• Title/Summary/Keyword: $Al_2O_3$ Paste

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Compositional Effects on Thermal and Electrical Properties of Dielectric Glass Paste

  • Kim, Teock-Nam;Lee, Jea-Yeol;Kim, Hyung-Sun;Hu, Jeung-Soo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.95-96
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    • 2000
  • The effect of $Al_2O_3$ on the dielectric constant and the coefficient of thermal expansion of lead borosilicate glasses for the application of PDP glass paste was investigated. Measurements were made theoretically by using empirical equations on the composition of the of glasses in which the $PbO/Al_2O_3$, $B_2O_3/Al_2O_3$ and $SiO_2/Al_2O_3$ ratios were systematically varied. As a result, with increasing $PbO/Al_2O_3$ the thermal expansion coefficient and the dielectric constant noticeably increased, while the change of $B_2O_3/Al_2O_3$ and $SiO_2/Al_2O_3$ ratios did not affect those properties of the glasses.

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Hardening Properties of Activated Calcium Dialuminate Clinker with Phosphoric Acid Solution

  • Song, Tae-Woong;Kim, Sei-Gi
    • The Korean Journal of Ceramics
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    • v.3 no.4
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    • pp.235-238
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    • 1997
  • Basic properties of new cement pastes based on the system $CaO-Al_2O_3-P_O_5-H_2O$were studied Phosphoric acid solutions and calcium dialuminate clinkers synthesized by the hydration-burning method were used for liquid and powder components of the paste, respectively Variation in the compositions of the paste was achieved by changing the liquid/powder ratio and the concentration of phosphoric acid solution. The hardening rate of the paste was so largely affected by the amount of phosphoric acid that hardening was inhibited with the low-concentrated solution but was explosively accelerated with the high-concentrated solution. The phosphoric acid solutions of concentration of 45~50% and the liquid/powder ratio of 0.5~1.5 were favoured for the high early-strength cement paste with the reasonable hardening rate and high strength. The binding phase of hardened paste was the dense amorphous gel of the system $CaO-Al_2O_3-P_O_5-H_2O$. in which the unreacted calcium dialuminate grains were embeded.

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The Effect of the Composition of Metallizing Paste on the Bonding Strength in the Joining of Al2O3/Cu to Cu (Al2O3/Cu 접합에서 Metallizing paste의 조성이 접합강도에 미치는 영향)

  • Yoon, Jong-Hyuk;Park, Hyun Gyoon
    • Journal of Welding and Joining
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    • v.31 no.6
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    • pp.65-70
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    • 2013
  • In joining Alumina to copper plate by Mo-Mn metallizing process, the effects of the composition of metallizing paste on the bonding strength were investigated. The bonding strength increased with increasing Mn amount in the paste up to 20% but followed by the decrease with addition of Mn. The maximum bonding strength reached 50MPa at 20%Mn when heated to $1550^{\circ}C$ for 60minute. The addition of Si to the metallizing powder increased the bonding strength of the joint by enhancing the mechanical bonding between the Alumina and the metallizing layer due to the decrease of layer viscosity with the addition of $SiO_2$. It is thought that MnO reacted with $Al_2O_3$ to yield $MnAl_2O_4$ spinel, forming a joint.

Effects of $Al_2O_3$ Based Paste Formulation for Constrained Sintering in LTCC (Constrained Sintering을 위한 LTCC용 $Al_2O_3$ Paste 조성에 대한 영향)

  • Lee, Sang-Myoung;Yoo, Myong-Jae;Kim, Jun-Yong;Park, Sung-Dae;Park, Jong-Chul;Nahm, Sahn
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.267-268
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    • 2007
  • 기존의 Free Sintering 방법을 사용하는 LTCC(Low Temperature Cofiring Ceramics)는 수축률이 일정하지 않아서 설계 치수와 동일하게 제작하기 어려운 단점을 가지고 있다. 이에 따라서 정밀한 전자부품을 제작하기 위한 방안으로 X-Y면 방향에서의 변형을 거의 zero로 제어하는 Constrained Sintering(CS) 기술이 요구되고 있다. 본 연구에서는 LTCC 기판이 소성되는 동안에 변형을 억제하기 위하여 소성온도가 LTCC 기판 보다 높은 $Al_2O_3$ 분말과 유기물을 혼합하여 페이스트를 제작한 후에 스크린 프린팅 방법을 이용하여 도포 후에 Z축 방향으로 일축가압을 하면서 소성하여 수축률을 제어 하였다. 또한 바인더와 $Al_2O_3$ 분말의 함량에 대한 최적 조성의 $Al_2O_3$ 페이스트를 제작하여 0.5%로 수축률을 가지는 균일한 LTCC 기판을 구현 할 수 있었다.

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Effect of Additives on the Refractive Index of B2O3-SiO2-Al2O3 Glasses for Photolithographic Process in Electronic Micro Devices

  • Won, Ju-Yeon;Hwang, Seong-Jin;Lee, Jung-Ki;Kim, Hyung-Sun
    • Korean Journal of Materials Research
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    • v.20 no.7
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    • pp.370-373
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    • 2010
  • In fabricating plasma display panels, the photolithographic process is used to form patterns of barrier ribs with high accuracy and high aspect ratio. It is important in the photolithographic process to control the refractive index of the photosensitive paste. The composition of this paste for photolithography is based on the $B_2O_3-SiO_2-Al_2O_3$ glass system, including additives of alkali oxides and rare earth oxides. In this work, we investigated the density, structure and refractive index of glasses based on the $B_2O_3-SiO_2-Al_2O_3$ system with the addition of $Li_2O$, $K_2O$, $Na_2O$, CaO, SrO, and MgO. The refractive index of the glasses containing K2O, Na2O and CaO was similar to that of the [BO3] fraction while that of the SrO, MgO and Li2O containing glasses were not correlated with the coordination fraction. The coordination number of the boron atoms was measured by MAS NMR. The refractive index increased with a decrease of molar volume due to the increase in the number of non-bridging oxygen atoms and the polarizability. The lowest refractive index (1.485) in this study was that of the $B_2O_3-SiO_2-Al_2O_3-K_2O$ glass system due to the larger ionic radius of $K^+$. Based on our results, it has been determined that the refractive index of the $B_2O_3-SiO_2-Al_2O_3$ system should be controlled by the addition of alkali oxides and alkali earth oxides for proper formation of the photosensitive paste.

Effect of Lead Free Glass Frit Compositions on Properties of Ag System Conductor and RuO2 Based Resistor Pastes (Ag계 도체 및 RuO2계 저항체 페이스트의 특성에 미치는 무연계 글라스 프릿트 조성의 영향)

  • Koo, Bon-Keup
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.3
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    • pp.200-207
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    • 2011
  • Abstract: The effect of lead free glass frit compositions on the properties of thick film conductor and resistor pastes were investigated. Two types lead free frits, HBF-A(without $Bi_2O_3$) and HBF-B(with $Bi_2O_3$) were made from $SiO_2$, $B_2O_3$, $Al_2O_3$, CaO, MgO, $Na_2O$, $K_2O$, ZnO, MnO, $ZrO_2$, $Bi_2O_3$. And Ag based conductor pastes and $RuO_2$ based resistor paste were prepared by mixed with these frits and functional phase(Ag and $RuO_2$), and organic vehicle. The properties of thick film conductor and resistor sintered at $850^{\circ}C$ were studied after printing on $Al_2O_3$ substrate. The morphology of the sintered films surface were SEM and EDS were carried out to analysis the chemical composition on resistor surface and state of Ru atom in frit matrix.

Electrical Properties of Eco-Friendly RuO2-Based Thick-Film Resistors Containing CaO-ZnO-B2O3-Al2O3-SiO2 System Glass for AlN Substrate (Electrical Properties of Eco-Friendly RuO2-Based Thick-Film Resistors Containing CaO-ZnO-B2O3-Al2O3-SiO2 계 유리가 적용된 질화알루미늄 기판용 RuO2계 친환경 후막저항의 전기적 특성 연구)

  • Kim, Min-Sik;Kim, Hyeong-Jun;Kim, Hyung-Tae;Kim, Dong-Jin;Kim, Young-Do;Ryu, Sung-Soo
    • Journal of the Korean Ceramic Society
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    • v.47 no.5
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    • pp.467-473
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    • 2010
  • The objective of this study is to prepare lead-free thick film resistor (TFR) paste compatible with AlN substrate for hybrid microelectronics. For this purpose, CaO-ZnO-$B_2O_3-Al_2O_3-SiO_2$ glass system was chosen as a sintering aid of $RuO_2$. The effects of the weight ratio of CaO to ZnO in glass composition, the glass content and the sintering temperature on the electrical properties of TFR were investigated. $RuO_2$ as a conductive and glass powder were dispersed in an organic binder to obtain printable paste and then thick-film was formed by screen printing, followed by sintering at the range between $750^{\circ}C$ and $900^{\circ}C$ for 10 min with a heating rate of $50^{\circ}C$/min in an ambient atmosphere. The addition of ZnO to glass composition and sintering at higher temperature resulted in increasing sheet resistance and decreasing temperature coefficient of resistance. Using $RuO_2$-based resistor paste containing 40 wt%glass of CaO-20.5%ZnO-25%$B_2O_3$-7%$Al_2O_3$-15%$SiO_2$ composition, it is possible to produce thick film resistor on AlN substrate with sheet resistance of $10.6\Omega/\spuare$ and the temperature coefficient of resistance of 702ppm/$^{\circ}C$ after sintering at $850^{\circ}C$.

The Effects of Additives and Fabrication Methods on Durability in Acid of Glass Frit for Thick Film Paste (후막페이스트용 Glass Frit의 내산성에 미치는 제조방법 및 첨가제의 영향)

  • 장규철;노태형;구본급;임대영;김호기
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.2
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    • pp.29-36
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    • 2000
  • The effects of additives and fabrication methods of glass frits far thick film paste on durability in acid of glass frits fur thick film paste were studied. To investigate the effect of fabrication method, glass brit based on $PbO-SiO_2-B_2O_3$ was prepared by various mixing method and number of melting. The effects of addition of $ZrO_2$, $Al_2O_3$, and $TiO_2$in glass on the durability in acid solution were investigated.

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A Study on the Copper Metallizing Method of $Al_2$O$_3$ Ceramic Surface (알루미나(Al$_2$O$_3$) 세라믹 표면의 강메탈라이징법에 관한 연구)

  • ;;Choi, Y. G.;Kim, Y. S.
    • Journal of Welding and Joining
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    • v.13 no.3
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    • pp.55-64
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    • 1995
  • Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

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Setting Properties of GGBS Powder According to Replacement of Ratio of CaO-Al2O3 Based Inorganic Binder (CaO-Al2O3계 무기결합재 사용량에 따른 고로슬래그 미분말의 응결특성)

  • Choi, Duck-Jin;Lee, Young-Jae;Choi, Se-Jin;Kim, Jin-Man
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2013.05a
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    • pp.78-79
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    • 2013
  • As a part of study to maximize the amount used of the ground granulated blast-furnace slag, the study deals with setting properties of paste that is mixed the ground granulated blast-furnace slag with CaO-Al2O3 based inorganic blinder. The results of the experiment show that the setting time is most fast in the mix of 25% rate of CaO-Al2O3 based inorganic blinder. It is generally needed 2 hours for work time in precast concrete products. In this study, this requirement is achieved when using the retarder of 0.5%.

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