH_4/H_2$/Ar gas mixture. Dry etching characteristics such as etch rate, anisotropic etching profile and so on, for the III-V nitride layers were investigated using Planar ICP Etcher, based on the plasma characteristic as a variation of plasma process parameters.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.233.2-233.2
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• 2016

Graphite의 순도, 결함, 결정층, 전기저항이 개선을 위하여, 10,000K 이상의 초고온 RF 열플라즈마 처리에 관한 연구를 수행하였다. 방전가스는 Ar을 사용하고, 특성 개선을 위하여 첨가가스로 $H_2$, $CH_4$을 첨가하여 흑연의 열플라즈마 처리에 의한 특성을 고찰하였다. Energy Dispersion Spectroscopy을 이용한 탄소 함량 분석 결과, 75wt% 저급 흑연에 함유된 유무기 불순물은 고온의 플라즈마에 의해 제거되어 99wt% 이상으로 순도가 개선되었고, XRD 및 Raman 분석으로부터 고온 열처리를 통한 탄소원자의 재배열로 흑연의 $sp^2$결함이 감소되고, 결정성이 향상됨을 확인하였다. 또한 열플라즈마로 처리된 흑연입자에 대한 분체저항 측정 결과, $10^{-3}{\Omega}{\cdot}cm$에서 $10{-4}{\Omega}{\cdot}cm$로 감소되었다.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.39-43
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• 2001

$SiC_{x}N$_{y}$ film is deposited by electron cyclotron resonance plasma chemical vapor deposition system using $SiH_4$(5% in Ar), $CH_4$ and $N_2$. Ternary phase $SiC_{x}N$_{y}$ thin film deposited at the microwave power of 600 W and substrate temperature of 700 contains considerable amount of strong C-N bonds. Change in $CH_4$flow rate can effectively control the residual film stress, and typical surface roughness of 34.6 (rms) was obtained. Extreme]y high hardness (3952 Hv) and optical transmittance (95% at 633 nm) was achieved, which is suitable for a LIGA mask membrane application.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.169-169
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• 2008

To keep pace with scaling trends of CMOS technologies, high-k metal oxides are to be introduced. Due to their high permittivity, high-k materials can achieve the required capacitance with stacks of higher physical thickness to reduce the leakage current through the scaled gate oxide, which make it become much more promising materials to instead of $SiO_2$. As further studying on high-k, an understanding of the relation between the etch characteristics of high-k dielectric materials and plasma properties is required for the low damaged removal process to match standard processing procedure. There are some reports on the dry etching of different high-k materials in ICP and ECR plasma with various plasma parameters, such as different gas combinations ($Cl_2$, $Cl_2/BCl_3$, $Cl_2$/Ar, $SF_6$/Ar, and $CH_4/H_2$/Ar etc). Understanding of the complex behavior of particles at surfaces requires detailed knowledge of both macroscopic and microscopic processes that take place; also certain processes depend critically on temperature and gas pressure. The choice of $BCl_3$ as the chemically active gas results from the fact that it is widely used for the etching o the materials covered by the native oxides due to the effective extraction of oxygen in the form of $BCl_xO_y$ compounds. In this study, the surface reactions and the etch rate of $Al_2O_3$ films in $BCl_3/Cl_2$/Ar plasma were investigated in an inductively coupled plasma(ICP) reactor in terms of the gas mixing ratio, RF power, DC bias and chamber pressure. The variations of relative volume densities for the particles were measured with optical emission spectroscopy (OES). The surface imagination was measured by AFM and SEM. The chemical states of film was investigated using X-ray photoelectron spectroscopy (XPS), which confirmed the existence of nonvolatile etch byproducts.

• Journal of the Korean institute of surface engineering
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• v.45 no.4
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• pp.151-154
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• 2012

A hydrophobic surface has been fabricated on aluminum by two-step surface treatment processes consisting of structure modification and surface coating. Nature inspired micro nano scale structures were artificially created on the aluminum surface by a blasting and Ar ion beam etching. And a hydrophobic thin film was coated by a trimethylsilane ($(CH_3)_3SiH$) plasma deposition to minimize the surface energy of the micro nano structure surface. The contact angle of micro nano structured aluminum surface with the trimethylsilane coating was $123^{\circ}$ (surface energy: 9.05 $mJ/m^2$), but the contact angle of only trimethylsilane coated sample without the micro nano surface structure was $92^{\circ}$ (surface energy: 99.15 $mJ/m^2$). In the hydrophobic treatment of aluminum surface, a trimethylsilane coated sample having the micro nano structure was more effective than only trimethylsilane coated sample without the micro nano structure.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.16.2-16.2
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• 2011

Graphene has attracted significant attention due to its unique characteristics and promising nanoelectronic device applications. For practical device applications, it is essential to synthesize high-quality and large-area graphene films. Graphene has been synthesized by eloborated mechanical exfoliation of highly oriented pyrolytic graphite, chemical reduction of exfoliated grahene oxide, thermal decomposition of silicon carbide, and chemical vapor deposition (CVD) on metal substrates such as Ni, Cu, Ru etc. The CVD has advantages over some of other methods in terms of mass production on large-areas substrates and it can be easily separated from the metal substrate and transferred to other desired substrates. Especially, plasma-enhanced CVD (PECVD) can be very efficient to synthesize high-quality graphene. Little information is available on the synthesis of graphene by PECVD even though PECVD has been demonstrated to be successful in synthesizing various carbon nanostructures such as carbon nanotubes and nanosheets. In this study, we synthesized graphene on $Ni/SiO_2/Si$ and Cu plate substrates with CH4 diluted in $Ar/H_2$ (10%) by using an inductively-coupled PECVD (ICPCVD). High-quality graphene was synthesized at as low as $700^{\circ}C$ with 600 W of plasma power while graphene layer was not formed without plasma. The growth rate of graphene was so fast that graphene films fully covered on substrate surface just for few seconds $CH_4$ gas supply. The transferred graphene films on glass substrates has a transmittance at 550 nm is higher 94%, indicating 1~3 monolayers of graphene were formed. FETs based on the grapheme films transferred to $Si/SiO_2$ substrates revealed a p-type. We will further discuss the synthesis of graphene and doped graphene by ICPVCD and their characteristics.