• Journal of the Speleological Society of Korea
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• no.75
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• pp.49-54
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• 2006

Electrophoretic Deposition (EPD) is the most convenient technology to deposit natural or oxide powders of nonconductive materials in alcoholic suspension solution with adding electrolyte of iodine to form ceramic thick film on metal substrate under applied electric field with double electric layer between electrode and metal substrate. In this research work, the important parameters and technical ways were studied to form EPD thick films of typical oxide ceramics of Al2O3, YBCO and tourmaline powders.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.457-457
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• 2010

Flexible organic light emitting diodes (F-OLEDs) requires excellent moisture permeation barriers to minimize the degradation of the F-OLEDs device. Specifically, F-OLEDs device need a barrier layer that transmits less than $10^{-6}g/m^2/day$ of water and $10^{-5}g/m^2/day$ of oxygen. To increase the life time of F-OLEDs, therefore, it is indispensable to protect the organic materials from water and oxygen. Severe groups have reported on multi-layerd barriers consisting inorganic thin films deposited by plasma enhenced chemical deposition (PECVD) or sputtering. However, it is difficult to control the formation of granular-type morphology and microscopic pinholes in PECVD and sputtering. On the contrary, atomic layer deoposition (ALD) is free of pinhole, highly uniform, conformal films and show good step coverage. Thus, $Al_2O_3/TiO_2$ multi-layer was deposited onto the polyethersulfon (PES) substrate by electron cyclotron resonance atomic layer deposition (ECR-ALD), and the water vapor transmission rates (WVTR) were measured. WVTR of moisture permeation barriers is dependent upon density of films and initial state of polymer surface. A significant reduction of WVTR was achieved by increasing density of films and by applying low plasma induced interlayer on the PES substrate. In order to minimize damage of polymer surface, a 10 nm thick $TiO_2$ was deposited on PES prior to a $Al_2O_3$ ECR-ALD process. High quality barriers were developed from $Al_2O_3$ barriers on the $TiO_2$ interlayer. WVTR of $Al_2O_3$ by introducing $TiO_2$ interlayer was recorded in the range of $10^{-3}g/m^2.day$ at $38^{\circ}C$ and 100% relative humidity using a MOCON instrument. The WVTR was two orders of magnitude smaller than $Al_2O_3$ barriers directly grown on PES substrate without the $TiO_2$ interlayer. Thus, we can consider that the $Al_2O_3/TiO_2$ multi-layer passivation can be one of the most suitable F-OLEDs passivation films.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.5
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• pp.279-283
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• 2016

In this study, we intended to achieve both antibacterial properties and electromagnetic shielding using the Al-doped ZnO (AZO) films. FTS (Facial Target Sputtering) magnetron sputtering was used for the AZO thin films instead of the conventional RF sputtering because the FTS sputtering could avoid the damage for the plasma as well as fabrication of thin films with a high quality. The 300-nm thick AZO thin films grown on glass substrate showed a resistivity of about $7{\times}10^{-4}{\Omega}-cm$ and a transmittance of about 90% at a wavelength of 550 nm. AZO thin films were investigated for the electromagnetic shielding effectiveness measured by 2-port network method at 1.5 ~ 3 GHz. The AZO (300 nm)/glass films showed an EMI shielding effectiveness of approximately 27 dB. An antibacterial effect was measured by the film attachment method (JIS Z 2801). The percent reductions of bacteria by AZO films were 99.99668% and 99.99999% against Staphylococcus aureus and Escherichia coli, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.137-141
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• 2009

AZO transparent conductive thin films were grown on $SiO_2$/Si and glass substrates using diethylzinc (DEZ) and trimethylaluminium (TMA) as the precursor and $H_2O$ as oxidant by atomic layer deposition. The structural, electrical, and optical properties of the AZO films were characterized as a function of film thickness at a deposition temperature of $150^{\circ}C$. The AZO films with various thicknesses show well-crystallized phases and smooth surface morphologies. The 190-nm-thick AZO films grown on Coming 1737 glass substrates exhibit rms(root mean square) roughness of 8.8 nm, electrical resistivity of $1.5{\times}10^{-3}\;{\Omega}-cm$, and an optical transmittance of 84% at 600nm wavelength. Atomic layer deposition technique for the transparent conductive oxide films is possible to apply for the deposition on flexible polymer substrates.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.7
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• pp.437-442
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• 2018

This work reports the preparation of Al-Ti based oxide thin films and their optical properties. Although the transmittance of a $TiO_2/Al2O_3$ bilayer structure was as high as 90% at wavelengths of 600 nm or larger, the reflectance of the bilayer reached its minimum at wavelengths of around 360 nm. The transmittance of an 89-nm-thick $TiO_2$ thin film rapidly increased and then decreased at a critical wavelength because of destructive interference. The wavelength corresponding to the reflectance minimum increased after an increase in $TiO_2$ film thickness. The smooth surface morphology of the AlTiO thin film was retained up to a film thickness of 65 nm, and the transmittance of the film was inversely proportional to film thickness, in accordance with the general tendency for optical films. The reflectance of the AlTiO film at visible light wavelengths was lower than that of the $TiO_2$ film, which implies that the AlTiO film is suitable for applications as an optical thin film layer in semitransparent solar cells.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.118-118
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• 2010

현재 반도체 제조 공정 중 많은 비중을 차지하는 식각 및 증착 공정에는 대부분 플라즈마를 사용하고 있으며, 이러한 반도체 장비내의 공정 부분품들은 수율과 생산성을 향상시키기 위하여 내플라즈마 특성이 우수한 세라믹 또는 세라믹 코팅막으로 구성되어 있다. 더욱이 최근에는 미세공정을 위해 고밀도 플라즈마 공정이 요구되면서, 노출된 세라믹 층이 침식되어 파티클이 떨어져 나오거나 모재와 세라믹 막 사이의 박리현상과 같은 심각한 문제들이 발생되고 있다. 따라서 보다 우수한 내플라즈마 특성을 갖는 세라믹 코팅 기술 개발이 시급한 실정이다. 현재 내플라즈마성 세라믹 코팅막 제조를 위한 코팅기술로서는 주로 용사법이 이용되고 있으나 기공률이 높고 치밀하지 못한 등의 문제점으로 인하여 사용수명이 짧다는 한계에 봉착하였다. 이에 본 연구에서는 상온에서 치밀하고 고속으로 세라믹 후막 형성이 가능한 Aerosol Deposition (AD)법과 AD법의 단점인 edge, corner, hole에서 코팅이 잘 안 되는 점을 보완할 수 있는 Arc Plasma Anodizing (APA)법을 조합하여, 상용화된 Al 모재위에 APA법을 사용하여 $Al_2O_3$ 후막 중간층을 형성한 뒤 그 위에 AD법으로 치밀한 $Al_2O_3$ 후막 성막함으로써 내 플라즈마 향상을 위한 새로운 개념의 제조기술개발을 시도하였다. 이를 위해 우선 Al 모재 위에 APA를 사용하여 중간층인 $Al_2O_3$막을 제조하였으며, 중간층의 두께에 따른 특성을 확인한 결과, $Al_2O_3$중간층의 두께가 두꺼워질수록 표면조도가 증가함을 확인 할 수 있었다. AD법으로 $Al_2O_3$중간층 위에 치밀한 $Al_2O_3$막을 제조하는데 있어 중요인자를 확인하기 위해, AD법으로 중간층 위에 $Al_2O_3$막을 제조한 후 성막특성을 관찰하였다. 그 결과, 중간층의 표면조도가 $0.8-1\;{\mu}m$인 경우에는 수 ${\mu}m$의 두께로 성막 되었으나, 표면조도가 $1\;{\mu}m$ 이상인 $Al_2O_3$중간층 위에서는 성막 되지 않았다. 이를 통해 AD법으로 치밀하고 두꺼운 $Al_2O_3$ 후막을 $Al_2O_3$중간층 위에 성막하기 위해서는 표면조도가 중요인자임을 확인하였다.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1915-1917
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• 2005

PZT(40/60) and PZT(60/40) powders, prepared by the sol-gel method, were mixed with an organic vehicle and the PZT(40/60)/PZT(60/40) heterolayered thick films were fabricated by the screen-printing method on $Pt/Al_2O_3$ substrates. The structural properties such as DTA, X-ray diffraction and microstructure, were examined as a function of the applied pressure. In the DTA analysis, the formation of the polycrystalline perovskite phase was observed at around $880^{\circ}C$. The average thickness of the PZT heterolayered thick films which were coated five times was approximately $95-100{\mu}m$.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1918-1920
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• 2005

PZT(20/80) and PZT(80/20) powders, prepared by the sol-gel method, were mixed with an organic vehicle and the PZT(20/80)/PZT(80/20) heterolayered thick films were fabricated by the screen-printing method on $Pt/Al_2O_3$ substrates. The structural properties such as DTA, X-ray diffraction and microstructure, were examined as a function of the sintering temperature. In the DTA analysis, the formation of the polycrystalline perovskite phase was observed at around $880^{\circ}C$. The average thickness of the PZT heterolayered thick films was approximately $80-90{\mu}m.$

• Journal of the Korean Ceramic Society
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• v.32 no.3
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• pp.371-377
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• 1995

Silicon oxide films were grown on single-crystal silicon substrates at low temperatures (25~205$^{\circ}C$) in a low pressure electron cyclotron resonance (ECR) oxygen plasma. The growth rate of the silicon oxide film increased as the temperature increased or the pressure decreased. Also, the thickness of the silicon oxide film increased at negative bias voltage, but not changed at positive bias voltage. The growth law of the silicon oxide film was approximated to the parabolic form. Capacitance-voltage (C-V) and current density-electric field (J-E) characteristics were studied using Al/SiO2/p-Si MOS structures. For a 10.2 nm thick silicon oxide film, the leakage current density at the electric field of 1 MVcm-1 was less than 1.0$\times$10-8Acm-2 and the breakdown field was higher than 10 MVcm-1. The flat band voltage of Al/SiO2/p-Si MOS capacitor was varied in the range of -2~-3 V and the effective dielectric constant was 3.85. These results indicate that high quality oxide films with properties that are similar to those of thermal oxide film can be fastly grown at low temperature using the ECR oxygen plasma.

• Korean Journal of Materials Research
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• v.31 no.10
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• pp.546-551
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• 2021

To improve ferroelectric properties of PZT, many studies have attempted to fabricate dense PZT films. The AD process has an advantage for forming dense ceramic films at room temperature without any additional heat treatment in low vacuum. Thick films coated by AD have a higher dielectric breakdown strength due to their higher density than those coated using conventional methods. To improve the breakdown strength, glass (SiO₂-Al₂O₃-Y₂O₃, SAY) is mixed with PZT powder at various volume ratios (PZT-xSAY, x = 0, 5, 10 vol%) and coating films are produced on silicon wafers by AD method. Depending on the ratio of PZT to glass, dielectric breakdown strength and energy storage efficiency characteristics change. Mechanical impact in the AD process makes the SAY glass more viscous and fills the film densely. Compared to pure PZT film, PZT-SAY film shows an 87.5 % increase in breakdown strength and a 35.3 % increase in energy storage efficiency.