• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.6
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• pp.61-70
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• 1999

An optical switch composed of three-identical, equally-spaced $Ti:LinbO_3$ waveguides and overlaid Al electrodes of CPW structure was designed and fabricated. Patterned Ti was diffused into z-cut $LinbO_3$ substrates at $1025^{\circ}C$ for 6 hours to make a three-waveguide directional coupler. $SiO_2$ buffer layer of $1.2{\mu}m$ was grown by the PECVD to reduce the propagation loss of TM mode, and Al electrodes were built on the layer for switching the guided beam. For an incident beam of ${\lambda}=1.3{\mu}m$, almost perfect optical coupling between two outer waveguides was observed. When an electric field was applied to detune the three waveguides anti-symmetrically, the optical switching phenomenon was successfully confirmed.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1501-1503
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• 1999

The $(Sr_{0.85}Ca_{0.15})TiO_3$(SCT) thin films are deposited on Pt-coated electrode$(Pt/TiO_2/SiO_2/Si)$ using RF sputtering method. Ag, Cu, Al, Pt films for the formation of top eletrode were doposited on SCT thin films by thermal evaporator and sputtering. The effects of top electodes have be studied on SCT samples with a variety of top electrode materials.

• Korean Journal of Materials Research
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• v.10 no.8
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• pp.575-580
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• 2000

Diamond thin films were deposited on $Si_3N_4$, SiC, TiC and $Al_2O_3$, substrates by the CVD method using Ta(TaC)Filament, and the appearance of the diamond films and their adhesion properties were examined by SEM, optical microscopy, indentation test and compression topple test. Diamond films were deposited at lower $CH_4$ concentration than 5%$CH_4$ for all kinds of the substrate material, but graphitic(amorphous)carbon was observed at 10%$CH_4$. The diamond film of about $12\mu\textrm{m}$ thickness on WC substrate partly peeled off, but the film on $Si_3N_4$ substrate held good adhesion. The indentation test showed that roughly ground surface was very effective for adhesion of diamond films to substrate. The topple test revealed that film thickness was an important factor governing the adhesion of the diamond film.

• Journal of the Korean Ceramic Society
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• v.41 no.6
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• pp.444-449
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• 2004

The microwave dielectric properties of low temperature sintered BaO-Nd$_2$O$_3$-TiO$_2$ (here after BNT) with a Pb-based glass-ceramics were studied in order to investigate their applicability to Low Temperature Co-fired Ceramics (LTCC) for fabrication of multilayered Radio Frequency (RF) passive components module. The BNT ceramics, with 5∼30 wt% of PbO-TiO$_2$-A1$_2$O$_3$-SiO$_2$ based glass-ceramics, were sintered at 105$0^{\circ}C$, which is lower than 130$0^{\circ}C$, sintering temperature of pure BNT ceramics. With increasing the amount of the glass-ceramics, sintering rate of the ceramics become activated due to the softening of glass, resulting in low-temperature densification. BaO-Nd$_2$O$_3$-TiO$_2$ microwave ceramics with 20 wt% glass-ceramics exhibit sintered relative densities over 95% and dielectric constant of 72, quality factor of 1500, and temperature coefficient of frequency of +22 ppm/$^{\circ}C$. This enhanced dielectric properties are attributed to mainly the presence of crystalline phases PbTiO$_3$ within the Pb-based glass.

• Journal of Surface Science and Engineering
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• v.33 no.1
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• pp.17-24
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• 2000

The microstructures and corrosion properties of Al-Si diffusion coated PWA1426 and PWA658 alloys have been investigated. The coated layer and corrosion properties were analysed by SEM, EDS and hot corrosion test. According to the results of SEM, it is supposed that the coated layers were composed of mixed, denuded and inter-diffusion layer. The coated PWA1426 alloy improved corrosion properties, compared to the PWA658 alloy. Corrosion debris generated during hot corrosion test of PWA658 alloy are identified as NiO, $TiO_2$and $NiAl_2$$O_4$from coated layer which increase oxidation rate and decrease adhesion. The PWA1426 alloy heat treated at $1080^{\circ}C$ showed that NiAl and $Al_2$$O_3$formed on coated layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.338-338
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• 2013

Monolithic three-dimensional integrated circuits (3D-ICs) 구현 시 bonding 과정에서 발생되는 aluminum (Al) 이나 copper (Cu) 등의 interconnect metal의 확산, 열적 스트레스, 결함의 발생, 도펀트 재분포와 같은 문제들을 피하기 위해서는 저온 공정이 필수적이다. 지금까지는 polymer 기반의 bonding이나 Cu/Cu와 같은 metal 기반의 bonding 등과 같은 저온 bonding 방법이 연구되어 왔다. 그러나 이와 같은 bonding 공정들은 공정 시 void와 같은 문제가 발생하거나 공정을 위한 특수한 장비가 필수적이다. 반면, 두 물질의 합금을 이용해 녹는점을 낮추는 eutectic bonding 공정은 저온에서 공정이 가능할 뿐만 아니라 void의 발생 없이 강한 bonding 강도를 얻을 수 있다. Aluminum-germanium (Al-Ge) 및 aluminum-indium (Al-In) 등의 조합이 eutectic bonding에 이용되어 각각 $424^{\circ}C$ 및 $454^{\circ}C$의 저온 공정을 성취하였으나 여전히 $400^{\circ}C$이상의 eutectic 온도로 인해 3D-ICs의 구현 시에는 적용이 불가능하다. 이러한 metal 조합들에 비해 indium (In)과 tin (Sn)은 각각 $156^{\circ}C$ 및 $232^{\circ}C$로 굉장히 낮은 녹는점을 가지고 있기 때문에 In-Sn 조합은 약 $120^{\circ}C$ 정도의 상당히 낮은eutectic 온도를 갖는다. 따라서 본 연구팀은 In-Sn 조합을 이용하여 $200^{\circ}C$ 이하에서monolithic 3D-IC 구현 시 사용될 eutectic bonding 공정을 개발하였다. 100 nm SiO2가 증착된 Si wafer 위에 50 nm Ti 및 410 nm In을 증착하고, 다른Si wafer 위에 50 nm Ti 및 500 nm Sn을 증착하였다. Ti는 adhesion 향상 및 diffusion barrier 역할을 위해 증착되었다. In과 Sn의 두께는 binary phase diagram을 통해 In-Sn의 eutectic 온도인 $120^{\circ}C$ 지점의 조성 비율인 48 at% Sn과 52 at% In에 해당되는 410 nm (In) 그리고 500 nm (Sn)로 결정되었다. Bonding은 Tbon-100 장비를 이용하여 $140^{\circ}C$, $170^{\circ}C$ 그리고 $200^{\circ}C$에서 2,000 N의 압력으로 진행되었으며 각각의 샘플들은 scanning electron microscope (SEM)을 통해 확인된 후, 접합 강도 테스트를 진행하였다. 추가로 bonding 층의 In 및 Sn 분포를 확인하기 위하여 Si wafer 위에 Ti/In/Sn/Ti를 차례로 증착시킨 뒤 bonding 조건과 같은 온도에서 열처리하고secondary ion mass spectrometry (SIMS) profile 분석을 시행하였다. 결론적으로 본 연구를 통하여 충분히 높은 접합 강도를 갖는 In-Sn eutectic bonding 공정을 $140^{\circ}C$의 낮은 공정온도에서 성공적으로 개발하였다.

• Journal of the Korean Ceramic Society
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• v.36 no.12
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• pp.1350-1355
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• 1999

Sintering characteristics and dielectric properties of low temperature sinterable Glass/Ceramic dielectric materials were investigated. The dielectric materials which were developed for microwave frequency applications consist of SiO2-TiO2-Bi2O3-RO system(RO:BaO-CaO-SrO) crystallizable glass and Al2O3 as a ceramic filler. Sintering experiments showed that no more densification occurred above 80$0^{\circ}C$ and bulk density and shrinkage depended on Al2O3 content only. Results of dielectric measurements showed that $\varepsilon$r Q$\times$f and $\tau$f of the material containing 30wt% Al2O3 were 17.3, 600 and +23 ppm respectively. Those values for 45 and 60wt% Al2O3 samples were 11.6, 1400, +0.7 ppm and 7.2, 2000, -8.5 ppm, repectively. The results clearly showed that the Glas/Ceramic materials of present experiment decreased in $\varepsilon$r and increased in $\times$f value and changed from positive to negative value in $\tau$f value with the increasement of Al2O3 content.

• Journal of Sensor Science and Technology
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• v.5 no.1
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• pp.30-36
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• 1996

ZnO thin-film sensors were fabricated by RF magnetron sputtering method. The composition of the device material was 4 wt. % $Al_{2}O_{3}$, 1 wt. % $TiO_{2}$ and 0.2 wt. % $V_{2}O_{5}$ on the basis of ZnO material for developing the high sensitive TMA gas sensor which have an appropriate resistivity and the stability for practical use. They were also grown on the $SiO_{2}/Si$ substrates heated at $250^{\circ}C$ under a pure oxygen pressure of about 10 mTorr with a power of about 80 watts for 10 minutes. So as to enhance the stability of the resistivity, the thin films were annealed from $400^{\circ}C$ to $800^{\circ}C$. The sensors made with the thin film which were annealed at $700^{\circ}C$ for 60 minutes in pure oxygen gas exhibited a good sensing properties for TMA gas. The thin film grown at this condition showed the maximum sensitivity of 550 in TMA gas concentration of 160 ppm, and exhibited a good stability and excellent linearity.

• Journal of Conservation Science
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• v.8 no.1 s.11
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• pp.10-15
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• 1999

The chemical compositions and microstructure of the punch'ong excavated from Bokwangri, Kangnung were investigated by the scanning electron microscope (SEM) with an energy dispersive X-ray spectrometer (EDS), X-ray diffractometer (XRD), and dilatometer. The compositions of body were $SiO_2(73-78\%),\;Al_2O_3(13-16\%)$, $RO{\cdot}R_2O(4-5\%,\;R=Ca,\;Mg,\;Na,\;K),\;R_xO_y(3-6\%,\;R=Fe,Ti)$ in weight ratio, which were higher silica and flux $(RO{\cdot}R_2O)$ but lower alumina. Owing to the high content$(21-30\%)$ of calcium oxide the glaze is considered lime type. Firing temperature range for the ceramic was presumed to about $1150^{\circ}C$.

• The Journal of Engineering Research
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• v.1 no.1
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• pp.15-22
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• 1997

The crystallization behaviours of cordierite gel derived from sol-gel method and glass prepared from conventional melting method with or without $TiO_2$ as nucleants are compared. The densification temperature of gel is $810^{\circ}C$ and its chemical structure identified by IR analysis is same as that of glass melted by conventional method. The beginning crystallization temperature of gel is $965^{\circ}C$ lower than that of melted glass with 10wt% $TiO_2$, which is $978^{\circ}C$. The crystalline phases developed from gel during heat treatment are identified as spinel, $\beta$-quartz solid solution and $\alpha$-cordierite crystal and crystalline phases in case of glass are (Mg,Al)TiOn and $\beta$-quartz solid solution and $\alpha$-cordierite crystal, respectively. The crystallization in melted glass with nucleants occurs through bulk crystallization and in case of that without nucleants surface crystallization occurs, while the crystallization in gel is internal crystallization from interface between particles formed after densification.