• Bulletin of the Korean Chemical Society
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• 제19권11호
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• pp.1161-1164
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• 1998

The catalytic transformation of sterically bulky tertiary stannane n-Bu3SnH by the Cp2MCl2/Red-Al (M=Ti, Zr, Hf) and M(CO)6 (M=Cr, Mo, W) catalysts yielded two kinds of catenated products: one is a cross-linked polystannane as minor product, and the other is hexabutyldistannane (n-Bu3Sn)2 as major product. The distannane was produced by simple dehydrocoupling of n-Bu3SnH, whereas the cross-linked polystannane could be obtained via redistribution/dehydrocoupling combination process of n-Bu3SnH. The redistribution/dehydrocoupling combination process may initially produce a low-molecular-weight oligostannane with partial backbone Sn-H bonds which could then undergo an extensive cross-linking reaction of backbone Sn-H bonds, resulting in the formation of an insoluble polystannane.

• 대한화학회지
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• 제43권1호
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• pp.74-84
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• 1999

벤조트리아졸을 보조체로 사용하는 유기합성법은 거의 대부분 이온성 반응 메카니즘으로 설명되며 라디칼 반응을 이용한 벤조트리아졸의 응용은 거의 없었다. 벤조트리아졸의 N-1의 ${\alpha}$위치 탄소 원자에 라디칼 중심을 만든 후 벤조트리아졸의 다섯고리를 형성하는 질소 원자중에서 질소 분자가 빠져나감으로서 생성되는 페닐 라디칼의 반응을 연구하기위해 1[(aryl)(phenylseleno)methyl]benzotriazole, AIBN, 그리고 $Bu_3$SnH을 벤젠에 용해시키고 환류시켜 주었다. 이 반응 혼합물로 부터 2-aminodiphenyl selenide (16∼29%), 2-aminobiphenyl (9∼15%), diphenyl diselenide (30∼93%), 1-(arylmethyl)benzotriazole (9∼39%), 그리고 tributyltinphenyl selenide (10∼36%)을 얻었으며, AIBN없이 과량의 $Bu_3$SnH 존재하에 같은 조건하에서 반응시키는 경우,diphenyl diselenide (53∼100%), benzotriazole (27∼35%) 그리고 1-(arylmethyl)-benzotriazole (16∼33%)와 함께 arylmethylidenaniline이 과량의 $Bu_3S_nH$에 의해 환원된 N-(arylmethyl)anilines (44∼66%)이 생성되었다. 같은 조건 하에서 6-aryl-6-(benzotriazol-1-yl)-1-hexenyl phenyl selenides, AIBN, 그리고 $Bu_3$SnH의 반응으로부터 6-aryl-6-phenylamino-1-hexene(9∼31%)과 1-aryl-1-oxo-5-pentene (15∼44%)을 얻었다. 이들 생성물의 생성 메카니즘을 제시하였으며 벤조트리아졸이 합성 보조체로 이용된 경우 $Bu_3$SnH에 의해 벤조트리아졸의 세개의 질소 원자를 포함하는 다섯원자고리로 부터 라디칼 반응에 의해 질소 분자가 빠져나가는 것을 보여준 새로운 예이다.

• Bulletin of the Korean Chemical Society
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• 제33권2호
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• pp.739-741
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• 2012

• 통합자연과학논문집
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• 제5권2호
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• pp.79-83
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• 2012

Trialkyltin n-$Bu_3SnH$, an endocrine disruptor, was slowly converted by the catalytic action of group 4 $Cp_2MCl_2$/Red-Al (M = Ti, Zr, Hf) to produce two phases of products: one is an insoluble cross-linked solid, polystannane in 7-23% yield as minor product via redistribution/dehydrocoupling combination process, and the other is an oil, hexabutyldistannane in 69-90% yield as major product via simple dehydrocoupling process. Redistribution/dehydrocoupling process first produced a low-molecular-weight oligostannane possessing partial backbone Sn-H bonds which then underwent an extensive cross-linking reaction of backbone Sn-H bonds, leading to an insoluble polystannane. This is the first exciting example of redistribution/dehydrocoupling of a tertiary hydrostannane catalyzed by early transition metallocenes.

• 통합자연과학논문집
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• 제6권2호
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• pp.71-75
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• 2013

$Bu_3Sn$-endded poly(vinyl)s with biological activity were obtained by the radical polymerization of vinyl monomers using thianthrene cation radical/$^nBu_3H$. Thianthrene cation and stannyl radicals promoted the homopolymerization and copolymerization of styrene and ethyl vinyl ether having number average molecular weights of 2000-3100. Tributyltin hydride functions as a chain transfer agent. Such polymereization by cationic thianthrene and stannyl radicals could provide some clues for the biological reaction in living animals. Plausible polymerization mechanisms were suggested.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 추계학술발표대회 개요집
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• Bulletin of the Korean Chemical Society
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• 제26권9호
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• pp.1440-1442
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• 2005

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.33-35
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• 2006

The interactions between Cu/Sn-Ag-(Cu) and Sn-Ag-(Cu)/Ni interfacial reactions were studied during isothermal aging at $150^{\circ}C$ for up to 1000h using Cu(ENIG)/Sn-3.5Ag-(0.7Cu)/Cu(ENIG) sandwich solder joints. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing, whereas a $(Cu,Ni)_6Sn_5$ IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni side was sourced from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment was performed at $150^{\circ}C$, no Ni was detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the $(Cu,Ni)_6Sn_5$ IMC layer of the Cu/sn-Ag/ENIG sandwich joint effectively retarded the Ni consumption from the electroless Ni-P layer.

• Applied Biological Chemistry
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• 제51권1호
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• pp.60-64
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• 2008

스파티필름 지상부를 80% MeOH 용액으로 추출하고, 얻어진 추출물을 EtOAc, n-BuOH 및 $H_2O$로 용매 분획 하였다. 이 중 EtOAc 분획으로부터 silica gel, ODS 및 Sephadex LH-20 column chromatography로 정제하여 3종의 지질화합물을 분리 하였다. 각 화합물의 화학구조는 NMR, MS, 및 IR 등의 스펙트럼 데이터를 해석하여 stigmasterol (1), $(2S)1-O-linolenoyl-2-O-myristoyl-3-O-{\beta}-D-galactopyranosyl-sn-glycerol$ (2), stigmasterol glucoside (3)으로 동정하였다. 이 화합물들은 스파티필름에서 처음으로 분리 및 동정 되었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.30-32
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• 2006

The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.